JPS5597890A - Electromagnetic bonding method - Google Patents

Electromagnetic bonding method

Info

Publication number
JPS5597890A
JPS5597890A JP299279A JP299279A JPS5597890A JP S5597890 A JPS5597890 A JP S5597890A JP 299279 A JP299279 A JP 299279A JP 299279 A JP299279 A JP 299279A JP S5597890 A JPS5597890 A JP S5597890A
Authority
JP
Japan
Prior art keywords
bonding
adhesive agent
copper pipe
electromagnetic
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP299279A
Other languages
Japanese (ja)
Inventor
Hiromi Tsuji
Masahisa Sofue
Eiji Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP299279A priority Critical patent/JPS5597890A/en
Publication of JPS5597890A publication Critical patent/JPS5597890A/en
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE: To make possible the bonding of the case when the rigidity of the materials to be bonded is low and the bonding of metals and non-metals by interposing an adhesive agent between two objects then electromagnetically bonding the same.
CONSTITUTION: Silver braze or organic base adhesive agent 6 is interposed between copper pipes 4 and 5. The copper pipe 4 receives plastic deformation by electromagnetic bonding energy by a forming coil 7 and is bonded to the copper pipe 5 by way of the adhesive agent 6. Since bonding is accomplished by the low electromagnetic bonding energy, the bonding is possible with virtually no deformation of the copper pipe 5.
COPYRIGHT: (C)1980,JPO&Japio
JP299279A 1979-01-17 1979-01-17 Electromagnetic bonding method Pending JPS5597890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP299279A JPS5597890A (en) 1979-01-17 1979-01-17 Electromagnetic bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP299279A JPS5597890A (en) 1979-01-17 1979-01-17 Electromagnetic bonding method

Publications (1)

Publication Number Publication Date
JPS5597890A true JPS5597890A (en) 1980-07-25

Family

ID=11544864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP299279A Pending JPS5597890A (en) 1979-01-17 1979-01-17 Electromagnetic bonding method

Country Status (1)

Country Link
JP (1) JPS5597890A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62203689A (en) * 1986-03-03 1987-09-08 Masanobu Nakamura Junction method for metal pipe
CN101905375A (en) * 2010-07-29 2010-12-08 哈尔滨工业大学 Magnetic pulse connecting method and joint structure for thin-wall metal pipelines

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62203689A (en) * 1986-03-03 1987-09-08 Masanobu Nakamura Junction method for metal pipe
CN101905375A (en) * 2010-07-29 2010-12-08 哈尔滨工业大学 Magnetic pulse connecting method and joint structure for thin-wall metal pipelines

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