JPS5519829A - Glass mold piling type semiconductor device - Google Patents

Glass mold piling type semiconductor device

Info

Publication number
JPS5519829A
JPS5519829A JP9234978A JP9234978A JPS5519829A JP S5519829 A JPS5519829 A JP S5519829A JP 9234978 A JP9234978 A JP 9234978A JP 9234978 A JP9234978 A JP 9234978A JP S5519829 A JPS5519829 A JP S5519829A
Authority
JP
Japan
Prior art keywords
temperature
crystallizing
glass components
semiconductor device
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9234978A
Other languages
Japanese (ja)
Other versions
JPS6118863B2 (en
Inventor
Masaaki Takahashi
Shinichi Hara
Masanobu Hanazono
Yutaka Misawa
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9234978A priority Critical patent/JPS5519829A/en
Publication of JPS5519829A publication Critical patent/JPS5519829A/en
Publication of JPS6118863B2 publication Critical patent/JPS6118863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To seal a pn joining section by crystallizing the glass-constituting elements, composed of ZnO, B2O3 and SiO2, using a temperature lower than the conventional crystallizing temperature.
CONSTITUTION: When a semiconeuctor-pellets-soldered block is being provided with an electrode and covered with a pn joint, it is covered with glass components, with weight ratio of 65%W70% of ZnO, 20%W25% of B2O3 and 8%W11% of SiO2, and calcined at a temperature between 660W710°C. By crystallizing these glass components using a temperature lower than the conventional glass components crystallizing temperature, it is possible to make the thermal expansion coefficient equal to that of silicon or bring it down within a range of 32W45×10-7/°C. And therefore, the silicon block can be prevented from being deformed due to utilization of a low temperature calcination and, at the same time, it is also prevented from occurrence of thermal crack at the time of solder-plating of the lead wire.
COPYRIGHT: (C)1980,JPO&Japio
JP9234978A 1978-07-28 1978-07-28 Glass mold piling type semiconductor device Granted JPS5519829A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9234978A JPS5519829A (en) 1978-07-28 1978-07-28 Glass mold piling type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9234978A JPS5519829A (en) 1978-07-28 1978-07-28 Glass mold piling type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5519829A true JPS5519829A (en) 1980-02-12
JPS6118863B2 JPS6118863B2 (en) 1986-05-14

Family

ID=14051918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9234978A Granted JPS5519829A (en) 1978-07-28 1978-07-28 Glass mold piling type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5519829A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211722U (en) * 1985-07-04 1987-01-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211722U (en) * 1985-07-04 1987-01-24
JPH055151Y2 (en) * 1985-07-04 1993-02-10

Also Published As

Publication number Publication date
JPS6118863B2 (en) 1986-05-14

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