JPH11504264A - ステップアンドリピート露光の方法および装置 - Google Patents
ステップアンドリピート露光の方法および装置Info
- Publication number
- JPH11504264A JPH11504264A JP8532526A JP53252696A JPH11504264A JP H11504264 A JPH11504264 A JP H11504264A JP 8532526 A JP8532526 A JP 8532526A JP 53252696 A JP53252696 A JP 53252696A JP H11504264 A JPH11504264 A JP H11504264A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- illumination
- mask
- exposing
- patterned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.基材をパターン化された照明に露光するための装置であって、 前記基材をその上に支持するための支持手段と、 前記支持手段を移動するための移動手段と、 照明を生成するための照明手段と、 前記基材上への十分な形成を行なうために前記照明手段からの所要レベルの照 明を必要とする特徴群のパターンをその上に備えたマスクと、を具備し、 前記照明手段は、前記所要レベルの照明に達する残量の照明を余して、最初に 前記所要レベル未満の照明を提供し、後に一回以上で前記残量の照明を提供する 、 基材をパターン化された照明に露光するための装置。 2.前記照明手段はエキシマレーザ装置を具備する請求の範囲第1項に記載の 基材をパターン化された照明に露光するための装置。 3.前記エキシマレーザ装置は、 パルス化されたレーザビームを生成するためのエキシマレーザと、 前記レーザビームをガイドし、前記マスクのイメージを前記基材上に投影する ための光学系と、 を備えている請求の範囲第1項に記載の基材をパターン化された照明に露光す るための装置。 4.前記マスク上の前記パターンは、それぞれが3次元構造の断面スライスに 対応する複数の輪郭を有する請求の範囲第1項に記載の基材をパターン化された 照明に露光するための装置。 5.基材をパターン化された照明に露光するための装置であって、 基材をその上に支持するための支持手段と、 前記支持手段を移動するための移動手段と、 照明を生成するための照明手段と、 前記基材上に転写されてイメージフィールドサイズを有するイメージを形成す る特徴群のパターンをその上に備えたマスクと、を具備し、 前記移動手段は、前記照明への前記基材の各露光の間に前記基材を前記イメー ジフィールドサイズ未満の距離だけ移動させる、 基材をパターン化された照明に露光するための装置。 6.前記移動手段は前記基材を1つの特徴に等しい距離だけ移動させる請求の 範囲第5項に記載の基材をパターン化された照明に露光するための装置。 7.前記移動手段は前記基材を複数の特徴に等しい距離だけ移動させる請求の 範囲第5項に記載の基材をパターン化された照明に露光するための装置。 8.レーザ投影融蝕装置であって、 基材をその上に支持するための支持手段と、 前記支持手段を移動するための移動手段と、 パルス化されたレーザビームを放射するためのレーザと、 前記基材への十分な融蝕を行なうために前記レーザからの所要数の前記パルス 化されたレーザビームを必要とする反復特徴群のパターンをその上に備えたマス クと、 前記レーザビームをガイドし、イメージフィールドサイズを有する前記マスク のイメージを前記基材上に投影するための光学系と、を具備し、 前記レーザは、前記所要数のパルス化されたレーザビームに達する残数のパル ス化されたレーザビームを余して、最初に前記所要数未満のパルス化されたレー ザビームを提供し、後に一回以上前記残数のパルス化されたレーザビームを提供 し、前記移動手段は、前 記パルス化されたレーザビームへの前記基材の各露光の間に前記基材を前記イメ ージフィールサイズ未満の距離だけ移動させる、 レーザ投影融蝕装置。 9.パターン化された照明を用いて、特徴群によって形成される構造群を基材 上に微細加工する方法であって、 前記基材を前記パターン化された照明に露光して、イメージフィールド内で前 記構造群を部分的に露光するステップと、 前記基材を前記イメージフィールド未満の距離だけ移動させるステップと、 前記基材の所定エリアが完全に露光された構造群を有するまで前記露光および 移動ステップを反復するステップと、 を有したパターン化された照明を用いて基材上に構造群を微細加工する方法。 10.前記構造は3次元構造であり、前記特徴群のそれぞれは前記3次元構造 の断面スライスに対応する請求の範囲第9項に記載の基材上に構造群を微細加工 する方法。 11.パターン化された照明を用いて、特徴群によって形成される構造群を基 材上に微細加工する方法であって、 前記基材を前記パターン化された照明に露光して、イメージフィールド内で前 記構造群を部分的に露光するステップと、 前記基材を少なくとも1つの前記イメージフィールドの距離だけ移動させるス テップと、 前記基材の所定エリアが部分的に露光された構造群を有するまで前記露光およ び移動ステップを反復するステップと、 前記イメージフィールド内で前記基材上の前記所定エリアの複数の部分を再位 置決めするステップと、 前記パターン化された照明に前記基材上の前記所定エリアの前記 複数の部分を再露光するステップと、 前記基材上の前記所定エリアが完全に露光された構造群を有するまで前記再位 置決めおよび再露光ステップを反復するステップと、 を有した、パターン化された照明を用いて基材上に構造群を微細加工する方法 。 12.前記所定エリアを再位置決めする前記ステップは、前記所定エリアの前 記複数の部分がいずれも先の露光でそれらの複数の部分が位置決めされたときと 同一の前記イメージフィールド内の位置に確実に位置決めされないようにする請 求の範囲第11項に記載の基材上に構造群を微細加工する方法。 13.複数の部分を有するパターン化されたマスクを用いて基材を露光する方 法であって、前記基材の一エリアが前記パターン化されたマスクの前記複数の部 分の内の1つ以上の部分を通過する照明に露光されるように、露光の間に前記基 材を移動させることを有する方法。 14.パターン化されたマスクを用いて基材を露光する方法であって、 前記パターン化されたマスクの第1の部分を通過する所要レベル未満のレベル の照明に前記基材の一エリアを露光させるステップと、 前記パターン化されたマスクの第2の部分を通過する照明に前記基材の前記エ リアを再露光させるステップと、 を有したパターン化されたマスクを用いて基材を露光する方法。 15.前記基材が前記所要レベルの照明に露光されるまで、前記パターン化さ れたマスクの複数の部分を通過する照明による前記再露光ステップを反復するス テップをさらに有した請求の範囲第14項に記載のパターン化されたマスクを用 いて基材を露光する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42930295A | 1995-04-26 | 1995-04-26 | |
