JPS54154266A - Semiconductor wafer cutting device - Google Patents

Semiconductor wafer cutting device

Info

Publication number
JPS54154266A
JPS54154266A JP6360278A JP6360278A JPS54154266A JP S54154266 A JPS54154266 A JP S54154266A JP 6360278 A JP6360278 A JP 6360278A JP 6360278 A JP6360278 A JP 6360278A JP S54154266 A JPS54154266 A JP S54154266A
Authority
JP
Japan
Prior art keywords
cover
wafer
cutting device
semiconductor wafer
mixture solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6360278A
Other languages
Japanese (ja)
Other versions
JPS5725365B2 (en
Inventor
Takashi Tokutake
Hiroshi Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP6360278A priority Critical patent/JPS54154266A/en
Publication of JPS54154266A publication Critical patent/JPS54154266A/en
Publication of JPS5725365B2 publication Critical patent/JPS5725365B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To elminate the contamination of the wafer to be cut by providing the sucking hole at the inside prescribed area of the cover for the rotary blade in order to suck up the mixture solution of the cuttings and the cooling water dropping down along the cover and thus exhausting the mixture solution outside the cover.
CONSTITUTION: The cutting device cuts off semiconductor wafer 5 adhered on semiconductor wafer mounting stage 6 along cutting line 7. This cutting device is constituted as follows: rotary blade 1 attached to shaft 2 is enclosed with cover 3 containing the open area against line 7 with some gap beween; tube 9 and 10 linked to vacuum pipe 8 are provided in allotment at the outer circumference of cover 3; and the tips of tube 9 and 10 are connected to aperture part 11 and 12 each provided to cover 3. In addition, water supply nozzle 4 is installed piercing through cover 3. In such structure, no mixture solution of the cooling water and the cutting drops down onto wafer 5 along cover 3, thus the contamination of the wafer being minimized very much.
COPYRIGHT: (C)1979,JPO&Japio
JP6360278A 1978-05-26 1978-05-26 Semiconductor wafer cutting device Granted JPS54154266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6360278A JPS54154266A (en) 1978-05-26 1978-05-26 Semiconductor wafer cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6360278A JPS54154266A (en) 1978-05-26 1978-05-26 Semiconductor wafer cutting device

Publications (2)

Publication Number Publication Date
JPS54154266A true JPS54154266A (en) 1979-12-05
JPS5725365B2 JPS5725365B2 (en) 1982-05-29

Family

ID=13233984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6360278A Granted JPS54154266A (en) 1978-05-26 1978-05-26 Semiconductor wafer cutting device

Country Status (1)

Country Link
JP (1) JPS54154266A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158084U (en) * 1983-04-11 1984-10-23 ミクロン機器株式会社 blind timer device
JPH0962180A (en) * 1995-08-28 1997-03-07 Nippon Denki Ido Tsushin Kk Speech guide device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147103U (en) * 1974-05-24 1975-12-06
JPS51124409U (en) * 1975-04-04 1976-10-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147103U (en) * 1974-05-24 1975-12-06
JPS51124409U (en) * 1975-04-04 1976-10-08

Also Published As

Publication number Publication date
JPS5725365B2 (en) 1982-05-29

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