JPS54149574A - Blade dicing unit for semiconductor substrate - Google Patents

Blade dicing unit for semiconductor substrate

Info

Publication number
JPS54149574A
JPS54149574A JP5755278A JP5755278A JPS54149574A JP S54149574 A JPS54149574 A JP S54149574A JP 5755278 A JP5755278 A JP 5755278A JP 5755278 A JP5755278 A JP 5755278A JP S54149574 A JPS54149574 A JP S54149574A
Authority
JP
Japan
Prior art keywords
wafer
cut grains
water
sticking
water film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5755278A
Other languages
Japanese (ja)
Inventor
Hiroshi Kobayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5755278A priority Critical patent/JPS54149574A/en
Publication of JPS54149574A publication Critical patent/JPS54149574A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To prevent cut grains from sticking to the surface of a semiconductor wafer by covering the surface with a water film at the time of dicing the semiconductor wafer.
CONSTITUTION: On semiconductor-substrate support pedestal 12, wafer 13 is held by decompressing-suction via decompression openings 14 and 14' and diced along its dicing line by rotary blade 11 rotating at a speed of more 10000 r.p.m. At this time, a water film is formed over wafer 13 by water pipe 15 and cut grains made during the dicing are washed away. On the other hand, water is supplied to blade 11 via water pipe 25 to wash away cut grains sticking the surface of the blade and the scattering speed of cut grains is reduced to form water film 26 for the prevention of scattering. In this way, water films 16 and 26 are renewed constantly and cut grains are discharged. Consequently, the wafer surface is covered with a water film, so that cut grains will be prevented from sticking to the surface of the wafer.
COPYRIGHT: (C)1979,JPO&Japio
JP5755278A 1978-05-17 1978-05-17 Blade dicing unit for semiconductor substrate Pending JPS54149574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5755278A JPS54149574A (en) 1978-05-17 1978-05-17 Blade dicing unit for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5755278A JPS54149574A (en) 1978-05-17 1978-05-17 Blade dicing unit for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS54149574A true JPS54149574A (en) 1979-11-22

Family

ID=13058958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5755278A Pending JPS54149574A (en) 1978-05-17 1978-05-17 Blade dicing unit for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS54149574A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0566991U (en) * 1992-02-10 1993-09-03 株式会社ディスコ Dicing machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0566991U (en) * 1992-02-10 1993-09-03 株式会社ディスコ Dicing machine

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