JPS5486287A - Integrated-circuit device - Google Patents
Integrated-circuit deviceInfo
- Publication number
- JPS5486287A JPS5486287A JP15482277A JP15482277A JPS5486287A JP S5486287 A JPS5486287 A JP S5486287A JP 15482277 A JP15482277 A JP 15482277A JP 15482277 A JP15482277 A JP 15482277A JP S5486287 A JPS5486287 A JP S5486287A
- Authority
- JP
- Japan
- Prior art keywords
- film
- layer
- wiring
- films
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To accelerate the operation speed of an IC by making the density high with the pattern effective area rate increased by providing an insulating film made of the substance of the 1st layer conductive wiring to the part where the 1st layer conductive wiring and 2nd layer conductive wiring confront each other.
CONSTITUTION: On the surface of P-type Si substrate 31, N-type regions 32, 32' and 32" are diffusion-formed, the 1st layer Al wiring patterns 22 and 22' are provided throgh SiO2 films 33 and 33', and SiO2 film 34 is adhered to the entire surface. On film 34, photo resist film 35 is applied, opening pattern 36 is made, and film 35 is used as a mask to etching-remove film 34 on region 32'. Then,film 35 is used as a mask for anode oxidation, exposed wirings 22 and 22' are converted into unporous Al2O3 films 37 and 37' being self-matched, and after film 35 is removed, the 2nd layer Al wiring pattern 24 is formed. In this way, the 2nd layer Al wiring 24 is obtained which makes conductive coupling with region 32' between the 1st layer Al wirings 22 and 22' and is insulated from the lower layer via films 37 and 37' and 34.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15482277A JPS5486287A (en) | 1977-12-21 | 1977-12-21 | Integrated-circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15482277A JPS5486287A (en) | 1977-12-21 | 1977-12-21 | Integrated-circuit device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5486287A true JPS5486287A (en) | 1979-07-09 |
JPS6138611B2 JPS6138611B2 (en) | 1986-08-30 |
Family
ID=15592623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15482277A Granted JPS5486287A (en) | 1977-12-21 | 1977-12-21 | Integrated-circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5486287A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63133708U (en) * | 1987-02-24 | 1988-09-01 |
-
1977
- 1977-12-21 JP JP15482277A patent/JPS5486287A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6138611B2 (en) | 1986-08-30 |
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