JPS56136965A - Plating method - Google Patents
Plating methodInfo
- Publication number
- JPS56136965A JPS56136965A JP3817880A JP3817880A JPS56136965A JP S56136965 A JPS56136965 A JP S56136965A JP 3817880 A JP3817880 A JP 3817880A JP 3817880 A JP3817880 A JP 3817880A JP S56136965 A JPS56136965 A JP S56136965A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- inorg
- plating
- plated
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/40—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Conductive Materials (AREA)
Abstract
PURPOSE: To form a metal film with superior adhesion and electric conductivity on the surface of an inorg. oxide substrate by electroless plating the surface with Ni or Co and electroplating it with Ni or further carrying out Cu plating.
CONSTITUTION: The surface of an inorg. oxide substrate of alumina, silica or the like, smooth glass or an In- or Sn-base oxide substrate formed on the glass is electroless plated with Ni- or Co-base metal in an electroless plating bath of <10pH. The bath contains salt of at least one of Ni and Co as plating metal ions, Zn salt in 0.075W1.5mol ratio to the above-mentioned metal salt, a chelating agent such as citric acid in an amount more than twice the total mol of the metal salts and 0.02mol/l hypophosphite ions as a reducing agent. The plated film is then electroplated with Ni or further plated with Cu to form a metal film with superior adhesion and electric conductivity on the inorg. oxide.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3817880A JPS56136965A (en) | 1980-03-27 | 1980-03-27 | Plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3817880A JPS56136965A (en) | 1980-03-27 | 1980-03-27 | Plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56136965A true JPS56136965A (en) | 1981-10-26 |
JPS6152233B2 JPS6152233B2 (en) | 1986-11-12 |
Family
ID=12518124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3817880A Granted JPS56136965A (en) | 1980-03-27 | 1980-03-27 | Plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56136965A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58193354A (en) * | 1982-04-30 | 1983-11-11 | Hitachi Chem Co Ltd | Plating bath |
JPS63190204A (en) * | 1987-01-30 | 1988-08-05 | 積水フアインケミカル株式会社 | Conducting fine pellet |
US5304403A (en) * | 1992-09-04 | 1994-04-19 | General Moors Corporation | Zinc/nickel/phosphorus coatings and elecroless coating method therefor |
US6818313B2 (en) * | 2002-07-24 | 2004-11-16 | University Of Dayton | Corrosion-inhibiting coating |
-
1980
- 1980-03-27 JP JP3817880A patent/JPS56136965A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58193354A (en) * | 1982-04-30 | 1983-11-11 | Hitachi Chem Co Ltd | Plating bath |
JPH0216390B2 (en) * | 1982-04-30 | 1990-04-17 | Hitachi Chemical Co Ltd | |
JPS63190204A (en) * | 1987-01-30 | 1988-08-05 | 積水フアインケミカル株式会社 | Conducting fine pellet |
US5304403A (en) * | 1992-09-04 | 1994-04-19 | General Moors Corporation | Zinc/nickel/phosphorus coatings and elecroless coating method therefor |
US6818313B2 (en) * | 2002-07-24 | 2004-11-16 | University Of Dayton | Corrosion-inhibiting coating |
US7537663B2 (en) | 2002-07-24 | 2009-05-26 | University Of Dayton | Corrosion-inhibiting coating |
Also Published As
Publication number | Publication date |
---|---|
JPS6152233B2 (en) | 1986-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5754296A (en) | Plating liquid for palladium nickel alloy | |
JPS56116894A (en) | Neutral tin electroplating bath for obtaining dense plated coating | |
JPS56136965A (en) | Plating method | |
JPS56152958A (en) | Electroless gold plating solution | |
JPS575856A (en) | Plating method | |
JPS56136966A (en) | Electroless plating method | |
JPS5623295A (en) | Bright tin-nickel alloy plating liquid | |
JPS5481777A (en) | Lead frame structure with intermediate layer | |
JPS57140891A (en) | Pretreating solution for silver plating | |
JPS55107795A (en) | Gold tin alloy electroplating bath and plating method | |
JPS5770286A (en) | Plating bath composition and plating method | |
JPS56136970A (en) | Chemical copper plating bath | |
JPS55164067A (en) | Method for nonelectrolytic plating | |
JPS57140882A (en) | Bright electroplating method for tin or solder | |
JPS57152489A (en) | Manufacture of silver plated iron and iron alloy | |
JPS5453629A (en) | Resistance chemical plating method | |
JPS57140884A (en) | Plating method for silver | |
JPS57188664A (en) | Electroless plating method for insulation substrate | |
JPS5554589A (en) | Plating method of electronic parts which prevent production of zinc whisker | |
Tremmel | Cyanide-free copper electrolyte and process | |
JPS53144839A (en) | Pretreting method in composite plating line | |
El-Mallah et al. | Autocatalytic(Electroless) Nickel Plating. Effect of Iron and Copper Contamination | |
JPS56123363A (en) | Pretreating liquid for chemical plating | |
JPS5397937A (en) | Silver plating method | |
JPS57210991A (en) | Manufacture of surface-treated steel plate with high corrosion resistance |