JPS55153350A - Manufacture of hybrid integrated circuit - Google Patents
Manufacture of hybrid integrated circuitInfo
- Publication number
- JPS55153350A JPS55153350A JP6201379A JP6201379A JPS55153350A JP S55153350 A JPS55153350 A JP S55153350A JP 6201379 A JP6201379 A JP 6201379A JP 6201379 A JP6201379 A JP 6201379A JP S55153350 A JPS55153350 A JP S55153350A
- Authority
- JP
- Japan
- Prior art keywords
- groove
- integrated circuit
- pattern
- laser light
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To eliminate dispersion of solid particles generated in a scribing process to a patterned region by a method wherein as a prior process of formation of plural number of pattern products on a surface of a hybrid integrated circuit substrate a scribing groove by laser light is provided on the back surface. CONSTITUTION:Plural number of pattern products composed of metal electrodes 5, 6, 9 and dielectric material 7 are fabricated on a surface of a hydrid integrated circuit substrate 1 consisting of a ceramic material such as Al2O3 etc. and a scribing groove is carved on the substrate 1 by laser light 3. In this process the substrate 1 is fused partially at the groove 4 by irradiation of laser light 3 and solid particles 8 are formed and may be dispersed on the pattern product, and so as to avoid this phenomenon the groove 4 is previously carved to be deep enough to be cut by being bent afterward before the pattern product is formed. By this method the product can not be damaged, and feasibility of production is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6201379A JPS55153350A (en) | 1979-05-18 | 1979-05-18 | Manufacture of hybrid integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6201379A JPS55153350A (en) | 1979-05-18 | 1979-05-18 | Manufacture of hybrid integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55153350A true JPS55153350A (en) | 1980-11-29 |
Family
ID=13187838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6201379A Pending JPS55153350A (en) | 1979-05-18 | 1979-05-18 | Manufacture of hybrid integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55153350A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4914815A (en) * | 1988-02-23 | 1990-04-10 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing hybrid integrated circuits |
JP2001253800A (en) * | 2000-03-13 | 2001-09-18 | Namiki Precision Jewel Co Ltd | Thin sapphire substrate |
DE19927046B4 (en) * | 1999-06-14 | 2007-01-25 | Electrovac Ag | Ceramic-metal substrate as a multi-substrate |
-
1979
- 1979-05-18 JP JP6201379A patent/JPS55153350A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4914815A (en) * | 1988-02-23 | 1990-04-10 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing hybrid integrated circuits |
DE19927046B4 (en) * | 1999-06-14 | 2007-01-25 | Electrovac Ag | Ceramic-metal substrate as a multi-substrate |
JP2001253800A (en) * | 2000-03-13 | 2001-09-18 | Namiki Precision Jewel Co Ltd | Thin sapphire substrate |
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