JPS5484475A - Die bonding method - Google Patents

Die bonding method

Info

Publication number
JPS5484475A
JPS5484475A JP15263577A JP15263577A JPS5484475A JP S5484475 A JPS5484475 A JP S5484475A JP 15263577 A JP15263577 A JP 15263577A JP 15263577 A JP15263577 A JP 15263577A JP S5484475 A JPS5484475 A JP S5484475A
Authority
JP
Japan
Prior art keywords
pellet
metal
junction
brush
stainless steel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15263577A
Other languages
Japanese (ja)
Inventor
Takao Fujizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15263577A priority Critical patent/JPS5484475A/en
Publication of JPS5484475A publication Critical patent/JPS5484475A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To obtain an excellent junction between a substrate and pellet by mechanically rubbing the pellet-junction surface of the package substrate with a metal brush or metal stick and by immediately connecting the pellet there.
CONSTITUTION: The surface of metal plating 2 which is the pellet junction point of package substrate 1 is rubbed with metal brush 3 made of stainless steel or piano wire. As a substitute for brush 3, metal stick 4 made of stainless steel is also used for rubbing. In this way, the surface of plating layer 2 is activated and before surface energy lowers, a semeconductor pellet is connected to the surface. Consequently, an excellent junction state can be obtained and a connection is specially made possible in foaming gas or nitrogen gas.
COPYRIGHT: (C)1979,JPO&Japio
JP15263577A 1977-12-19 1977-12-19 Die bonding method Pending JPS5484475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15263577A JPS5484475A (en) 1977-12-19 1977-12-19 Die bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15263577A JPS5484475A (en) 1977-12-19 1977-12-19 Die bonding method

Publications (1)

Publication Number Publication Date
JPS5484475A true JPS5484475A (en) 1979-07-05

Family

ID=15544695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15263577A Pending JPS5484475A (en) 1977-12-19 1977-12-19 Die bonding method

Country Status (1)

Country Link
JP (1) JPS5484475A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202746A (en) * 1981-06-09 1982-12-11 Toshiba Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202746A (en) * 1981-06-09 1982-12-11 Toshiba Corp Manufacture of semiconductor device

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