JPS6420958A - Chamfering device - Google Patents
Chamfering deviceInfo
- Publication number
- JPS6420958A JPS6420958A JP17676587A JP17676587A JPS6420958A JP S6420958 A JPS6420958 A JP S6420958A JP 17676587 A JP17676587 A JP 17676587A JP 17676587 A JP17676587 A JP 17676587A JP S6420958 A JPS6420958 A JP S6420958A
- Authority
- JP
- Japan
- Prior art keywords
- sections
- chamfering
- periphery
- chipping
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To increase the edge angle of corner sections, suppress the occurrence of chipping, and remove the chipping having occurred by chamfering corner sections before polishing the periphery and performing the additional chamfering on the cross section between the chamfering sections and the end faces. CONSTITUTION:When the corner sections 23, 23 of a work material 20 are brought into contact with the polishing faces 12B, 12B of a polishing groove 12 and polished, chamfering sections 21A, 21A start to be formed, the edge angle, i.e., angle theta1, of the cross section between the chamfering sections 21A, 21A and the periphery is set sufficiently large, thus the occurrence of chipping at the cross section between the chamfering sections and the periphery when the periphery is polished can be thoroughly suppressed. After the periphery 21 and the corner sections 23, 23 of the material 20 is polished by the desired quantity, the material 20 is separated from the polishing groove 12 and brought into contact with the polishing faces 13B, 13B of a polishing groove 13 and polished, other chamfering sections 21B, 21B are formed, the chipping generated at the cross section between the chamfering sections 21A, 21A and the end faces 22, 22 can be removed, and the chipping can be removed because angles theta3, theta4 are larger than 90 deg. and larger than theta5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62176765A JP2623251B2 (en) | 1987-07-15 | 1987-07-15 | Chamfering equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62176765A JP2623251B2 (en) | 1987-07-15 | 1987-07-15 | Chamfering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6420958A true JPS6420958A (en) | 1989-01-24 |
JP2623251B2 JP2623251B2 (en) | 1997-06-25 |
Family
ID=16019426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62176765A Expired - Fee Related JP2623251B2 (en) | 1987-07-15 | 1987-07-15 | Chamfering equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2623251B2 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5727990A (en) * | 1994-06-17 | 1998-03-17 | Shin-Etsu Handotai Co., Ltd. | Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus |
US5738563A (en) * | 1995-03-07 | 1998-04-14 | Kao Corporation | Substrate chamfering machine |
WO2001091968A1 (en) * | 2000-05-30 | 2001-12-06 | Memc Electronic Materials, Inc. | Method and apparatus for multiple chamfering of a wafer |
US6565421B1 (en) * | 1999-09-01 | 2003-05-20 | Lg Philips Lcd Co., Ltd. | Apparatus and method of grinding liquid crystal cell |
EP1312817A2 (en) | 2001-11-15 | 2003-05-21 | Nissan Motor Co., Ltd. | Rotary member and production process |
EP1312818A2 (en) | 2001-11-15 | 2003-05-21 | Nissan Motor Company, Limited | Rolling bearing |
JP2004243422A (en) * | 2003-02-12 | 2004-09-02 | Komatsu Electronic Metals Co Ltd | Circumference grinding united wheel |
JP2007306000A (en) * | 2006-05-11 | 2007-11-22 | Siltronic Ag | Manufacturing method for semiconductor wafer equipped with odd-shaped edge |
CN103394982A (en) * | 2013-08-20 | 2013-11-20 | 中国电子科技集团公司第四十六研究所 | Chamfering grinding wheel for machining silicon single crystal wafer for thick-layer epitaxy, and chamfering method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5784739U (en) * | 1980-11-13 | 1982-05-25 | ||
JPS58100432A (en) * | 1981-12-11 | 1983-06-15 | Hitachi Ltd | Bevelling process of wafer |
JPS60232874A (en) * | 1984-04-27 | 1985-11-19 | Honda Motor Co Ltd | Total shape grinding tool |
-
1987
- 1987-07-15 JP JP62176765A patent/JP2623251B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5784739U (en) * | 1980-11-13 | 1982-05-25 | ||
JPS58100432A (en) * | 1981-12-11 | 1983-06-15 | Hitachi Ltd | Bevelling process of wafer |
JPS60232874A (en) * | 1984-04-27 | 1985-11-19 | Honda Motor Co Ltd | Total shape grinding tool |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5727990A (en) * | 1994-06-17 | 1998-03-17 | Shin-Etsu Handotai Co., Ltd. | Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus |
US5738563A (en) * | 1995-03-07 | 1998-04-14 | Kao Corporation | Substrate chamfering machine |
US6565421B1 (en) * | 1999-09-01 | 2003-05-20 | Lg Philips Lcd Co., Ltd. | Apparatus and method of grinding liquid crystal cell |
WO2001091968A1 (en) * | 2000-05-30 | 2001-12-06 | Memc Electronic Materials, Inc. | Method and apparatus for multiple chamfering of a wafer |
EP1312817A2 (en) | 2001-11-15 | 2003-05-21 | Nissan Motor Co., Ltd. | Rotary member and production process |
EP1312818A2 (en) | 2001-11-15 | 2003-05-21 | Nissan Motor Company, Limited | Rolling bearing |
JP2004243422A (en) * | 2003-02-12 | 2004-09-02 | Komatsu Electronic Metals Co Ltd | Circumference grinding united wheel |
JP2007306000A (en) * | 2006-05-11 | 2007-11-22 | Siltronic Ag | Manufacturing method for semiconductor wafer equipped with odd-shaped edge |
CN103394982A (en) * | 2013-08-20 | 2013-11-20 | 中国电子科技集团公司第四十六研究所 | Chamfering grinding wheel for machining silicon single crystal wafer for thick-layer epitaxy, and chamfering method |
CN103394982B (en) * | 2013-08-20 | 2015-07-29 | 中国电子科技集团公司第四十六研究所 | A kind ofly process the chamfering abrasive wheel and chamfering method that adopt silicon single crystal flake outside thick-layer |
Also Published As
Publication number | Publication date |
---|---|
JP2623251B2 (en) | 1997-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |