JPS54154266A - Semiconductor wafer cutting device - Google Patents

Semiconductor wafer cutting device

Info

Publication number
JPS54154266A
JPS54154266A JP6360278A JP6360278A JPS54154266A JP S54154266 A JPS54154266 A JP S54154266A JP 6360278 A JP6360278 A JP 6360278A JP 6360278 A JP6360278 A JP 6360278A JP S54154266 A JPS54154266 A JP S54154266A
Authority
JP
Japan
Prior art keywords
cover
wafer
cutting device
semiconductor wafer
mixture solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6360278A
Other languages
English (en)
Other versions
JPS5725365B2 (ja
Inventor
Takashi Tokutake
Hiroshi Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP6360278A priority Critical patent/JPS54154266A/ja
Publication of JPS54154266A publication Critical patent/JPS54154266A/ja
Publication of JPS5725365B2 publication Critical patent/JPS5725365B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP6360278A 1978-05-26 1978-05-26 Semiconductor wafer cutting device Granted JPS54154266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6360278A JPS54154266A (en) 1978-05-26 1978-05-26 Semiconductor wafer cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6360278A JPS54154266A (en) 1978-05-26 1978-05-26 Semiconductor wafer cutting device

Publications (2)

Publication Number Publication Date
JPS54154266A true JPS54154266A (en) 1979-12-05
JPS5725365B2 JPS5725365B2 (ja) 1982-05-29

Family

ID=13233984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6360278A Granted JPS54154266A (en) 1978-05-26 1978-05-26 Semiconductor wafer cutting device

Country Status (1)

Country Link
JP (1) JPS54154266A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158084U (ja) * 1983-04-11 1984-10-23 ミクロン機器株式会社 盲用タイマ−装置
JPH0962180A (ja) * 1995-08-28 1997-03-07 Nippon Denki Ido Tsushin Kk 音声案内装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147103U (ja) * 1974-05-24 1975-12-06
JPS51124409U (ja) * 1975-04-04 1976-10-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147103U (ja) * 1974-05-24 1975-12-06
JPS51124409U (ja) * 1975-04-04 1976-10-08

Also Published As

Publication number Publication date
JPS5725365B2 (ja) 1982-05-29

Similar Documents

Publication Publication Date Title
JPS6471992A (en) Device and method of sampling soil and holding volatile substance to said soil
JPS54154266A (en) Semiconductor wafer cutting device
JPS5572029A (en) Tray for semiconductor wafer
JPS5418158A (en) Cleaning method and cleaning device
JPS5412563A (en) Fabricating method of semiconductor crystals
JPS5441665A (en) Manufacture for semiconductor device
JPS5519959A (en) Cooling wing
JPS5414155A (en) Manufacture for semiconductor device
JPS5386158A (en) Production of semiconductor device
JPS5578544A (en) Pelletization of semiconductor wafer
JPS51145082A (en) Device of cutting running long composite material to a length of hard substrate
JPS54139483A (en) Photo resist coating device
JPS52119588A (en) Device for cutting cylindrical pipe
JPS5490965A (en) Removal unit of cutting trash
JPS51137550A (en) Fibre (hair etc.) cutting method and its device
JPS52150806A (en) Motor fan
JPS57118645A (en) Liquid processing equipment for semiconductor
JPS5216091A (en) Stone cutting device
JPS54149574A (en) Blade dicing unit for semiconductor substrate
JPS5486713A (en) Device for supplying cryogenic refrigerant to superconductive rotor
JPS544073A (en) Cleaning method for semiconductor surface
JPS5286775A (en) Bebeling method for semiconductor substrate
JPS57115824A (en) Removing epitaxial layer mound
JPS52120552A (en) Apparatus for sucking and removing floating matters on water surface
JPS5572054A (en) Preparation of semiconductor device