US08/429,302 | 1995-04-26 | ||
PCT/US1996/004322 WO1996033839A1 (en) | 1995-04-26 | 1996-03-29 | Method and apparatus for step and repeat exposures |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11504264A true JPH11504264A (ja) | 1999-04-20 |
JP4180654B2 JP4180654B2 (ja) | 2008-11-12 |
Family
ID=23702662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53252696A Expired - Lifetime JP4180654B2 (ja) | 1995-04-26 | 1996-03-29 | ステップアンドリピート露光の方法および装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6285001B1 (ja) |
EP (1) | EP0822881B1 (ja) |
JP (1) | JP4180654B2 (ja) |
KR (1) | KR19990007929A (ja) |
AU (1) | AU5325596A (ja) |
CA (1) | CA2217018C (ja) |
DE (1) | DE69637994D1 (ja) |
WO (1) | WO1996033839A1 (ja) |
Cited By (2)
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---|---|---|---|---|
JP4557242B2 (ja) * | 2000-03-14 | 2010-10-06 | 孝 西 | 露光量制御用フォトマスクおよびその製造方法 |
WO2024105861A1 (ja) * | 2022-11-17 | 2024-05-23 | 信越エンジニアリング株式会社 | アブレーション加工方法、アブレーション加工装置、基板、及び基板を製造する方法 |
Families Citing this family (118)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6555449B1 (en) | 1996-05-28 | 2003-04-29 | Trustees Of Columbia University In The City Of New York | Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication |
US7128737B1 (en) * | 1997-10-22 | 2006-10-31 | Carl Zeiss Meditec Ag | Object figuring device |
BR9910015A (pt) | 1998-04-29 | 2001-01-09 | 3M Innovative Properties Co | Meio receptor e processos de fabricação de um meio receptor e de produção de uma imagem |
JP2000294523A (ja) * | 1999-04-01 | 2000-10-20 | Sony Corp | 半導体製造装置および半導体装置の製造方法 |
DE60038400T2 (de) * | 1999-04-02 | 2009-04-23 | Murata Mfg. Co., Ltd., Nagaokakyo-shi | Laserverfahren zur Bearbeitung von Löchern nur in einer keramischen Grünfolie mit einem Trägerfilm |
US6540367B1 (en) | 1999-04-07 | 2003-04-01 | 3M Innovative Properties Company | Structured surface articles containing geometric structures with compound faces and methods for making same |
DE19915715A1 (de) * | 1999-04-08 | 2000-10-19 | Ticona Gmbh | Mikrostrukturierte Bauteile |
AU5452500A (en) | 1999-06-01 | 2000-12-18 | 3M Innovative Properties Company | Random microembossed receptor media |
EP1189757B1 (en) | 1999-06-01 | 2003-07-30 | 3M Innovative Properties Company | Optically transmissive microembossed receptor media |
US8728610B2 (en) | 2000-02-25 | 2014-05-20 | 3M Innovative Properties Company | Compound mold and structured surface articles containing geometric structures with compound faces and method of making same |
