JPS5240972A - Packaging construction of semiconductor device - Google Patents
Packaging construction of semiconductor deviceInfo
- Publication number
- JPS5240972A JPS5240972A JP11658775A JP11658775A JPS5240972A JP S5240972 A JPS5240972 A JP S5240972A JP 11658775 A JP11658775 A JP 11658775A JP 11658775 A JP11658775 A JP 11658775A JP S5240972 A JPS5240972 A JP S5240972A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- packaging construction
- conduct
- paste
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PURPOSE: To conduct IC electrode to leads by means of a paste-form conductive material via the through-hole of IC lead pattern formed on an insulating substrate, thereby forming inexpensive and highly reliable wireless bonding.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11658775A JPS5240972A (en) | 1975-09-26 | 1975-09-26 | Packaging construction of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11658775A JPS5240972A (en) | 1975-09-26 | 1975-09-26 | Packaging construction of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5240972A true JPS5240972A (en) | 1977-03-30 |
Family
ID=14690817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11658775A Pending JPS5240972A (en) | 1975-09-26 | 1975-09-26 | Packaging construction of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5240972A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4955132A (en) * | 1987-11-16 | 1990-09-11 | Sharp Kabushiki Kaisha | Method for mounting a semiconductor chip |
US5452182A (en) * | 1990-04-05 | 1995-09-19 | Martin Marietta Corporation | Flexible high density interconnect structure and flexibly interconnected system |
WO1998048455A1 (en) * | 1997-04-21 | 1998-10-29 | Seiko Epson Corporation | Interelectrode connecting structure, interelectrode connecting method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic equipment |
-
1975
- 1975-09-26 JP JP11658775A patent/JPS5240972A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4955132A (en) * | 1987-11-16 | 1990-09-11 | Sharp Kabushiki Kaisha | Method for mounting a semiconductor chip |
US5452182A (en) * | 1990-04-05 | 1995-09-19 | Martin Marietta Corporation | Flexible high density interconnect structure and flexibly interconnected system |
WO1998048455A1 (en) * | 1997-04-21 | 1998-10-29 | Seiko Epson Corporation | Interelectrode connecting structure, interelectrode connecting method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic equipment |
US6357111B1 (en) | 1997-04-21 | 2002-03-19 | Seiko Epson Corporation | Inter-electrode connection structure, inter-electrode connection method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic apparatus |
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