JPS54154266A - Semiconductor wafer cutting device - Google Patents
Semiconductor wafer cutting deviceInfo
- Publication number
- JPS54154266A JPS54154266A JP6360278A JP6360278A JPS54154266A JP S54154266 A JPS54154266 A JP S54154266A JP 6360278 A JP6360278 A JP 6360278A JP 6360278 A JP6360278 A JP 6360278A JP S54154266 A JPS54154266 A JP S54154266A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- wafer
- cutting device
- semiconductor wafer
- mixture solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To elminate the contamination of the wafer to be cut by providing the sucking hole at the inside prescribed area of the cover for the rotary blade in order to suck up the mixture solution of the cuttings and the cooling water dropping down along the cover and thus exhausting the mixture solution outside the cover.
CONSTITUTION: The cutting device cuts off semiconductor wafer 5 adhered on semiconductor wafer mounting stage 6 along cutting line 7. This cutting device is constituted as follows: rotary blade 1 attached to shaft 2 is enclosed with cover 3 containing the open area against line 7 with some gap beween; tube 9 and 10 linked to vacuum pipe 8 are provided in allotment at the outer circumference of cover 3; and the tips of tube 9 and 10 are connected to aperture part 11 and 12 each provided to cover 3. In addition, water supply nozzle 4 is installed piercing through cover 3. In such structure, no mixture solution of the cooling water and the cutting drops down onto wafer 5 along cover 3, thus the contamination of the wafer being minimized very much.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6360278A JPS54154266A (en) | 1978-05-26 | 1978-05-26 | Semiconductor wafer cutting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6360278A JPS54154266A (en) | 1978-05-26 | 1978-05-26 | Semiconductor wafer cutting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54154266A true JPS54154266A (en) | 1979-12-05 |
JPS5725365B2 JPS5725365B2 (en) | 1982-05-29 |
Family
ID=13233984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6360278A Granted JPS54154266A (en) | 1978-05-26 | 1978-05-26 | Semiconductor wafer cutting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54154266A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59158084U (en) * | 1983-04-11 | 1984-10-23 | ミクロン機器株式会社 | blind timer device |
JPH0962180A (en) * | 1995-08-28 | 1997-03-07 | Nippon Denki Ido Tsushin Kk | Speech guide device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50147103U (en) * | 1974-05-24 | 1975-12-06 | ||
JPS51124409U (en) * | 1975-04-04 | 1976-10-08 |
-
1978
- 1978-05-26 JP JP6360278A patent/JPS54154266A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50147103U (en) * | 1974-05-24 | 1975-12-06 | ||
JPS51124409U (en) * | 1975-04-04 | 1976-10-08 |
Also Published As
Publication number | Publication date |
---|---|
JPS5725365B2 (en) | 1982-05-29 |
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