JPS52113687A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52113687A
JPS52113687A JP3012476A JP3012476A JPS52113687A JP S52113687 A JPS52113687 A JP S52113687A JP 3012476 A JP3012476 A JP 3012476A JP 3012476 A JP3012476 A JP 3012476A JP S52113687 A JPS52113687 A JP S52113687A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
disconnection
reliable
fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3012476A
Other languages
Japanese (ja)
Other versions
JPS5840338B2 (en
Inventor
Hiroshi Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3012476A priority Critical patent/JPS5840338B2/en
Publication of JPS52113687A publication Critical patent/JPS52113687A/en
Publication of JPS5840338B2 publication Critical patent/JPS5840338B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To make contact window opening of a fine Si gate MOS-IC reliable and avoid the disconnection of electrode wirings at the window edges by partially varying the film thickness of the photo resist used during processing.
COPYRIGHT: (C)1977,JPO&Japio
JP3012476A 1976-03-19 1976-03-19 Manufacturing method for semiconductor devices Expired JPS5840338B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3012476A JPS5840338B2 (en) 1976-03-19 1976-03-19 Manufacturing method for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3012476A JPS5840338B2 (en) 1976-03-19 1976-03-19 Manufacturing method for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS52113687A true JPS52113687A (en) 1977-09-22
JPS5840338B2 JPS5840338B2 (en) 1983-09-05

Family

ID=12295016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3012476A Expired JPS5840338B2 (en) 1976-03-19 1976-03-19 Manufacturing method for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5840338B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056461U (en) * 1983-09-27 1985-04-19 株式会社東芝 polishing jig
JPS60167637U (en) * 1984-04-16 1985-11-07 株式会社　富士電機総合研究所 Suction type holder for grinding fuel cell electrode substrates
JPS61168439A (en) * 1985-01-18 1986-07-30 Shibayama Kikai Kk Method for removing semiconductor wafer in chuck mechanism
JPS61168438A (en) * 1985-01-18 1986-07-30 Shibayama Kikai Kk Method for removing semiconductor wafer in chuck mechanism
JPS6295862U (en) * 1985-12-04 1987-06-18

Also Published As

Publication number Publication date
JPS5840338B2 (en) 1983-09-05

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