JPH11505073A - 炭化ケイ素上の酸化物層の欠陥を少なくするための方法 - Google Patents
炭化ケイ素上の酸化物層の欠陥を少なくするための方法Info
- Publication number
- JPH11505073A JPH11505073A JP9518224A JP51822497A JPH11505073A JP H11505073 A JPH11505073 A JP H11505073A JP 9518224 A JP9518224 A JP 9518224A JP 51822497 A JP51822497 A JP 51822497A JP H11505073 A JPH11505073 A JP H11505073A
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- oxide
- layer
- oxide layer
- exposing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 124
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims abstract description 65
- 230000007547 defect Effects 0.000 title description 3
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 70
- 230000003647 oxidation Effects 0.000 claims abstract description 52
- 230000001590 oxidative effect Effects 0.000 claims abstract description 41
- 239000007789 gas Substances 0.000 claims description 35
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 27
- 238000000137 annealing Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 22
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 230000002411 adverse Effects 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000012300 argon atmosphere Substances 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 238000010405 reoxidation reaction Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000011002 quantification Methods 0.000 description 2
- 238000009279 wet oxidation reaction Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- FIPWRIJSWJWJAI-UHFFFAOYSA-N Butyl carbitol 6-propylpiperonyl ether Chemical compound C1=C(CCC)C(COCCOCCOCCCC)=CC2=C1OCO2 FIPWRIJSWJWJAI-UHFFFAOYSA-N 0.000 description 1
- WTDRDQBEARUVNC-LURJTMIESA-N L-DOPA Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C(O)=C1 WTDRDQBEARUVNC-LURJTMIESA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001485 argon Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000000717 platinum sputter deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005610 quantum mechanics Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/048—Making electrodes
- H01L21/049—Conductor-insulator-semiconductor electrodes, e.g. MIS contacts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/931—Silicon carbide semiconductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. SiCがかなりの速度で酸化し始める温度未満の温度ではあるが、酸化 性ガス源の酸化物層中への拡散を可能にするよう充分に高くて、しかも炭化ケイ 素の実質的なさらなる酸化が避けられるような温度にて、酸化物層を緻密化する に足る、また酸化物層と炭化ケイ素層との間の界面を改良するに足る時間にわた って、炭化ケイ素層上の酸化物層を酸化性ガス源に暴露する工程を含む、改良さ れた酸化物層と、酸化物をベースとしたデバイスからの改良された性能とを得る 方法。 2. 酸化物と炭化ケイ素を酸化性ガス源に暴露する工程の前に、炭化ケイ素 層上に酸化物層を蒸着させるという方法、酸化物層をスパッター蒸着させるとい う方法、酸化物層をプラズマ蒸着させるという方法、およびオキシ窒化物層を生 成させるという方法、からなる群から選ばれる方法によって、炭化ケイ素層上に 酸化物層を生成させる工程をさらに含む、請求項1記載の方法。 3. 炭化ケイ素層上に酸化物層を生成させ、次いで炭化ケイ素層の炭素面を 約900〜1300℃の温度で熱酸化する工程をさらに含み、酸化物層を酸化性ガス源 に暴露する工程が、酸化物層を約600〜1000℃の温度で暴露する工程を含む、請 求項1記載の方法。 4. 炭化ケイ素層上に酸化物層を生成させ、次いで炭化ケイ素層のケイ素面 を約1000〜1400℃の温度で熱酸化する工程をさらに含み、酸化物層を酸化性ガス 源に暴露する工程が、酸化物層を約700〜1100℃の温度で暴露する工程を含む、 請求項1記載の方法。 