JPS5213774A - Production method of semiconductor device - Google Patents

Production method of semiconductor device

Info

Publication number
JPS5213774A
JPS5213774A JP8919375A JP8919375A JPS5213774A JP S5213774 A JPS5213774 A JP S5213774A JP 8919375 A JP8919375 A JP 8919375A JP 8919375 A JP8919375 A JP 8919375A JP S5213774 A JPS5213774 A JP S5213774A
Authority
JP
Japan
Prior art keywords
semiconductor device
production method
wafer
offf
semiconductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8919375A
Other languages
Japanese (ja)
Inventor
Masao Kosugi
Takashi Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Gakki Co Ltd
Original Assignee
Nippon Gakki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Gakki Co Ltd filed Critical Nippon Gakki Co Ltd
Priority to JP8919375A priority Critical patent/JPS5213774A/en
Publication of JPS5213774A publication Critical patent/JPS5213774A/en
Priority to US05/893,275 priority patent/US4179794A/en
Pending legal-status Critical Current

Links

Landscapes

  • Bipolar Transistors (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: In order to improve the reliability and the yield of a semiconductor device through cutting the PN junction section offf from the air, by means of coating the thermosetting or thermoplastic resin on a wafer, after the forming numerous pieces of semiconductors on the wafer surface section, thereby heating and hardening it.
COPYRIGHT: (C)1977,JPO&Japio
JP8919375A 1975-07-23 1975-07-23 Production method of semiconductor device Pending JPS5213774A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP8919375A JPS5213774A (en) 1975-07-23 1975-07-23 Production method of semiconductor device
US05/893,275 US4179794A (en) 1975-07-23 1978-04-05 Process of manufacturing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8919375A JPS5213774A (en) 1975-07-23 1975-07-23 Production method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5213774A true JPS5213774A (en) 1977-02-02

Family

ID=13963870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8919375A Pending JPS5213774A (en) 1975-07-23 1975-07-23 Production method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5213774A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474677A (en) * 1977-11-28 1979-06-14 Hitachi Ltd Surface stabilizing method of semiconcuctor element using polyimide silicone
JPS60251267A (en) * 1984-05-26 1985-12-11 Nisshin Steel Co Ltd Heat resistant coated covered steel material and its manufacture
JPH0288754A (en) * 1988-09-27 1990-03-28 Nippon Steel Corp Hot-dip aluminized steel sheet excellent in corrosion resistance
JPH0293055A (en) * 1988-09-30 1990-04-03 Nippon Steel Corp Hot dip aluminized steel sheet having superior corrosion resistance

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49105466A (en) * 1973-02-07 1974-10-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49105466A (en) * 1973-02-07 1974-10-05

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474677A (en) * 1977-11-28 1979-06-14 Hitachi Ltd Surface stabilizing method of semiconcuctor element using polyimide silicone
JPS616540B2 (en) * 1977-11-28 1986-02-27 Hitachi Ltd
JPS60251267A (en) * 1984-05-26 1985-12-11 Nisshin Steel Co Ltd Heat resistant coated covered steel material and its manufacture
JPH0576535B2 (en) * 1984-05-26 1993-10-22 Nisshin Steel Co Ltd
JPH0288754A (en) * 1988-09-27 1990-03-28 Nippon Steel Corp Hot-dip aluminized steel sheet excellent in corrosion resistance
JPH0293055A (en) * 1988-09-30 1990-04-03 Nippon Steel Corp Hot dip aluminized steel sheet having superior corrosion resistance

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