JPS53146572A - Method of bonding disks - Google Patents

Method of bonding disks

Info

Publication number
JPS53146572A
JPS53146572A JP3283178A JP3283178A JPS53146572A JP S53146572 A JPS53146572 A JP S53146572A JP 3283178 A JP3283178 A JP 3283178A JP 3283178 A JP3283178 A JP 3283178A JP S53146572 A JPS53146572 A JP S53146572A
Authority
JP
Japan
Prior art keywords
bonding disks
disks
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3283178A
Other languages
English (en)
Inventor
Reguraa Deiitaa
Maisunaa Buruuno
Mooritsutsu Arufureeto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of JPS53146572A publication Critical patent/JPS53146572A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP3283178A 1977-03-22 1978-03-22 Method of bonding disks Pending JPS53146572A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772712521 DE2712521A1 (de) 1977-03-22 1977-03-22 Verfahren zum aufkitten von scheiben

Publications (1)

Publication Number Publication Date
JPS53146572A true JPS53146572A (en) 1978-12-20

Family

ID=6004323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3283178A Pending JPS53146572A (en) 1977-03-22 1978-03-22 Method of bonding disks

Country Status (8)

Country Link
US (1) US4283242A (ja)
JP (1) JPS53146572A (ja)
BE (1) BE865169A (ja)
DE (1) DE2712521A1 (ja)
FR (1) FR2384589A1 (ja)
GB (1) GB1554694A (ja)
IT (1) IT1102109B (ja)
NL (1) NL7801348A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05116049A (ja) * 1991-10-30 1993-05-14 Kyushu Electron Metal Co Ltd 半導体ウエーハの真空貼着装置

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809274A1 (de) * 1978-03-03 1979-09-13 Wacker Chemitronic Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren
US4316757A (en) * 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
US4379018A (en) * 1981-12-17 1983-04-05 Planet Products Corporation Heat transfer apparatus
US4530138A (en) * 1982-09-30 1985-07-23 Westinghouse Electric Corp. Method of making a transducer assembly
US4466852A (en) * 1983-10-27 1984-08-21 At&T Technologies, Inc. Method and apparatus for demounting wafers
JPS61159718A (ja) * 1984-12-29 1986-07-19 株式会社村田製作所 積層セラミック電子部品の製造方法
DE3685136D1 (de) * 1985-02-07 1992-06-11 Fujitsu Ltd Verfahren und vorrichtung zum anheften eines streifens oder films an eine halbleiterscheibe.
GB8527708D0 (en) * 1985-11-09 1985-12-11 Old Acre Eng Co Ltd Laminating press
US4934920A (en) * 1987-06-17 1990-06-19 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor device
JPH084105B2 (ja) * 1987-06-19 1996-01-17 株式会社エンヤシステム ウェハ接着方法
US5217563A (en) * 1988-12-01 1993-06-08 Bayer Aktiengesellschaft Apparatus for producing a deep-drawn formed plastic piece
JP2648638B2 (ja) * 1990-11-30 1997-09-03 三菱マテリアル株式会社 ウェーハの接着方法およびその装置
US5116216A (en) * 1991-02-28 1992-05-26 The United States Of America As Represented By The Secretary Of The Navy Apparatus for preparing thermoplastic composites
US5236646A (en) * 1991-02-28 1993-08-17 The United States Of America As Represented By The Secretary Of The Navy Process for preparing thermoplastic composites
JPH0737768A (ja) * 1992-11-26 1995-02-07 Sumitomo Electric Ind Ltd 半導体ウェハの補強方法及び補強された半導体ウェハ
US5300175A (en) * 1993-01-04 1994-04-05 Motorola, Inc. Method for mounting a wafer to a submount
US5460773A (en) 1993-08-11 1995-10-24 Fritz; Michael L. Seal for blow down platen
US6017484A (en) * 1997-01-21 2000-01-25 Harold P. Hale Method for manufacture of minimum porosity, wrinkle free composite parts
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
DE19756614A1 (de) * 1997-12-18 1999-07-01 Wacker Siltronic Halbleitermat Verfahren zur Montage und Demontage einer Halbleiterscheibe, und Stoffmischung, die zur Durchführung des Verfahrens geeignet ist
JP3537688B2 (ja) * 1998-11-24 2004-06-14 富士通株式会社 磁気ヘッドの加工方法
US6431959B1 (en) * 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
DE10048881A1 (de) * 2000-09-29 2002-03-07 Infineon Technologies Ag Vorrichtung und Verfahren zum planen Verbinden zweier Wafer für ein Dünnschleifen und ein Trennen eines Produkt-Wafers
DE10054159A1 (de) * 2000-11-02 2002-05-16 Wacker Siltronic Halbleitermat Verfahren zur Montage von Halbleiterscheiben
US7239902B2 (en) * 2001-03-16 2007-07-03 Nellor Puritan Bennett Incorporated Device and method for monitoring body fluid and electrolyte disorders
DE102005006052A1 (de) * 2004-12-21 2006-07-06 Osram Opto Semiconductors Gmbh Linse, Laseranordnung und Verfahren zur Herstellung einer Laseranordnung
JP5895676B2 (ja) * 2012-04-09 2016-03-30 三菱電機株式会社 半導体装置の製造方法
WO2017047711A1 (ja) * 2015-09-18 2017-03-23 本田技研工業株式会社 貼り付け装置及び貼り付け方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495570A (ja) * 1972-05-02 1974-01-18
JPS4937278A (ja) * 1972-08-14 1974-04-06

