JPS5349949A - Pellet bonding method - Google Patents

Pellet bonding method

Info

Publication number
JPS5349949A
JPS5349949A JP12381976A JP12381976A JPS5349949A JP S5349949 A JPS5349949 A JP S5349949A JP 12381976 A JP12381976 A JP 12381976A JP 12381976 A JP12381976 A JP 12381976A JP S5349949 A JPS5349949 A JP S5349949A
Authority
JP
Japan
Prior art keywords
bonding method
pellet bonding
pellet
collet
breakage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12381976A
Other languages
Japanese (ja)
Inventor
Masakazu Ozawa
Osamu Sumiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12381976A priority Critical patent/JPS5349949A/en
Publication of JPS5349949A publication Critical patent/JPS5349949A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent the breakage of a pellet by increasing the collet amplitude gradually at the fixed junction time.
COPYRIGHT: (C)1978,JPO&Japio
JP12381976A 1976-10-18 1976-10-18 Pellet bonding method Pending JPS5349949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12381976A JPS5349949A (en) 1976-10-18 1976-10-18 Pellet bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12381976A JPS5349949A (en) 1976-10-18 1976-10-18 Pellet bonding method

Publications (1)

Publication Number Publication Date
JPS5349949A true JPS5349949A (en) 1978-05-06

Family

ID=14870123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12381976A Pending JPS5349949A (en) 1976-10-18 1976-10-18 Pellet bonding method

Country Status (1)

Country Link
JP (1) JPS5349949A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7978022B2 (en) 2004-04-20 2011-07-12 Electronics And Telecommunications Research Institute Cable to waveguide transition apparatus having signal accumulation form of backshort and active phase shifting using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4985967A (en) * 1972-12-22 1974-08-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4985967A (en) * 1972-12-22 1974-08-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7978022B2 (en) 2004-04-20 2011-07-12 Electronics And Telecommunications Research Institute Cable to waveguide transition apparatus having signal accumulation form of backshort and active phase shifting using the same

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