JPS5445654A - Ultrasonic soldering - Google Patents

Ultrasonic soldering

Info

Publication number
JPS5445654A
JPS5445654A JP11157377A JP11157377A JPS5445654A JP S5445654 A JPS5445654 A JP S5445654A JP 11157377 A JP11157377 A JP 11157377A JP 11157377 A JP11157377 A JP 11157377A JP S5445654 A JPS5445654 A JP S5445654A
Authority
JP
Japan
Prior art keywords
pipes
bath
ultrasonic
soldered
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11157377A
Other languages
Japanese (ja)
Inventor
Tomiyasu Katsumoto
Shinichi Hattori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11157377A priority Critical patent/JPS5445654A/en
Publication of JPS5445654A publication Critical patent/JPS5445654A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)

Abstract

PURPOSE: Small and large diameter pipes are overlapped and ultrasonically soldered in a soldering bath. While the pipes are moving up from the bath, one or more of ultrasonic vibrations are applied to them to remove imperfect solder portions and to provide a good joint with high reliability.
CONSTITUTION: A copper or other inside pipe 12 is soldered at its tip end and inserted into an aluminum or other outside pipe 11 to a predetermined depth. Both pipes are soldered together in a soldering bath using ultrasonic vibration. When pipes 11 and 12 are lifted from the bath, ultrasonic vibration is again applied. This causes to lower the molten solder between pipes, to remove unalloyed portion 13a produced on joint surface, and maintain wettability between solder and pipes. The pipes are then cooled. To be more effective, ultrasonic may be applied more than one times before the end of outside pipe 11 leaves the surface of soedering bath.
COPYRIGHT: (C)1979,JPO&Japio
JP11157377A 1977-09-19 1977-09-19 Ultrasonic soldering Pending JPS5445654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11157377A JPS5445654A (en) 1977-09-19 1977-09-19 Ultrasonic soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11157377A JPS5445654A (en) 1977-09-19 1977-09-19 Ultrasonic soldering

Publications (1)

Publication Number Publication Date
JPS5445654A true JPS5445654A (en) 1979-04-11

Family

ID=14564792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11157377A Pending JPS5445654A (en) 1977-09-19 1977-09-19 Ultrasonic soldering

Country Status (1)

Country Link
JP (1) JPS5445654A (en)

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