JPS5279781A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5279781A
JPS5279781A JP15498175A JP15498175A JPS5279781A JP S5279781 A JPS5279781 A JP S5279781A JP 15498175 A JP15498175 A JP 15498175A JP 15498175 A JP15498175 A JP 15498175A JP S5279781 A JPS5279781 A JP S5279781A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
bonding
layer
braze
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15498175A
Other languages
Japanese (ja)
Inventor
Mitsusachi Matsuzaki
Katsunobu Yoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15498175A priority Critical patent/JPS5279781A/en
Publication of JPS5279781A publication Critical patent/JPS5279781A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To make the Al bonding layer of a wafer block uniform by laminating and bonding the Al layer using a jig having effluent grooves for a braze for bonding.
COPYRIGHT: (C)1977,JPO&Japio
JP15498175A 1975-12-26 1975-12-26 Production of semiconductor device Pending JPS5279781A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15498175A JPS5279781A (en) 1975-12-26 1975-12-26 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15498175A JPS5279781A (en) 1975-12-26 1975-12-26 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5279781A true JPS5279781A (en) 1977-07-05

Family

ID=15596089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15498175A Pending JPS5279781A (en) 1975-12-26 1975-12-26 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5279781A (en)

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