JPS5319565A - Coating agent for contacting printed circuit - Google Patents
Coating agent for contacting printed circuitInfo
- Publication number
- JPS5319565A JPS5319565A JP9291877A JP9291877A JPS5319565A JP S5319565 A JPS5319565 A JP S5319565A JP 9291877 A JP9291877 A JP 9291877A JP 9291877 A JP9291877 A JP 9291877A JP S5319565 A JPS5319565 A JP S5319565A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- coating agent
- contacting printed
- contacting
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Paints Or Removers (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2635457A DE2635457C2 (de) | 1976-08-04 | 1976-08-04 | Katalytischer Lack und seine Verwendung zur Herstellung von gedruckten Schaltungen |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5319565A true JPS5319565A (en) | 1978-02-22 |
JPS6214119B2 JPS6214119B2 (ja) | 1987-03-31 |
Family
ID=5984909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9291877A Granted JPS5319565A (en) | 1976-08-04 | 1977-08-02 | Coating agent for contacting printed circuit |
Country Status (4)
Country | Link |
---|---|
US (1) | US4253875A (ja) |
JP (1) | JPS5319565A (ja) |
DE (1) | DE2635457C2 (ja) |
SU (1) | SU893136A3 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4719145A (en) * | 1983-09-28 | 1988-01-12 | Rohm And Haas Company | Catalytic process and systems |
US4581301A (en) * | 1984-04-10 | 1986-04-08 | Michaelson Henry W | Additive adhesive based process for the manufacture of printed circuit boards |
US4581256A (en) * | 1984-11-19 | 1986-04-08 | Chemline Industries | Electroless plating composition and method of use |
US5147453A (en) * | 1987-11-03 | 1992-09-15 | Basf Corporation | Paint compositions containing silver metal flake pigment |
US5288313A (en) * | 1990-05-31 | 1994-02-22 | Shipley Company Inc. | Electroless plating catalyst |
US5075039A (en) * | 1990-05-31 | 1991-12-24 | Shipley Company Inc. | Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles |
US5120578A (en) * | 1990-05-31 | 1992-06-09 | Shipley Company Inc. | Coating composition |
US5076841A (en) * | 1990-05-31 | 1991-12-31 | Shipley Company Inc. | Coating composition |
DE4107644A1 (de) * | 1991-03-09 | 1992-09-10 | Bayer Ag | Hydroprimer zum metallisieren von substratoberflaechen |
DE4111817A1 (de) * | 1991-04-11 | 1992-10-15 | Bayer Ag | Formulierung zum aktivieren von substratoberflaechen fuer deren stromlose metallisierung |
US5158604A (en) * | 1991-07-01 | 1992-10-27 | Monsanto Company | Viscous electroless plating solutions |
US5419954A (en) * | 1993-02-04 | 1995-05-30 | The Alpha Corporation | Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof |
GB0025989D0 (en) * | 2000-10-24 | 2000-12-13 | Shipley Co Llc | Plating catalysts |
US20020068127A1 (en) * | 2000-12-04 | 2002-06-06 | Francis Durso | Process for selectively plating areas of a substrate |
KR20080011206A (ko) * | 2005-04-20 | 2008-01-31 | 아그파-게바에르트 | 무전해 침착 촉매 패턴의 접촉 인쇄공정 |
KR102440363B1 (ko) * | 2017-08-11 | 2022-09-05 | 삼성전자주식회사 | 필름 프레임, 디스플레이 기판 제조 시스템 및 디스플레이 기판 제조 방법 |
CN116782516B (zh) * | 2023-07-13 | 2024-01-23 | 南华大学 | 一种基于均相离子型催化油墨制备铜印刷电路的普适工艺 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
DE1266099B (de) * | 1965-02-20 | 1968-04-11 | Schering Ag | Bad fuer die reduktive Kupferabscheidung |
US3560257A (en) * | 1967-01-03 | 1971-02-02 | Kollmorgen Photocircuits | Metallization of insulating substrates |
US3372059A (en) * | 1967-04-24 | 1968-03-05 | Dow Chemical Co | Chemical reduction process for silver, copper, or nickel deposition |
FR1548401A (ja) * | 1967-08-16 | 1968-12-06 | ||
US4002786A (en) * | 1967-10-16 | 1977-01-11 | Matsushita Electric Industrial Co., Ltd. | Method for electroless copper plating |
US3520723A (en) * | 1968-01-25 | 1970-07-14 | Eastman Kodak Co | Process for forming a metallic layer on a substrate |
US3607317A (en) * | 1969-02-04 | 1971-09-21 | Photocircuits Corp | Ductility promoter and stabilizer for electroless copper plating baths |
US3904783A (en) * | 1970-11-11 | 1975-09-09 | Nippon Telegraph & Telephone | Method for forming a printed circuit |
US3959547A (en) * | 1971-07-29 | 1976-05-25 | Photocircuits Division Of Kollmorgen Corporation | Process for the formation of real images and products produced thereby |
US3925578A (en) * | 1971-07-29 | 1975-12-09 | Kollmorgen Photocircuits | Sensitized substrates for chemical metallization |
US3915717A (en) * | 1973-11-12 | 1975-10-28 | Rca Corp | Stabilized autocatalytic metal deposition baths |
DE2418654A1 (de) * | 1974-04-18 | 1975-11-06 | Langbein Pfanhauser Werke Ag | Verfahren zum stromlosen oberflaechenmetallisieren von kunststoffgegenstaenden und fuer die durchfuehrung des verfahrens geeignetes aktivierungsbad |
US3930072A (en) * | 1974-06-28 | 1975-12-30 | Universal Oil Prod Co | Stabilization of metal plating baths |
-
1976
- 1976-08-04 DE DE2635457A patent/DE2635457C2/de not_active Expired
-
1977
- 1977-08-02 JP JP9291877A patent/JPS5319565A/ja active Granted
- 1977-08-04 SU SU772514605A patent/SU893136A3/ru active
-
1978
- 1978-11-03 US US05/957,327 patent/US4253875A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE2635457C2 (de) | 1985-06-05 |
JPS6214119B2 (ja) | 1987-03-31 |
US4253875A (en) | 1981-03-03 |
DE2635457A1 (de) | 1978-02-09 |
SU893136A3 (ru) | 1981-12-23 |
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