JPH11508928A - 電気工学または電子工学部品の注型材料としてのシリコーン変性エポキシ樹脂の使用 - Google Patents
電気工学または電子工学部品の注型材料としてのシリコーン変性エポキシ樹脂の使用Info
- Publication number
- JPH11508928A JPH11508928A JP9504686A JP50468697A JPH11508928A JP H11508928 A JPH11508928 A JP H11508928A JP 9504686 A JP9504686 A JP 9504686A JP 50468697 A JP50468697 A JP 50468697A JP H11508928 A JPH11508928 A JP H11508928A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- use according
- silicone
- resin mixture
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.化学的に結合した線状オルガノポリシロキサン基を有する第一のエポキシ樹 脂を含有し、かつ多価の芳香族または脂環式ヒドロキシ化合物ベースの第二のエ ポキシ樹脂を含有し、ならびに硬化剤および鉱物質充填剤を含有し、その際、第 一のエポキシ樹脂がエラストマーの性質を有し、かつ官能性のオキシランと線状 オルガノポリシロキサンとの間に少なくとも1つの酸素原子を有する2官能性の 架橋分子を少なくとも1つ有する基を有する、硬化可能なエポキシ樹脂混合物の 、電気工学または電子工学部品のための注型材料としての使用。 2.2官能性化可能な架橋分子が、ビスフェノールA、ビスフェノールFからな る群から選択され、かつ2官能性架橋分子の断片が−CH2CH2COO−、−C H2CH2CH2COO−からなる群から選択されている、請求項1記載の使用。 3.もう1つのエポキシ樹脂が脂環式および/または脂肪族エポキシ樹脂である 、請求項1または2記載の使用。 4.脂環式エポキシ樹脂がヘキサヒドロフタル酸−ビス−グリシジルエステルで ある、請求項3記載の使用。 5.鉱物性充填剤が無定形二酸化ケイ素である、請求 項1記載の使用。 6.無定形二酸化ケイ素の割合が、硬化可能なエポキシ樹脂混合物に対して40 〜75重量%である、請求項1から5までのいずれか1項記載の使用。 7.硬化剤がオレフィン系不飽和ジカルボン酸無水物と環式ジエンからなるジエ ン付加生成物である、請求項1記載の使用。 8.エポキシ樹脂混合物が付加的に、エポキシ樹脂の陽イオンの架橋のための開 始剤を含有する、請求項1記載の使用。 9.エポキシ樹脂混合物がさらに硬化促進剤、顔料、カーボンブラック、カラー ペースト、沈降抑制剤、消泡剤、および/または粘着助剤を別の添加物として含 有する、請求項1記載の使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19523897A DE19523897C2 (de) | 1995-06-30 | 1995-06-30 | Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile |
DE19523897.4 | 1995-06-30 | ||
PCT/DE1996/000993 WO1997002321A1 (de) | 1995-06-30 | 1996-06-05 | Verwendung von silicon-modifizierten expoxidharzen als vergussmasse |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11508928A true JPH11508928A (ja) | 1999-08-03 |
JP4138001B2 JP4138001B2 (ja) | 2008-08-20 |
Family
ID=7765704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50468697A Expired - Fee Related JP4138001B2 (ja) | 1995-06-30 | 1996-06-05 | 電気工学または電子工学部品の注型材料としてのシリコーン変性エポキシ樹脂の使用 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5965637A (ja) |
EP (1) | EP0835287B1 (ja) |
JP (1) | JP4138001B2 (ja) |
KR (1) | KR19990028499A (ja) |
CN (1) | CN1093866C (ja) |
DE (2) | DE19523897C2 (ja) |
ES (1) | ES2152527T3 (ja) |
WO (1) | WO1997002321A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002531672A (ja) * | 1998-12-09 | 2002-09-24 | バンティコ アクチエンゲゼルシャフト | 疎水性エポキシ樹脂系 |
JP2004511641A (ja) * | 2000-10-14 | 2004-04-15 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | シリコーン変性された1成分系シールコンパウンド |
JP2020079344A (ja) * | 2018-11-12 | 2020-05-28 | 株式会社ダイセル | 硬化性組成物 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638630B4 (de) | 1996-09-20 | 2004-11-18 | Siemens Ag | UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen |
JP2002020586A (ja) * | 2000-07-05 | 2002-01-23 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
DE10057111C1 (de) * | 2000-11-16 | 2002-04-11 | Bosch Gmbh Robert | Wärmeleitfähige Vergußmasse |
JP3685253B2 (ja) * | 2001-02-23 | 2005-08-17 | 信越化学工業株式会社 | シリコーン変性エポキシ樹脂又はシリコーン変性フェノール樹脂を含有する樹脂組成物、並びにこれを用いた半導体装置 |
DE10144871A1 (de) * | 2001-09-12 | 2003-03-27 | Bosch Gmbh Robert | Vergußmasse mit hoher thermischer Stabilität |
DE10224587A1 (de) * | 2002-06-04 | 2003-12-18 | Abb Patent Gmbh | Vergußmasse |
US6800373B2 (en) * | 2002-10-07 | 2004-10-05 | General Electric Company | Epoxy resin compositions, solid state devices encapsulated therewith and method |
DE502004007350D1 (de) * | 2003-09-29 | 2008-07-24 | Bosch Gmbh Robert | Härtbares Reaktionsharzsystem |
US20070225465A1 (en) * | 2004-04-16 | 2007-09-27 | Toshiyuki Akiike | Composition for Sealing Optical Semiconductor, Optical Semiconductor Sealing Material, and Method for Producing Composition for Sealing Optical Semiconductor |
KR20100074171A (ko) * | 2007-10-08 | 2010-07-01 | 에이비비 리써치 리미티드 | 폴리머 콘크리트 전기 절연 시스템 |
WO2009109216A1 (en) * | 2008-03-03 | 2009-09-11 | Abb Research Ltd | Electrical hollow core insulator |
DE102009007392A1 (de) * | 2009-01-29 | 2010-08-05 | Siemens Aktiengesellschaft | Tränkharzsystem für Isolierstoffe in Schaltanlagen |
DE102009008464A1 (de) * | 2009-02-10 | 2010-08-12 | Siemens Aktiengesellschaft | Gießharzsystem für Isolierstoffe in Schaltanlagen |
DE102009003132A1 (de) * | 2009-05-15 | 2010-11-18 | Robert Bosch Gmbh | Kunststoffformmasse sowie Verfahren zu deren Herstellung |
JP5185890B2 (ja) * | 2009-06-17 | 2013-04-17 | 株式会社日立産機システム | 高電圧電気機器用絶縁注型樹脂及びこれを用いた高電圧電気機器 |
KR101222502B1 (ko) * | 2011-01-12 | 2013-01-29 | 정우화인 주식회사 | 충전제 분산과 결합에 유리한 실리콘-에폭시-비닐 수지 및 그의 제조 방법 |
DE102019209346A1 (de) * | 2019-06-27 | 2020-12-31 | Siemens Aktiengesellschaft | Imprägnierformulierung, Isolationsmaterial, Verfahren zum Herstellen eines Isolationsmaterials und elektrische Maschine mit einem Isolationsmaterial |
DE102020214020A1 (de) | 2020-11-09 | 2022-05-12 | Robert Bosch Gesellschaft mit beschränkter Haftung | Positionssensor und Führungswagen mit einem Positionssensor und Verfahren zur Herstellung eines Positionssensors |
TWI784356B (zh) * | 2020-11-30 | 2022-11-21 | 財團法人工業技術研究院 | 具環氧基之矽氧烷改質樹脂、封裝材料、與封裝結構 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1745545A1 (de) * | 1967-12-01 | 1969-10-02 | Vni I P Ki Elektrovozostrojeni | Verfahren zur Herstellung von Elektroisolierkoerpern und -ueberzuegen |
US3849187A (en) * | 1970-03-08 | 1974-11-19 | Dexter Corp | Encapsulant compositions for semiconductors |
DE3229558C2 (de) * | 1982-08-07 | 1984-11-08 | Robert Bosch Gmbh, 7000 Stuttgart | Imprägniervergußmasse für elektrische Bauteile |