US6830993B1 (en) * | 2000-03-21 | 2004-12-14 | The Trustees Of Columbia University In The City Of New York | Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method |
US6462859B1 (en) | 2000-10-04 | 2002-10-08 | 3M Innovative Properties Company | Electromagnetically responsive particle assembly and methods and articles for manufacture and use |
EP1259985A2 (en) | 2000-10-10 | 2002-11-27 | The Trustees Of Columbia University In The City Of New York | Method and apparatus for processing thin metal layers |
WO2002042847A1 (en) * | 2000-11-27 | 2002-05-30 | The Trustees Of Columbia University In The City Of New York | Process and mask projection system for laser crystallization processing of semiconductor film regions on a substrate |
NL1016735C2 (nl) * | 2000-11-29 | 2002-05-31 | Ocu Technologies B V | Werkwijze voor het vormen van een nozzle in een orgaan voor een inkjet printkop, een nozzle-orgaan, een inkjet printkop voorzien van dit nozzle-orgaan en een inkjet printer voorzien van een dergelijke printkop. |
US20020164446A1 (en) | 2001-01-17 | 2002-11-07 | Zhiming Zhou | Pressure sensitive adhesives with a fibrous reinforcing material |
US6762124B2 (en) * | 2001-02-14 | 2004-07-13 | Avery Dennison Corporation | Method for patterning a multilayered conductor/substrate structure |
CN1330797C (zh) * | 2001-08-27 | 2007-08-08 | 纽约市哥伦比亚大学托管会 | 通过对相对于沟道区域的微结构的自觉偏移提高多晶薄膜晶体管器件之间均匀性的方法 |
US6881203B2 (en) | 2001-09-05 | 2005-04-19 | 3M Innovative Properties Company | Microneedle arrays and methods of manufacturing the same |
US6908453B2 (en) | 2002-01-15 | 2005-06-21 | 3M Innovative Properties Company | Microneedle devices and methods of manufacture |
US6821348B2 (en) * | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
US6897164B2 (en) * | 2002-02-14 | 2005-05-24 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
US20030151118A1 (en) * | 2002-02-14 | 2003-08-14 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
US6583936B1 (en) | 2002-03-11 | 2003-06-24 | Eastman Kodak Company | Patterned roller for the micro-replication of complex lenses |
WO2003084688A2 (en) * | 2002-04-01 | 2003-10-16 | The Trustees Of Columbia University In The City Of New York | Method and system for providing a thin film |
MXPA05000597A (es) | 2002-07-19 | 2005-04-28 | 3M Innovative Properties Co | Dispositivos de microaguja y aparatos de administracion por microaguja. |
KR101131040B1 (ko) * | 2002-08-19 | 2012-03-30 | 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 에지 영역을 최소화하도록 기판 상의 박막 영역을 레이저결정화 처리하는 방법 및 시스템, 그리고 그러한 박막 영역의 구조 |
KR101118974B1 (ko) * | 2002-08-19 | 2012-03-15 | 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 균일성을 제공하도록 기판 상의 박막 영역을 레이저 결정화처리하는 방법 및 시스템, 그리고 그러한 박막 영역의 구조 |
AU2003258289A1 (en) | 2002-08-19 | 2004-03-03 | The Trustees Of Columbia University In The City Of New York | A single-shot semiconductor processing system and method having various irradiation patterns |
