JPS5314553A - Isolating method of rigid fragile plate - Google Patents

Isolating method of rigid fragile plate

Info

Publication number
JPS5314553A
JPS5314553A JP8816776A JP8816776A JPS5314553A JP S5314553 A JPS5314553 A JP S5314553A JP 8816776 A JP8816776 A JP 8816776A JP 8816776 A JP8816776 A JP 8816776A JP S5314553 A JPS5314553 A JP S5314553A
Authority
JP
Japan
Prior art keywords
fragile plate
isolating method
rigid
rigid fragile
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8816776A
Other languages
Japanese (ja)
Inventor
Shinichi Yamashita
Takeshi Oyamada
Takefumi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8816776A priority Critical patent/JPS5314553A/en
Publication of JPS5314553A publication Critical patent/JPS5314553A/en
Pending legal-status Critical Current

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To isolate wafer to pellets by applying vibrations to a rigit fragile plate provided with scribing grooves.
COPYRIGHT: (C)1978,JPO&Japio
JP8816776A 1976-07-26 1976-07-26 Isolating method of rigid fragile plate Pending JPS5314553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8816776A JPS5314553A (en) 1976-07-26 1976-07-26 Isolating method of rigid fragile plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8816776A JPS5314553A (en) 1976-07-26 1976-07-26 Isolating method of rigid fragile plate

Publications (1)

Publication Number Publication Date
JPS5314553A true JPS5314553A (en) 1978-02-09

Family

ID=13935350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8816776A Pending JPS5314553A (en) 1976-07-26 1976-07-26 Isolating method of rigid fragile plate

Country Status (1)

Country Link
JP (1) JPS5314553A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653317A (en) * 1992-05-27 1994-02-25 Wacker Chemitronic Ges Elektron Grundstoffe Mbh Method for cutting of semiconductor material, especially small piece not contaminated with silicon
JP2013102211A (en) * 2013-01-29 2013-05-23 Agere Systems Inc Method for separating semiconductor wafer into semiconductor dies by using injected impurities

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653317A (en) * 1992-05-27 1994-02-25 Wacker Chemitronic Ges Elektron Grundstoffe Mbh Method for cutting of semiconductor material, especially small piece not contaminated with silicon
JP2013102211A (en) * 2013-01-29 2013-05-23 Agere Systems Inc Method for separating semiconductor wafer into semiconductor dies by using injected impurities

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