US4560716A (en) * | 1983-08-30 | 1985-12-24 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Rust preventing epoxy resin compositions |
JPS61271319A (ja) * | 1985-05-24 | 1986-12-01 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物 |
DE3634084A1 (de) * | 1986-10-07 | 1988-04-21 | Hanse Chemie Gmbh | Modifiziertes reaktionsharz, verfahren zu seiner herstellung und seine verwendung |
JPH0617458B2 (ja) * | 1987-03-16 | 1994-03-09 | 信越化学工業株式会社 | エポキシ樹脂組成物 |
US5120803A (en) * | 1988-09-07 | 1992-06-09 | Mitsui Toatsu Chemicals, Inc. | Resin compositions for sealing semiconductor |
DE59000858D1 (de) * | 1989-01-16 | 1993-03-25 | Ciba Geigy Ag | Araliphatische sulfoniumsalze und deren verwendung. |
JPH0362844A (ja) * | 1989-02-27 | 1991-03-18 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
DE3913488C2 (de) * | 1989-04-25 | 1994-02-03 | Bosch Gmbh Robert | Vergußmasse für elektrische und elektronische Bauteile |
JP3367964B2 (ja) * | 1992-04-21 | 2003-01-20 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
JP3359410B2 (ja) * | 1994-03-04 | 2002-12-24 | 三菱電機株式会社 | 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法 |
-
1995
- 1995-06-30 DE DE19523897A patent/DE19523897C2/de not_active Expired - Lifetime
-
1996
- 1996-06-05 ES ES96915973T patent/ES2152527T3/es not_active Expired - Lifetime
- 1996-06-05 JP JP50468697A patent/JP4138001B2/ja not_active Expired - Fee Related
- 1996-06-05 CN CN96195169A patent/CN1093866C/zh not_active Expired - Lifetime
- 1996-06-05 WO PCT/DE1996/000993 patent/WO1997002321A1/de not_active Application Discontinuation
- 1996-06-05 DE DE59606048T patent/DE59606048D1/de not_active Expired - Lifetime
- 1996-06-05 EP EP96915973A patent/EP0835287B1/de not_active Expired - Lifetime
- 1996-06-05 US US09/000,405 patent/US5965637A/en not_active Expired - Lifetime
- 1996-06-05 KR KR1019970709817A patent/KR19990028499A/ko not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002531672A (ja) * | 1998-12-09 | 2002-09-24 | バンティコ アクチエンゲゼルシャフト | 疎水性エポキシ樹脂系 |
JP2004511641A (ja) * | 2000-10-14 | 2004-04-15 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | シリコーン変性された1成分系シールコンパウンド |
JP2020079344A (ja) * | 2018-11-12 | 2020-05-28 | 株式会社ダイセル | 硬化性組成物 |
Also Published As
Publication number | Publication date |
---|---|
DE19523897A1 (de) | 1997-01-02 |
EP0835287A1 (de) | 1998-04-15 |
CN1189847A (zh) | 1998-08-05 |
WO1997002321A1 (de) | 1997-01-23 |
DE19523897C2 (de) | 2002-10-24 |
ES2152527T3 (es) | 2001-02-01 |
US5965637A (en) | 1999-10-12 |
JP4138001B2 (ja) | 2008-08-20 |
DE59606048D1 (de) | 2000-11-30 |
KR19990028499A (ko) | 1999-04-15 |
CN1093866C (zh) | 2002-11-06 |
EP0835287B1 (de) | 2000-10-25 |
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