JPS5580738A - Seal bonding material - Google Patents
Seal bonding materialInfo
- Publication number
- JPS5580738A JPS5580738A JP15163378A JP15163378A JPS5580738A JP S5580738 A JPS5580738 A JP S5580738A JP 15163378 A JP15163378 A JP 15163378A JP 15163378 A JP15163378 A JP 15163378A JP S5580738 A JPS5580738 A JP S5580738A
- Authority
- JP
- Japan
- Prior art keywords
- quartz glass
- bonding material
- dispersed
- seal bonding
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Products (AREA)
- Glass Compositions (AREA)
Abstract
PURPOSE: To provide a seal bonding material of low permittivity for a semiconductor element, which material is protected from deterioration in insulation resistance since no alkali ion is contained, by dispersing fine quartz glass particles in low m.p. glass based on PbO and contg. B2O3, SiO2, Al2O3, etc.
CONSTITUTION: 40W150vol% Quartz glass particles of 50μm or less in average diameter are dispersed in low m.p. glass contg., by wt., PbO 70W90%, B2O3 8W 20% and SiO2+Al2O3 1W10%, the total amt. of them being 90% or more. Thus, a seal bonding material for a semiconductor element, etc. is obtd. The thermal expansion coefficient of the resulting material depends upon the amt. of quartz glass particles dispersed. In order to match the coefficient with an alumina ceramic substrate, about 20wt% quartz glass is dispersed.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15163378A JPS5580738A (en) | 1978-12-07 | 1978-12-07 | Seal bonding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15163378A JPS5580738A (en) | 1978-12-07 | 1978-12-07 | Seal bonding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5580738A true JPS5580738A (en) | 1980-06-18 |
Family
ID=15522800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15163378A Pending JPS5580738A (en) | 1978-12-07 | 1978-12-07 | Seal bonding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5580738A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05132367A (en) * | 1991-11-12 | 1993-05-28 | Ngk Insulators Ltd | Inorganic cementing material |
JPH05132365A (en) * | 1991-11-12 | 1993-05-28 | Ngk Insulators Ltd | Cemented ceramic and method for cementing |
-
1978
- 1978-12-07 JP JP15163378A patent/JPS5580738A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05132367A (en) * | 1991-11-12 | 1993-05-28 | Ngk Insulators Ltd | Inorganic cementing material |
JPH05132365A (en) * | 1991-11-12 | 1993-05-28 | Ngk Insulators Ltd | Cemented ceramic and method for cementing |
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