5. 酸化物と炭化ケイ素を酸化性ガス源に暴露する工程が、炭化ケイ素エピ タキシャル層上の酸化物層または炭化ケイ素基板上の酸化物層を暴露する工程を 含む、請求項1記載の方法。 6. 酸化物と炭化ケイ素を酸化性ガス源に暴露する工程が、酸化物層または 炭化ケイ素層の化学的、物理的、または電子的特性に悪影響を及ぼさない酸素含 有ガスに酸化物と炭化ケイ素を暴露する工程、および酸化物と炭化ケイ素を約80 0〜1000℃の温度にて酸素含有ガスに暴露する工程を含む、請求項1記載の方法 。 7. 酸化物と炭化ケイ素を酸化性ガス源に暴露する工程が、酸素、水蒸気、 水蒸気中酸素、キャリヤーガス中水蒸気、窒素と酸素との化合物、およびこれら の混合物からなる群選ばれるガスに酸化物と炭化ケイ素を暴露する工程を含む、 請求項1記載の方法。 8. 炭化ケイ素層を約1050〜1100℃の温度で熱酸化して、炭化ケイ素層上に 酸化物層を生成させる工程を含み、酸化物層を暴露する工程が、酸化物層と炭化 ケイ素層を1050℃未満の温度にて酸化性ガス源に暴露する工程を含む、請求項1 記載の方法。 9. 炭化ケイ素層を熱酸化する工程が、炭化ケイ素エピタキシャル層または 炭化ケイ素基板を熱酸化する工程を含む、請求項8記載の方法。 10. 酸化物と炭化ケイ素を酸化性ガス源に暴露する工程が、酸化物と炭化水 素を約950℃の温度にて酸化性ガス源に暴露する工程を含む、請求項8記載の方 法。 11. 酸化物層と炭化ケイ素層を酸化性ガス源に暴露する工程の前に、酸化物 層をアルゴン雰囲気中でアニールする工程をさらに含む、請求項1または8に記 載の方法。 12. 炭化ケイ素基板;および 1.6×1011cm-2/eV 未満の界面状態密度を有する、炭化ケイ素基板上の酸化 物層; を含む、改良された炭化ケイ素/酸化物構造物。 13. 前記界面状態密度が1.5×1011cm-2/eV未満である、請求項12記載の炭化 ケイ素/酸化物構造物。 14. 前記界面状態密度が1.1×1011cm-2/eV未満である、請求項12記載の炭化 ケイ素/酸化物構造物。 15. 炭化ケイ素基板;および 2.5×1012cm-2未満の酸化物電荷を有する、炭化ケイ素基板上の酸化物層; を含む、改良された炭化ケイ素/酸化物構造物。 16. 前記酸化物電荷が1.5×1012cm-2未満である、請求項15記載の炭化ケイ 素/酸化物構造物。 17. 前記酸化物電荷が1.1×1012cm-2未満である、請求項15記載の炭化ケイ 素/酸化物構造物。 18. 前記炭化ケイ素層が、2H、3C、4H、6H、および15Rからなる群 から選ばれるポリタイプを有する単結晶である、請求項12または15記載の炭化ケ イ素/酸化物構造物。 19. 前記炭化ケイ素層がエピタキシャル層または基板である、請求項12また は15に記載の炭化ケイ素/酸化物構造物。 20. 前記酸化物層が主として二酸化ケイ素である、請求項12または15に記載 の炭化ケイ素/酸化物構造物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/554,319 | 1995-11-08 | ||
US08/554,319 US5972801A (en) | 1995-11-08 | 1995-11-08 | Process for reducing defects in oxide layers on silicon carbide |
US554,319 | 1995-11-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11505073A true JPH11505073A (ja) | 1999-05-11 |
JP3251017B2 JP3251017B2 (ja) | 2002-01-28 |
Family
ID=24212909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51822497A Expired - Lifetime JP3251017B2 (ja) | 1995-11-08 | 1996-10-28 | 炭化ケイ素上の酸化物層の欠陥を少なくするための方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5972801A (ja) |
EP (1) | EP0860026B1 (ja) |
JP (1) | JP3251017B2 (ja) |
KR (1) | KR100475040B1 (ja) |
AU (1) | AU7665996A (ja) |
DE (1) | DE69615390T2 (ja) |
WO (1) | WO1997017730A1 (ja) |
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- 1996-10-28 EP EP96939506A patent/EP0860026B1/en not_active Expired - Lifetime
- 1996-10-28 DE DE69615390T patent/DE69615390T2/de not_active Expired - Lifetime
- 1996-10-28 JP JP51822497A patent/JP3251017B2/ja not_active Expired - Lifetime
- 1996-10-28 KR KR10-1998-0702624A patent/KR100475040B1/ko not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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EP0860026A1 (en) | 1998-08-26 |
US5972801A (en) | 1999-10-26 |
AU7665996A (en) | 1997-05-29 |
WO1997017730A1 (en) | 1997-05-15 |
KR19990064143A (ko) | 1999-07-26 |
JP3251017B2 (ja) | 2002-01-28 |
DE69615390D1 (de) | 2001-10-25 |
KR100475040B1 (ko) | 2005-06-20 |
DE69615390T2 (de) | 2002-06-13 |
EP0860026B1 (en) | 2001-09-19 |
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