JPS54149574A - Blade dicing unit for semiconductor substrate - Google Patents
Blade dicing unit for semiconductor substrateInfo
- Publication number
- JPS54149574A JPS54149574A JP5755278A JP5755278A JPS54149574A JP S54149574 A JPS54149574 A JP S54149574A JP 5755278 A JP5755278 A JP 5755278A JP 5755278 A JP5755278 A JP 5755278A JP S54149574 A JPS54149574 A JP S54149574A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cut grains
- water
- sticking
- water film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To prevent cut grains from sticking to the surface of a semiconductor wafer by covering the surface with a water film at the time of dicing the semiconductor wafer.
CONSTITUTION: On semiconductor-substrate support pedestal 12, wafer 13 is held by decompressing-suction via decompression openings 14 and 14' and diced along its dicing line by rotary blade 11 rotating at a speed of more 10000 r.p.m. At this time, a water film is formed over wafer 13 by water pipe 15 and cut grains made during the dicing are washed away. On the other hand, water is supplied to blade 11 via water pipe 25 to wash away cut grains sticking the surface of the blade and the scattering speed of cut grains is reduced to form water film 26 for the prevention of scattering. In this way, water films 16 and 26 are renewed constantly and cut grains are discharged. Consequently, the wafer surface is covered with a water film, so that cut grains will be prevented from sticking to the surface of the wafer.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5755278A JPS54149574A (en) | 1978-05-17 | 1978-05-17 | Blade dicing unit for semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5755278A JPS54149574A (en) | 1978-05-17 | 1978-05-17 | Blade dicing unit for semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54149574A true JPS54149574A (en) | 1979-11-22 |
Family
ID=13058958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5755278A Pending JPS54149574A (en) | 1978-05-17 | 1978-05-17 | Blade dicing unit for semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54149574A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0566991U (en) * | 1992-02-10 | 1993-09-03 | 株式会社ディスコ | Dicing machine |
-
1978
- 1978-05-17 JP JP5755278A patent/JPS54149574A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0566991U (en) * | 1992-02-10 | 1993-09-03 | 株式会社ディスコ | Dicing machine |
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