JPS5211866A - Resin sealing method in a semiconductor device - Google Patents

Resin sealing method in a semiconductor device

Info

Publication number
JPS5211866A
JPS5211866A JP8857075A JP8857075A JPS5211866A JP S5211866 A JPS5211866 A JP S5211866A JP 8857075 A JP8857075 A JP 8857075A JP 8857075 A JP8857075 A JP 8857075A JP S5211866 A JPS5211866 A JP S5211866A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin sealing
sealing method
transfer
burr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8857075A
Other languages
Japanese (ja)
Inventor
Hideyuki Irie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8857075A priority Critical patent/JPS5211866A/en
Publication of JPS5211866A publication Critical patent/JPS5211866A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: By applying the transfer pressure in a transfer mold method only in a resin injection, the occurrence of a burr shall be prevented.
COPYRIGHT: (C)1977,JPO&Japio
JP8857075A 1975-07-18 1975-07-18 Resin sealing method in a semiconductor device Pending JPS5211866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8857075A JPS5211866A (en) 1975-07-18 1975-07-18 Resin sealing method in a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8857075A JPS5211866A (en) 1975-07-18 1975-07-18 Resin sealing method in a semiconductor device

Publications (1)

Publication Number Publication Date
JPS5211866A true JPS5211866A (en) 1977-01-29

Family

ID=13946513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8857075A Pending JPS5211866A (en) 1975-07-18 1975-07-18 Resin sealing method in a semiconductor device

Country Status (1)

Country Link
JP (1) JPS5211866A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117843A (en) * 1984-11-14 1986-06-05 Sumitomo Heavy Ind Ltd Semiconductor resin-sealing method
JPS6278839A (en) * 1985-09-30 1987-04-11 Mitsubishi Electric Corp Resin sealing device for semiconductor element
JPS62130531A (en) * 1985-11-30 1987-06-12 Rohm Co Ltd Resin molding method for semiconductor device
JPS6371530U (en) * 1986-10-30 1988-05-13
JPH02133932A (en) * 1988-11-14 1990-05-23 Polyplastics Co Premolded package and its manufacture
JPH05154863A (en) * 1991-12-05 1993-06-22 Sumitomo Bakelite Co Ltd Molding method of thermosetting molding material

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117843A (en) * 1984-11-14 1986-06-05 Sumitomo Heavy Ind Ltd Semiconductor resin-sealing method
JPS6278839A (en) * 1985-09-30 1987-04-11 Mitsubishi Electric Corp Resin sealing device for semiconductor element
JPS62130531A (en) * 1985-11-30 1987-06-12 Rohm Co Ltd Resin molding method for semiconductor device
JPS6371530U (en) * 1986-10-30 1988-05-13
JPH02133932A (en) * 1988-11-14 1990-05-23 Polyplastics Co Premolded package and its manufacture
JPH05154863A (en) * 1991-12-05 1993-06-22 Sumitomo Bakelite Co Ltd Molding method of thermosetting molding material

Similar Documents

Publication Publication Date Title
JPS5253663A (en) Resin sealing mold
JPS5381073A (en) Oroduction of resin seal type semiconductor device and lead frame used the same
JPS5211866A (en) Resin sealing method in a semiconductor device
JPS5326841A (en) Method for sticking additives to polymer pellets
JPS5231673A (en) Resin sealing method of semiconductor device
JPS532078A (en) Sealing structure for semiconductor device
JPS5230167A (en) Method for production of semiconductor device
JPS5275180A (en) Package for integrated circuits
JPS5381076A (en) Lroduction of resin seal semiconductor device
JPS53100773A (en) Packaging method
JPS5214359A (en) Process for sealing of the semiconductor and lead-frame used in this method
JPS5242372A (en) Process for production of semiconductor device
JPS51112273A (en) Lead frame for resin mold type semiconductor device
JPS51137377A (en) Manufacturing method for plastic seal type semi conductor
JPS524600A (en) Curing of epoxy resin
JPS5252062A (en) Fitting method of bushing made of synthetic resin
JPS51148594A (en) Thermo-shrink packaging method with improved seal-brakability
JPS51137466A (en) Press pressure detecting method
JPS5287982A (en) Resin molding method of semiconductor elements
JPS5368974A (en) Production of resin seal type semiconductor device
JPS51116680A (en) Semiconductor device and its manumacturing method
JPS52156561A (en) Resin molded semiconductor device and its production
JPS5347770A (en) Production of semiconductor device
JPS52179A (en) Method of fabricating semiconductor
JPS51140480A (en) Method of fabticating semiconductor device