JPS5484475A - Die bonding method - Google Patents
Die bonding methodInfo
- Publication number
- JPS5484475A JPS5484475A JP15263577A JP15263577A JPS5484475A JP S5484475 A JPS5484475 A JP S5484475A JP 15263577 A JP15263577 A JP 15263577A JP 15263577 A JP15263577 A JP 15263577A JP S5484475 A JPS5484475 A JP S5484475A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- metal
- junction
- brush
- stainless steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE: To obtain an excellent junction between a substrate and pellet by mechanically rubbing the pellet-junction surface of the package substrate with a metal brush or metal stick and by immediately connecting the pellet there.
CONSTITUTION: The surface of metal plating 2 which is the pellet junction point of package substrate 1 is rubbed with metal brush 3 made of stainless steel or piano wire. As a substitute for brush 3, metal stick 4 made of stainless steel is also used for rubbing. In this way, the surface of plating layer 2 is activated and before surface energy lowers, a semeconductor pellet is connected to the surface. Consequently, an excellent junction state can be obtained and a connection is specially made possible in foaming gas or nitrogen gas.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15263577A JPS5484475A (en) | 1977-12-19 | 1977-12-19 | Die bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15263577A JPS5484475A (en) | 1977-12-19 | 1977-12-19 | Die bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5484475A true JPS5484475A (en) | 1979-07-05 |
Family
ID=15544695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15263577A Pending JPS5484475A (en) | 1977-12-19 | 1977-12-19 | Die bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5484475A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57202746A (en) * | 1981-06-09 | 1982-12-11 | Toshiba Corp | Manufacture of semiconductor device |
-
1977
- 1977-12-19 JP JP15263577A patent/JPS5484475A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57202746A (en) * | 1981-06-09 | 1982-12-11 | Toshiba Corp | Manufacture of semiconductor device |
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