JPS5284966A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5284966A
JPS5284966A JP76976A JP76976A JPS5284966A JP S5284966 A JPS5284966 A JP S5284966A JP 76976 A JP76976 A JP 76976A JP 76976 A JP76976 A JP 76976A JP S5284966 A JPS5284966 A JP S5284966A
Authority
JP
Japan
Prior art keywords
semiconductor device
disposing
chip
prevent
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP76976A
Other languages
Japanese (ja)
Inventor
Wataru Nozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP76976A priority Critical patent/JPS5284966A/en
Publication of JPS5284966A publication Critical patent/JPS5284966A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent the contact to undesired parts and make operation simple by disposing the end of copper foil leads on the connecting terminals of a chip through a lead frame.
COPYRIGHT: (C)1977,JPO&Japio
JP76976A 1976-01-07 1976-01-07 Semiconductor device Pending JPS5284966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP76976A JPS5284966A (en) 1976-01-07 1976-01-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP76976A JPS5284966A (en) 1976-01-07 1976-01-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5284966A true JPS5284966A (en) 1977-07-14

Family

ID=11482892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP76976A Pending JPS5284966A (en) 1976-01-07 1976-01-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5284966A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61141147A (en) * 1984-12-13 1986-06-28 Nec Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61141147A (en) * 1984-12-13 1986-06-28 Nec Corp Semiconductor device

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