JPS54152874A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPS54152874A
JPS54152874A JP6100478A JP6100478A JPS54152874A JP S54152874 A JPS54152874 A JP S54152874A JP 6100478 A JP6100478 A JP 6100478A JP 6100478 A JP6100478 A JP 6100478A JP S54152874 A JPS54152874 A JP S54152874A
Authority
JP
Japan
Prior art keywords
region
substrate
layer
featuring
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6100478A
Other languages
Japanese (ja)
Inventor
Tatsuya Kamei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6100478A priority Critical patent/JPS54152874A/en
Publication of JPS54152874A publication Critical patent/JPS54152874A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0661Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)
  • Thyristors (AREA)

Abstract

PURPOSE:To increase the forward dielectric strength up to the same level as the reverse dielectric strength for the semiconductor device featuring the negative bevel at the periphery of the PN junction by setting previously the impurity density near the negative bevel surface lower than the internal impurity density at that region. CONSTITUTION:Region 4a featuring a low acceptor density is provided near the bevel surface of P-type base region 4 which constitutes the thyristor. Thus, N-type Si substrate 3 to be N-type base layer is cacuum-enclosed into the quartz capsule along with Ga which is the diffusion source, and then Ga is diffused into substrate 3 through the heat treatment. After this, substrate 3 is taken out of the capsule to be heated up in the oxygen atmosphere in order to form P-type emitter layer 2 and base layer 4 on both surfaces of substrate 3. Then the negative bevel is formed at the both edges from layer 4 through substrate 3, and the entire surface is covered with the SiO2 film with the window drilled. Thus, N-type emitter region 5 is formed by diffusion within layer 4. In this case, an out-diffusion is given with Ga simultaneously to cause region 4 featuring a lower impurity density than region 4a on the bevel surface.
JP6100478A 1978-05-24 1978-05-24 Semiconductor device and its manufacture Pending JPS54152874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6100478A JPS54152874A (en) 1978-05-24 1978-05-24 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6100478A JPS54152874A (en) 1978-05-24 1978-05-24 Semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPS54152874A true JPS54152874A (en) 1979-12-01

Family

ID=13158761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6100478A Pending JPS54152874A (en) 1978-05-24 1978-05-24 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS54152874A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6466965A (en) * 1987-08-11 1989-03-13 Asea Brown Boveri Gate turn-off thyristor
EP0725444A1 (en) * 1995-02-03 1996-08-07 Hitachi, Ltd. Thyristor device and method of manufacturing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6466965A (en) * 1987-08-11 1989-03-13 Asea Brown Boveri Gate turn-off thyristor
EP0725444A1 (en) * 1995-02-03 1996-08-07 Hitachi, Ltd. Thyristor device and method of manufacturing same

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