JPS5545512A - Ultrasonic soldering method - Google Patents

Ultrasonic soldering method

Info

Publication number
JPS5545512A
JPS5545512A JP11702378A JP11702378A JPS5545512A JP S5545512 A JPS5545512 A JP S5545512A JP 11702378 A JP11702378 A JP 11702378A JP 11702378 A JP11702378 A JP 11702378A JP S5545512 A JPS5545512 A JP S5545512A
Authority
JP
Japan
Prior art keywords
layers
solder
end parts
pipes
surface roughness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11702378A
Other languages
Japanese (ja)
Inventor
Tomiyasu Katsumoto
Shinichi Hattori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11702378A priority Critical patent/JPS5545512A/en
Publication of JPS5545512A publication Critical patent/JPS5545512A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Non-Disconnectible Joints And Screw-Threaded Joints (AREA)

Abstract

PURPOSE: To dip connecting pipes in an ultrasonic soldering bath to form solder layers to the specified bonding length at the pipe end parts and couple the pipes by roughing the surface of the portions of the pipes which do not require soldering.
CONSTITUTION: First, the layers which do not require solder layers other than the fitting portions of the end parts of a large-diameter pipe and a small-diameter pipe are roughened to more than 20μm in surface roughness. Next, the bonding end parts of the large- and small-diameter pipes are dipped in the molten solder of the ultrasonic soldering bath. Then, the solder layers are formed at the bonding end parts whose surface roughness has been finished to 10μm or under and the roughened portions whose surface roughness is above 20μm are capable of preventing deposition of solder as the absorbing layers of the ultrasonic wave vibrations. Thereafter, the solder layers are mutually fitted and heated to be thereby bonded.
COPYRIGHT: (C)1980,JPO&Japio
JP11702378A 1978-09-22 1978-09-22 Ultrasonic soldering method Pending JPS5545512A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11702378A JPS5545512A (en) 1978-09-22 1978-09-22 Ultrasonic soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11702378A JPS5545512A (en) 1978-09-22 1978-09-22 Ultrasonic soldering method

Publications (1)

Publication Number Publication Date
JPS5545512A true JPS5545512A (en) 1980-03-31

Family

ID=14701523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11702378A Pending JPS5545512A (en) 1978-09-22 1978-09-22 Ultrasonic soldering method

Country Status (1)

Country Link
JP (1) JPS5545512A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4700879A (en) * 1984-06-01 1987-10-20 Brown, Boveri & Cie Ag Method for manufacturing semiconductor power modules with an insulated contruction
JP2010173921A (en) * 2009-01-30 2010-08-12 Taiheiyo Cement Corp Silicon carbide joined body
DE102010021126B4 (en) 2010-05-21 2023-09-07 Bayerisches Zentrum für Angewandte Energieforschung e.V. Method and device for producing a gas-tight ultrasonic soldered joint

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4700879A (en) * 1984-06-01 1987-10-20 Brown, Boveri & Cie Ag Method for manufacturing semiconductor power modules with an insulated contruction
JP2010173921A (en) * 2009-01-30 2010-08-12 Taiheiyo Cement Corp Silicon carbide joined body
DE102010021126B4 (en) 2010-05-21 2023-09-07 Bayerisches Zentrum für Angewandte Energieforschung e.V. Method and device for producing a gas-tight ultrasonic soldered joint

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