JPS5312268A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5312268A
JPS5312268A JP8672576A JP8672576A JPS5312268A JP S5312268 A JPS5312268 A JP S5312268A JP 8672576 A JP8672576 A JP 8672576A JP 8672576 A JP8672576 A JP 8672576A JP S5312268 A JPS5312268 A JP S5312268A
Authority
JP
Japan
Prior art keywords
production
electrode
semiconductor device
meatls
adn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8672576A
Other languages
Japanese (ja)
Other versions
JPS5724930B2 (en
Inventor
Kazufumi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8672576A priority Critical patent/JPS5312268A/en
Publication of JPS5312268A publication Critical patent/JPS5312268A/en
Publication of JPS5724930B2 publication Critical patent/JPS5724930B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To align electrodes one to one despite the production of any deviation adn narrow the space therebetween by depositing either one of the meatls of the wiring base electrode on a wiring substrate for leads and the electrode on a semiconductor element onto other electrode.
COPYRIGHT: (C)1978,JPO&Japio
JP8672576A 1976-07-20 1976-07-20 Production of semiconductor device Granted JPS5312268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8672576A JPS5312268A (en) 1976-07-20 1976-07-20 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8672576A JPS5312268A (en) 1976-07-20 1976-07-20 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5312268A true JPS5312268A (en) 1978-02-03
JPS5724930B2 JPS5724930B2 (en) 1982-05-26

Family

ID=13894829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8672576A Granted JPS5312268A (en) 1976-07-20 1976-07-20 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5312268A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61172938U (en) * 1985-04-15 1986-10-27

Also Published As

Publication number Publication date
JPS5724930B2 (en) 1982-05-26

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