JPS5453629A - Resistance chemical plating method - Google Patents

Resistance chemical plating method

Info

Publication number
JPS5453629A
JPS5453629A JP11992777A JP11992777A JPS5453629A JP S5453629 A JPS5453629 A JP S5453629A JP 11992777 A JP11992777 A JP 11992777A JP 11992777 A JP11992777 A JP 11992777A JP S5453629 A JPS5453629 A JP S5453629A
Authority
JP
Japan
Prior art keywords
salt
chemical plating
plating method
plating bath
printed substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11992777A
Other languages
Japanese (ja)
Inventor
Kanji Murakami
Yoichi Matsuda
Motoyo Wajima
Mineo Kawamoto
Yasusada Morishita
Yoshihiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11992777A priority Critical patent/JPS5453629A/en
Priority to GB7839089A priority patent/GB2006831A/en
Priority to DE19782843582 priority patent/DE2843582A1/en
Priority to NL7810123A priority patent/NL7810123A/en
Priority to FR7828646A priority patent/FR2405613A1/en
Publication of JPS5453629A publication Critical patent/JPS5453629A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To obtain a resistance film with a high specific resistance value by treating a printed substrate with an alkaline chemical plating bath based on a Ni salt and/ or a Co salt, a Zn salt, a complexing agent, and a reducing agent.
CONSTITUTION: A printed substrate is treated with an alkaline chemical plating bath based on a Ni salt such as NiSO4 and/or a Co salt such as CoSO4, a Zn salt such as ZnSO4, a complexing agent such as citric acid (salt), and a reducing agent such as hypophosphorous acid (salt). The molar ratio of the Zn salt to the Ni and/ or Co salts is 0.1 or more. By ths method a plate film is obtd. having a specific resistance of about 3×10-3W2×10-1Ωcm
COPYRIGHT: (C)1979,JPO&Japio
JP11992777A 1977-10-07 1977-10-07 Resistance chemical plating method Pending JPS5453629A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP11992777A JPS5453629A (en) 1977-10-07 1977-10-07 Resistance chemical plating method
GB7839089A GB2006831A (en) 1977-10-07 1978-10-03 Depositing film resistors by electroless coating
DE19782843582 DE2843582A1 (en) 1977-10-07 1978-10-05 METHOD FOR PRODUCING A RESISTANT LAYER BY ELECTRIC DEPOSITION
NL7810123A NL7810123A (en) 1977-10-07 1978-10-06 PROCEDURE FOR DEPOSITING A FILM RESISTOR BY CURRENT PLATING.
FR7828646A FR2405613A1 (en) 1977-10-07 1978-10-06 PROCESS FOR DEPOSITING A CIRCUIT RESISTOR PRINTED BY NON-GALVANIC VENEERING

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11992777A JPS5453629A (en) 1977-10-07 1977-10-07 Resistance chemical plating method

Publications (1)

Publication Number Publication Date
JPS5453629A true JPS5453629A (en) 1979-04-27

Family

ID=14773607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11992777A Pending JPS5453629A (en) 1977-10-07 1977-10-07 Resistance chemical plating method

Country Status (5)

Country Link
JP (1) JPS5453629A (en)
DE (1) DE2843582A1 (en)
FR (1) FR2405613A1 (en)
GB (1) GB2006831A (en)
NL (1) NL7810123A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5712592A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Method of metallizing sic board
JPS58193354A (en) * 1982-04-30 1983-11-11 Hitachi Chem Co Ltd Plating bath

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6818313B2 (en) * 2002-07-24 2004-11-16 University Of Dayton Corrosion-inhibiting coating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1508104A (en) * 1965-06-28 1968-01-05 Ibm Acid corrosion
GB1266729A (en) * 1969-08-29 1972-03-15
NL7301044A (en) * 1973-01-25 1974-07-29

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5712592A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Method of metallizing sic board
JPS6325720B2 (en) * 1980-06-27 1988-05-26 Hitachi Ltd
JPS58193354A (en) * 1982-04-30 1983-11-11 Hitachi Chem Co Ltd Plating bath
JPH0216390B2 (en) * 1982-04-30 1990-04-17 Hitachi Chemical Co Ltd

Also Published As

Publication number Publication date
GB2006831A (en) 1979-05-10
DE2843582A1 (en) 1979-04-12
FR2405613A1 (en) 1979-05-04
NL7810123A (en) 1979-04-10

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