JPS5441102B2 - - Google Patents

Info

Publication number
JPS5441102B2
JPS5441102B2 JP2690775A JP2690775A JPS5441102B2 JP S5441102 B2 JPS5441102 B2 JP S5441102B2 JP 2690775 A JP2690775 A JP 2690775A JP 2690775 A JP2690775 A JP 2690775A JP S5441102 B2 JPS5441102 B2 JP S5441102B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2690775A
Other versions
JPS51101865A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2690775A priority Critical patent/JPS5441102B2/ja
Priority to US05/662,440 priority patent/US4088828A/en
Publication of JPS51101865A publication Critical patent/JPS51101865A/ja
Publication of JPS5441102B2 publication Critical patent/JPS5441102B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2690775A 1975-03-04 1975-03-04 Expired JPS5441102B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2690775A JPS5441102B2 (ja) 1975-03-04 1975-03-04
US05/662,440 US4088828A (en) 1975-03-04 1976-03-01 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2690775A JPS5441102B2 (ja) 1975-03-04 1975-03-04

Publications (2)

Publication Number Publication Date
JPS51101865A JPS51101865A (ja) 1976-09-08
JPS5441102B2 true JPS5441102B2 (ja) 1979-12-06

Family

ID=12206283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2690775A Expired JPS5441102B2 (ja) 1975-03-04 1975-03-04

Country Status (2)

Country Link
US (1) US4088828A (ja)
JP (1) JPS5441102B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218081B2 (ja) * 1980-04-16 1987-04-21 Sanyo Electric Co
JP4746990B2 (ja) * 2006-01-10 2011-08-10 株式会社日立国際電気 電子回路基板

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132466A (en) * 1975-05-13 1976-11-17 Tokyo Purinto Kougiyou Kk Method of manufacturing independent lands on printed wiring board
JPS5234365A (en) * 1975-09-11 1977-03-16 Sanyo Electric Co Method of insulating printed board
JPS5340458U (ja) * 1976-09-13 1978-04-07
JPS5742020Y2 (ja) * 1976-12-20 1982-09-16
JPS5386567U (ja) * 1976-12-20 1978-07-17
US4178855A (en) * 1978-03-20 1979-12-18 The United States Of America As Represented By The Secretary Of The Navy Explosive actuated arming switch device
JPS5529527U (ja) * 1978-08-18 1980-02-26
JPS5724775U (ja) * 1980-07-17 1982-02-08
EP0044803A3 (de) * 1980-07-17 1984-08-15 Siemens Aktiengesellschaft Verfahren zum Herstellen einer mit elektrischen Bauelementen bestückten Leiterplatte
US4428043A (en) 1981-08-24 1984-01-24 Burroughs Corporation Data communications network
US4508990A (en) * 1982-09-17 1985-04-02 Sigmatron Associates Thin-film EL panel mounting unit
US4546283A (en) * 1984-05-04 1985-10-08 The United States Of America As Represented By The Secretary Of The Air Force Conductor structure for thick film electrical device
JP2575109B2 (ja) * 1985-11-08 1997-01-22 ソニー株式会社 プリント配線基板
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
JPS62184785U (ja) * 1986-05-16 1987-11-24
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
JPH01161368U (ja) * 1988-04-27 1989-11-09
EP0346522A3 (en) * 1988-06-16 1991-04-03 Nippon CMK Corp. Printed wiring board
AT398876B (de) * 1991-10-31 1995-02-27 Philips Nv Zwei- oder mehrlagige leiterplatte
US5852397A (en) * 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
DE4243356A1 (de) * 1992-12-21 1994-06-23 Siemens Ag Bestückungsverfahren für eine Leiterplatte
EP0760157B1 (en) 1994-05-16 1998-08-26 Raychem Corporation Electrical devices comprising a ptc resistive element
JPH1154237A (ja) * 1997-08-07 1999-02-26 Yazaki Corp 配線基板の放電構造
US6640420B1 (en) * 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6854176B2 (en) * 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
JP2001135906A (ja) * 1999-11-05 2001-05-18 Yazaki Corp 配線板の電気部品接続構造
JP2001264667A (ja) * 2000-03-15 2001-09-26 Sony Corp 光スキャニング装置
JP3624151B2 (ja) * 2000-10-24 2005-03-02 Ｔｄｋ株式会社 電気部品の接続構造
US6849805B2 (en) * 2000-12-28 2005-02-01 Canon Kabushiki Kaisha Printed wiring board and electronic apparatus
JP4554873B2 (ja) * 2002-04-22 2010-09-29 日本電気株式会社 配線板、電子機器および電子部品の実装方法並びに製造方法
JP5236707B2 (ja) * 2010-09-22 2013-07-17 日立オートモティブシステムズ株式会社 電子機器制御装置
DE102019116103B4 (de) * 2019-06-13 2021-04-22 Notion Systems GmbH Verfahren zum Beschriften einer Leiterplatte durch Erzeugen von Schattierungen in einer funktionalen Lackschicht

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818376U (ja) * 1971-07-12 1973-03-01
JPS4851253A (ja) * 1971-11-01 1973-07-18

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3339008A (en) * 1966-09-14 1967-08-29 Roger A Macarthur Circuit board having grooves to limit solder flow
JPS4861959A (ja) * 1971-12-06 1973-08-30
US3969816A (en) * 1972-12-11 1976-07-20 Amp Incorporated Bonded wire interconnection system
GB1416671A (en) * 1973-02-14 1975-12-03 Siemens Ag Layer circuits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818376U (ja) * 1971-07-12 1973-03-01
JPS4851253A (ja) * 1971-11-01 1973-07-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218081B2 (ja) * 1980-04-16 1987-04-21 Sanyo Electric Co
JP4746990B2 (ja) * 2006-01-10 2011-08-10 株式会社日立国際電気 電子回路基板

Also Published As

Publication number Publication date
US4088828A (en) 1978-05-09
JPS51101865A (ja) 1976-09-08

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