JPS53144835A - Electroless copper plating bath - Google Patents
Electroless copper plating bathInfo
- Publication number
- JPS53144835A JPS53144835A JP6070877A JP6070877A JPS53144835A JP S53144835 A JPS53144835 A JP S53144835A JP 6070877 A JP6070877 A JP 6070877A JP 6070877 A JP6070877 A JP 6070877A JP S53144835 A JPS53144835 A JP S53144835A
- Authority
- JP
- Japan
- Prior art keywords
- plating bath
- copper plating
- electroless copper
- cpds
- salts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To provide an electroless copper plating bath obtd. by adding Mg and Ni salts and cyan cpds. to a compsn. based on cupric salts, complex cpds., a reducing agent and a pH reulator, by which plated films of superior ductility can be formed.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6070877A JPS53144835A (en) | 1977-05-25 | 1977-05-25 | Electroless copper plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6070877A JPS53144835A (en) | 1977-05-25 | 1977-05-25 | Electroless copper plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53144835A true JPS53144835A (en) | 1978-12-16 |
JPS5652994B2 JPS5652994B2 (en) | 1981-12-16 |
Family
ID=13150048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6070877A Granted JPS53144835A (en) | 1977-05-25 | 1977-05-25 | Electroless copper plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53144835A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120177925A1 (en) * | 2011-01-11 | 2012-07-12 | Omg Electronic Chemicals, Llc | Electroless plating bath composition and method of plating particulate matter |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49128A (en) * | 1972-04-21 | 1974-01-05 |
-
1977
- 1977-05-25 JP JP6070877A patent/JPS53144835A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49128A (en) * | 1972-04-21 | 1974-01-05 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120177925A1 (en) * | 2011-01-11 | 2012-07-12 | Omg Electronic Chemicals, Llc | Electroless plating bath composition and method of plating particulate matter |
US8858693B2 (en) * | 2011-01-11 | 2014-10-14 | Omg Electronic Chemicals, Llc | Electroless plating bath composition and method of plating particulate matter |
Also Published As
Publication number | Publication date |
---|---|
JPS5652994B2 (en) | 1981-12-16 |
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