JPS535571A - Circuit block and its manufacture - Google Patents
Circuit block and its manufactureInfo
- Publication number
- JPS535571A JPS535571A JP7961976A JP7961976A JPS535571A JP S535571 A JPS535571 A JP S535571A JP 7961976 A JP7961976 A JP 7961976A JP 7961976 A JP7961976 A JP 7961976A JP S535571 A JPS535571 A JP S535571A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- circuit block
- substrate
- lead
- fsxing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
PURPOSE: To manufacture a circuit block which is thin-type and is easily made to a multiple lead by making both the substrate surface and the ship electrode surface onto the same surface and forming the lead from the electrode pad after fsxing the chip to the substrate.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7961976A JPS535571A (en) | 1976-07-05 | 1976-07-05 | Circuit block and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7961976A JPS535571A (en) | 1976-07-05 | 1976-07-05 | Circuit block and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS535571A true JPS535571A (en) | 1978-01-19 |
Family
ID=13695065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7961976A Pending JPS535571A (en) | 1976-07-05 | 1976-07-05 | Circuit block and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS535571A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5754356A (en) * | 1980-08-05 | 1982-03-31 | Gao Ges Automation Org | |
US5219795A (en) * | 1989-02-07 | 1993-06-15 | Fujitsu Limited | Dual in-line packaging and method of producing the same |
US5273938A (en) * | 1989-09-06 | 1993-12-28 | Motorola, Inc. | Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film |
-
1976
- 1976-07-05 JP JP7961976A patent/JPS535571A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5754356A (en) * | 1980-08-05 | 1982-03-31 | Gao Ges Automation Org | |
JPH0158657B2 (en) * | 1980-08-05 | 1989-12-13 | Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh | |
US5219795A (en) * | 1989-02-07 | 1993-06-15 | Fujitsu Limited | Dual in-line packaging and method of producing the same |
US5273938A (en) * | 1989-09-06 | 1993-12-28 | Motorola, Inc. | Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film |
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