JPS61117843A - Semiconductor resin-sealing method - Google Patents
Semiconductor resin-sealing methodInfo
- Publication number
- JPS61117843A JPS61117843A JP23867184A JP23867184A JPS61117843A JP S61117843 A JPS61117843 A JP S61117843A JP 23867184 A JP23867184 A JP 23867184A JP 23867184 A JP23867184 A JP 23867184A JP S61117843 A JPS61117843 A JP S61117843A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- resin
- plunger
- point
- speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（関連産業分野）
この発明は半導体を樹脂で被覆保護する半導体樹脂封止
成形方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Related Industrial Field) The present invention relates to a semiconductor resin encapsulation molding method for coating and protecting a semiconductor with a resin.
（従来技術）
半導体を樹脂で被覆するための従来法においては、第１
図に示す如きプレスにより以下のような使用方法が知ら
れている。(Prior art) In the conventional method for coating semiconductors with resin, the first
The following method of using a press as shown in the figure is known.
すなわち、プラテンｌは下部シリンダ２により上方に押
上げられ、プラテン１に取付けられた下型４をクラウン
３に吊下された上型５に押付ける。That is, the platen 1 is pushed upward by the lower cylinder 2, and the lower mold 4 attached to the platen 1 is pressed against the upper mold 5 suspended from the crown 3.
その後、上・下型５，４はボルトにより締め付けられる
。Thereafter, the upper and lower molds 5, 4 are tightened with bolts.
なお、予め下型４内には半導体が収容されている。上型
５には孔が設けられており、そこから合成樹脂タブレッ
トを投入した後、同一孔にプランジャー７を挿入し降下
させる。プランジャー７が合成樹脂に当たる（予め設定
した位置に達する）と、当初に設定した速度（流量制御
弁で初期設定）で加圧を開始する。その後プランジャー
圧が設定圧に達するまで一定速度で加圧を続け、設定圧
で保圧状態となる。Note that a semiconductor is housed in the lower mold 4 in advance. The upper mold 5 is provided with a hole, and after a synthetic resin tablet is introduced therein, a plunger 7 is inserted into the same hole and lowered. When the plunger 7 hits the synthetic resin (reaches a preset position), pressurization starts at the originally set speed (initial setting by the flow control valve). After that, pressurization continues at a constant rate until the plunger pressure reaches the set pressure, and the pressure is maintained at the set pressure.
こうした従来方法によれば、樹脂の性質および金型形状
によるパリおよびボイドの大量発生に対する対策として
は、金型形状を変更することしかなされておらず、充分
なものではなかった。According to these conventional methods, the only measure against the large amount of voids and voids caused by the properties of the resin and the shape of the mold is to change the shape of the mold, which is not sufficient.
（発明の解決しようとする問題点）
本発明は、こうした従来の問題点を改良するためになさ
れたもので、簡単な手段によりパリおよびボイドの発生
量を減少させることを目的とする。(Problems to be Solved by the Invention) The present invention has been made in order to improve these conventional problems, and aims to reduce the amount of voids and voids generated by simple means.
（問題点の解決手段）
上記の目的を達成するための本発明の要旨とするところ
は、半導体樹脂封止プレスの上型と下型とを締め付けた
後、金型内に樹脂を投入し、トランスファシリンダのプ
ランジャーにより樹脂加圧および保圧して封止を行う際
、加圧速度および保圧圧力をそれぞれ複数段に制御する
ことを特徴とする。(Means for Solving Problems) The gist of the present invention to achieve the above object is that after tightening the upper and lower molds of a semiconductor resin encapsulation press, the resin is poured into the mold, When sealing is performed by pressurizing and holding the resin with the plunger of the transfer cylinder, the pressurizing speed and holding pressure are each controlled in multiple stages.
（発明の実施例） 以下図面に基いて本発明の一実施例を説明する。(Example of the invention) An embodiment of the present invention will be described below based on the drawings.
本発明に使用するプレスは第１図に示す通りであって、
その構成は従来のものと変りはない、すなわち、図中１
は上下動可能なプラテンで、ベッド８に立設された４本
のコラム９に摺動可能に装嵌されている。２は前記ベッ
ド８に配設された下部シリンダであり、３は前記コラム
９の上端に保持されたクラウン、７は該クラウン３に装
備されたトランスファシリンダ６のプランジャである。The press used in the present invention is as shown in FIG.
