JPS5353968A - Electronic circuit device - Google Patents
Electronic circuit deviceInfo
- Publication number
- JPS5353968A JPS5353968A JP12920576A JP12920576A JPS5353968A JP S5353968 A JPS5353968 A JP S5353968A JP 12920576 A JP12920576 A JP 12920576A JP 12920576 A JP12920576 A JP 12920576A JP S5353968 A JPS5353968 A JP S5353968A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit device
- deformation
- leads
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To prevent the deformation of leads at the compression bonding by providing a hole at the end each lead.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12920576A JPS5353968A (en) | 1976-10-26 | 1976-10-26 | Electronic circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12920576A JPS5353968A (en) | 1976-10-26 | 1976-10-26 | Electronic circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5353968A true JPS5353968A (en) | 1978-05-16 |
Family
ID=15003724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12920576A Pending JPS5353968A (en) | 1976-10-26 | 1976-10-26 | Electronic circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5353968A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55117252A (en) * | 1979-03-01 | 1980-09-09 | Nec Corp | Semiconductor device |
-
1976
- 1976-10-26 JP JP12920576A patent/JPS5353968A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55117252A (en) * | 1979-03-01 | 1980-09-09 | Nec Corp | Semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS528785A (en) | Semiconductor device electrode structure | |
JPS522376A (en) | Ic elements connecting mechanism | |
JPS53117378A (en) | Assembling device of semiconductor device | |
JPS534472A (en) | Semiconductor package | |
JPS5353968A (en) | Electronic circuit device | |
JPS5315762A (en) | Production of semiconductor device | |
JPS5355932A (en) | Electronic apparatus | |
JPS52149973A (en) | External lead of electronic parts | |
JPS51151069A (en) | Electrode forming method of a semiconductor element | |
JPS5315759A (en) | Electronic parts | |
JPS51117575A (en) | Electronic circuit and its manufacturing method | |
JPS547272A (en) | Semiconductor package | |
JPS52116073A (en) | Hermetic structure in which integrated circuit element is sealed up ai rtightly | |
JPS51127678A (en) | Semiconductor device and its manufacturing method | |
JPS52143186A (en) | Taping device | |
JPS5441666A (en) | Semiconductor integrated circuit element | |
JPS5325394A (en) | Se miconductor device | |
JPS5368163A (en) | Production of flip chip | |
JPS52134395A (en) | Led display device | |
JPS5349948A (en) | Semiconductor device | |
JPS5284966A (en) | Semiconductor device | |
JPS5379462A (en) | Manufacture of semiconductor integrated circuit | |
JPS542664A (en) | Semiconductor device | |
JPS5333057A (en) | Bump type semiconductor device | |
JPS53128980A (en) | Positioning device for bonding |