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB316134A (ja) * 1928-07-23 1930-10-06 Paul Pick
US3041800A (en) * 1960-05-04 1962-07-03 Roy O Heisel Apparatus for shaping crystals
US3322598A (en) * 1963-10-02 1967-05-30 Alvin M Marks Laminator for securing continuous flexible film to a base
US3405019A (en) * 1965-07-30 1968-10-08 Mc Donnell Douglas Corp Vacuum bonding process
DE1577469A1 (de) * 1966-05-24 1970-05-06 Siemens Ag Verfahren zum Herstellen von Halbleiterscheiben gleichmaessiger Dicke durch mechanische Oberflaechenbearbeitung
US3453783A (en) * 1966-06-30 1969-07-08 Texas Instruments Inc Apparatus for holding silicon slices
US3453166A (en) * 1966-10-11 1969-07-01 Bell Telephone Labor Inc Method and apparatus for bonding transducer elements
US3493451A (en) * 1966-11-02 1970-02-03 Boeing Co Vacuum press and method of laminating therewith
US3475867A (en) * 1966-12-20 1969-11-04 Monsanto Co Processing of semiconductor wafers
DE1652170B2 (de) * 1967-03-03 1975-05-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum gleichzeitigen stirnseitigen Abarbeiten gleichdicker Werkstoffschichten an mehreren unterschiedlich dicken Halbleiterscheiben
US3492763A (en) * 1967-09-18 1970-02-03 Monsanto Co Method and apparatus for mounting semiconductor slices
US3597081A (en) * 1967-11-02 1971-08-03 Continental Device Corp Vacuum masking system and method
US3554834A (en) * 1968-07-24 1971-01-12 Corning Glass Works Decal applying
US3681171A (en) * 1968-08-23 1972-08-01 Hitachi Ltd Apparatus for producing a multilayer printed circuit plate assembly
US3888053A (en) * 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece
US4104099A (en) * 1977-01-27 1978-08-01 International Telephone And Telegraph Corporation Method and apparatus for lapping or polishing materials

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495570A (ja) * 1972-05-02 1974-01-18
JPS4937278A (ja) * 1972-08-14 1974-04-06

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05116049A (ja) * 1991-10-30 1993-05-14 Kyushu Electron Metal Co Ltd 半導体ウエーハの真空貼着装置

Also Published As

Publication number Publication date
BE865169A (fr) 1978-09-22
DE2712521A1 (de) 1978-09-28
IT1102109B (it) 1985-10-07
FR2384589A1 (fr) 1978-10-20
DE2712521C2 (ja) 1987-03-05
IT7848497A0 (it) 1978-03-20
GB1554694A (en) 1979-10-24
FR2384589B1 (ja) 1980-08-29
US4283242A (en) 1981-08-11
NL7801348A (nl) 1978-09-26

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