Its configuration is the same as the conventional one, that is, 1 in the figure.
is a platen that can move up and down, and is slidably fitted into four columns 9 erected on the bed 8. 2 is a lower cylinder arranged on the bed 8, 3 is a crown held at the upper end of the column 9, and 7 is a plunger of the transfer cylinder 6 equipped on the crown 3.
又金型を構成する上型５は前記クラウン３に吊下され、
下型４はプラテン１に取付けられていることは従来のも
のと同様である。Further, an upper mold 5 constituting the mold is suspended from the crown 3,
The lower die 4 is attached to the platen 1 as in the conventional case.
（作用）
以上の構成からなるプレスを使用して本発明の方法を第
３図に示した作動線図によって説明する。(Operation) The method of the present invention using the press constructed as described above will be explained with reference to the operation diagram shown in FIG.
まず、型内に半導体を入れた後、シリンダ２の操作によ
り、プラテン１を介して下型４を上動して上型５と下型
４とを締め付ける０次に上型５にあけられた孔を通して
合成樹脂タブレットを投入した後、鎖孔にプランジャー
７を挿入して降下させる。その際の降下速度は従来と同
様高速（例えば１６０ｍ／５ｅｅ）である。First, after putting a semiconductor into the mold, by operating the cylinder 2, the lower mold 4 is moved upward via the platen 1 to tighten the upper mold 5 and the lower mold 4. Next, a hole is made in the upper mold 5. After introducing the synthetic resin tablet through the hole, the plunger 7 is inserted into the chain hole and lowered. The descending speed at that time is high (for example, 160 m/5ee) as in the conventional case.
プランジャー７が合成樹脂に当たる（予め設定した位置
Ａに達する）と、初期に設定した第１速度（例えば１０
■／５ｅａ）となり、加圧を開始する。When the plunger 7 hits the synthetic resin (reaches the preset position A), the initially set first speed (for example, 10
■/5ea), and pressurization is started.
次に、プランジャー７が所定位置Ｂに達すると。Next, when the plunger 7 reaches the predetermined position B.
初期に設定した第二速度（例えば２■／５ｅｅ）になる
０次に、例えばプランジャー７の圧力を圧力センサーで
検出し、保圧に入る。保圧に入った後、タイマーで測定
した時間を信号として初期設定した第二の圧力に切り換
わる（Ｄ点）、最後に、タイマーで初期設定した時間後
Ｅ点で圧抜きが行われ、プランジャー７は上昇を開始し
くＦ点）、成形作業が終了する。At the 0th order when the initially set second speed (for example, 2/5ee) is reached, the pressure of the plunger 7, for example, is detected by a pressure sensor, and the pressure is maintained. After entering pressure holding, the time measured by the timer is used as a signal to switch to the initially set second pressure (point D).Finally, after the time initially set by the timer, pressure is released at point E, and the plan is released. The jar 7 starts to rise (point F), and the molding operation ends.
なお、上記保圧に入る前の信号は圧力センサーから取り
出しているが、ポテンショメータがエンコーダで検出し
たプランジャーの位置Ｃを保圧への切り変わりの信号と
してもよい。Although the signal before entering the holding pressure state is taken from the pressure sensor, the position C of the plunger detected by the encoder of the potentiometer may be used as the signal for switching to the holding pressure state.
（効果）
本発明の成形方法は以上の通りであって、樹脂の性質あ
るいは金型のキャビティ形状を考慮して加圧速度および
保圧圧力を複数段に制御できるようにしであるため、樹
脂の流れ込み充満状態が良好となり、ボイドおよびパリ
の発生を極少に抑え、良品質の製品を得ることを可能と
なし、発明所期の目的を確実に達成することができる。(Effects) The molding method of the present invention is as described above, and the pressurization speed and holding pressure can be controlled in multiple stages by taking into consideration the properties of the resin or the shape of the mold cavity. The flowing filling state is improved, the occurrence of voids and cracks are minimized, and it is possible to obtain a high quality product, thereby reliably achieving the intended purpose of the invention.
