JPS5213774A - Production method of semiconductor device - Google Patents
Production method of semiconductor deviceInfo
- Publication number
- JPS5213774A JPS5213774A JP8919375A JP8919375A JPS5213774A JP S5213774 A JPS5213774 A JP S5213774A JP 8919375 A JP8919375 A JP 8919375A JP 8919375 A JP8919375 A JP 8919375A JP S5213774 A JPS5213774 A JP S5213774A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- production method
- wafer
- offf
- semiconductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Dicing (AREA)
Abstract
PURPOSE: In order to improve the reliability and the yield of a semiconductor device through cutting the PN junction section offf from the air, by means of coating the thermosetting or thermoplastic resin on a wafer, after the forming numerous pieces of semiconductors on the wafer surface section, thereby heating and hardening it.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8919375A JPS5213774A (en) | 1975-07-23 | 1975-07-23 | Production method of semiconductor device |
US05/893,275 US4179794A (en) | 1975-07-23 | 1978-04-05 | Process of manufacturing semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8919375A JPS5213774A (en) | 1975-07-23 | 1975-07-23 | Production method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5213774A true JPS5213774A (en) | 1977-02-02 |
Family
ID=13963870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8919375A Pending JPS5213774A (en) | 1975-07-23 | 1975-07-23 | Production method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5213774A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5474677A (en) * | 1977-11-28 | 1979-06-14 | Hitachi Ltd | Surface stabilizing method of semiconcuctor element using polyimide silicone |
JPS60251267A (en) * | 1984-05-26 | 1985-12-11 | Nisshin Steel Co Ltd | Heat resistant coated covered steel material and its manufacture |
JPH0288754A (en) * | 1988-09-27 | 1990-03-28 | Nippon Steel Corp | Hot-dip aluminized steel sheet excellent in corrosion resistance |
JPH0293055A (en) * | 1988-09-30 | 1990-04-03 | Nippon Steel Corp | Hot dip aluminized steel sheet having superior corrosion resistance |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49105466A (en) * | 1973-02-07 | 1974-10-05 |
-
1975
- 1975-07-23 JP JP8919375A patent/JPS5213774A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49105466A (en) * | 1973-02-07 | 1974-10-05 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5474677A (en) * | 1977-11-28 | 1979-06-14 | Hitachi Ltd | Surface stabilizing method of semiconcuctor element using polyimide silicone |
JPS616540B2 (en) * | 1977-11-28 | 1986-02-27 | Hitachi Ltd | |
JPS60251267A (en) * | 1984-05-26 | 1985-12-11 | Nisshin Steel Co Ltd | Heat resistant coated covered steel material and its manufacture |
JPH0576535B2 (en) * | 1984-05-26 | 1993-10-22 | Nisshin Steel Co Ltd | |
JPH0288754A (en) * | 1988-09-27 | 1990-03-28 | Nippon Steel Corp | Hot-dip aluminized steel sheet excellent in corrosion resistance |
JPH0293055A (en) * | 1988-09-30 | 1990-04-03 | Nippon Steel Corp | Hot dip aluminized steel sheet having superior corrosion resistance |
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