尚、上記例では加圧・保圧とも２段制御を行った場合の
実施例について述へたが、本発明はこれに限定されるこ
となく、３段もしくはそれ以上の制御を行わせることも
可能であり１本発明の技術的範囲に包含されることは言
うまでもない。In addition, in the above example, an example was described in which two-stage control is performed for both pressurization and pressure holding, but the present invention is not limited to this, and three or more stages of control may also be performed. It goes without saying that this is possible and falls within the technical scope of the present invention.
図面はこの発明の実施に好適な一実施態様を示し、第１
図はプレスの正面図、第２図は側面図、第３図は作動線
図である。
図において；
１ プラテン ２ シリンダ
３ クラウン ４ 下型
５ 上型
６ トランスファシリンダ
７ プランジャー ８ ベッド
９ コラム
以上
出願人 住友重機械工業株式会社
復代理人 弁理士 大 橋 勇
１ｇ１図
第２図The drawings show one embodiment suitable for carrying out this invention, and the first embodiment is shown in the drawings.
The figure is a front view of the press, FIG. 2 is a side view, and FIG. 3 is an operating diagram. In the figure: 1 Platen 2 Cylinder 3 Crown 4 Lower die 5 Upper die 6 Transfer cylinder 7 Plunger 8 Bed 9 Column and above Applicant Sumitomo Heavy Industries, Ltd. Sub-Agent Patent Attorney Isamu Ohashi 1g1 Figure 2
Claims (1)
、金型内に樹脂を投入し、トランスファシリンダのプラ
ンジャーにより樹脂加圧および保圧して封止を行う際、
加圧速度および保圧圧力をそれぞれ複数段に制御するこ
とを特徴とする半導体樹脂封止成形方法。After tightening the upper and lower molds of the semiconductor resin sealing press, resin is poured into the mold, and when sealing is performed by pressurizing and holding the resin with the plunger of the transfer cylinder,
A semiconductor resin encapsulation molding method characterized by controlling pressurization speed and holding pressure in multiple stages.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23867184A JPS61117843A (en) | 1984-11-14 | 1984-11-14 | Semiconductor resin-sealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23867184A JPS61117843A (en) | 1984-11-14 | 1984-11-14 | Semiconductor resin-sealing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61117843A true JPS61117843A (en) | 1986-06-05 |
Family
ID=17033582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23867184A Pending JPS61117843A (en) | 1984-11-14 | 1984-11-14 | Semiconductor resin-sealing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61117843A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6371530U (en) * | 1986-10-30 | 1988-05-13 | ||
| JP2008183827A (en) * | 2007-01-30 | 2008-08-14 | Sumitomo Heavy Ind Ltd | Resin sealing device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211866A (en) * | 1975-07-18 | 1977-01-29 | Mitsubishi Electric Corp | Resin sealing method in a semiconductor device |
| JPS57167640A (en) * | 1981-04-08 | 1982-10-15 | Toshiba Corp | Sealing method for semiconductor element with resin |
| JPS5829640A (en) * | 1981-08-18 | 1983-02-21 | Toshiba Corp | Mold device |
| JPS58222831A (en) * | 1982-06-22 | 1983-12-24 | Fujitsu Ltd | Transfer molding apparatus |
-
1984
- 1984-11-14 JP JP23867184A patent/JPS61117843A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211866A (en) * | 1975-07-18 | 1977-01-29 | Mitsubishi Electric Corp | Resin sealing method in a semiconductor device |
| JPS57167640A (en) * | 1981-04-08 | 1982-10-15 | Toshiba Corp | Sealing method for semiconductor element with resin |
| JPS5829640A (en) * | 1981-08-18 | 1983-02-21 | Toshiba Corp | Mold device |
| JPS58222831A (en) * | 1982-06-22 | 1983-12-24 | Fujitsu Ltd | Transfer molding apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6371530U (en) * | 1986-10-30 | 1988-05-13 | ||
| JP2008183827A (en) * | 2007-01-30 | 2008-08-14 | Sumitomo Heavy Ind Ltd | Resin sealing device |
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