KR101058464B1 (ko) * | 2002-08-19 | 2011-08-24 | 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 기판상의 필름영역과 그 에지영역에서의 실질적인 균일성을제공하기 위한 필름영역의 레이저 결정 가공을 위한 방법과 시스템 및 그 필름영역을 가진 구조물 |
US7030010B2 (en) * | 2002-08-29 | 2006-04-18 | Micron Technology, Inc. | Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures |
US7341928B2 (en) * | 2003-02-19 | 2008-03-11 | The Trustees Of Columbia University In The City Of New York | System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques |
US7371452B2 (en) * | 2003-04-28 | 2008-05-13 | Eastman Kodak Company | Conductive patterned sheet utilizing multi-layered conductive conduit channels |
US8062734B2 (en) * | 2003-04-28 | 2011-11-22 | Eastman Kodak Company | Article comprising conductive conduit channels |
US7138170B2 (en) * | 2003-04-28 | 2006-11-21 | Eastman Kodak Company | Terminated conductive patterned sheet utilizing conductive conduits |
US7001658B2 (en) * | 2003-04-28 | 2006-02-21 | Eastman Kodak Company | Heat selective electrically conductive polymer sheet |
US20060110580A1 (en) * | 2003-04-28 | 2006-05-25 | Aylward Peter T | Article comprising conductive conduit channels |
WO2005029546A2 (en) | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination |
US7318866B2 (en) * | 2003-09-16 | 2008-01-15 | The Trustees Of Columbia University In The City Of New York | Systems and methods for inducing crystallization of thin films using multiple optical paths |
TWI351713B (en) | 2003-09-16 | 2011-11-01 | Univ Columbia | Method and system for providing a single-scan, con |
WO2005029547A2 (en) | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | Enhancing the width of polycrystalline grains with mask |
WO2005029550A2 (en) * | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | Method and system for producing crystalline thin films with a uniform crystalline orientation |
US7164152B2 (en) | 2003-09-16 | 2007-01-16 | The Trustees Of Columbia University In The City Of New York | Laser-irradiated thin films having variable thickness |
WO2005029548A2 (en) * | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | System and process for providing multiple beam sequential lateral solidification |
TWI359441B (en) | 2003-09-16 | 2012-03-01 | Univ Columbia | Processes and systems for laser crystallization pr |
US7364952B2 (en) | 2003-09-16 | 2008-04-29 | The Trustees Of Columbia University In The City Of New York | Systems and methods for processing thin films |
WO2005034193A2 (en) | 2003-09-19 | 2005-04-14 | The Trustees Of Columbia University In The City Ofnew York | Single scan irradiation for crystallization of thin films |
US20050213914A1 (en) * | 2004-03-23 | 2005-09-29 | Motorola, Inc. | High efficiency light guide |
US7092163B2 (en) * | 2004-07-22 | 2006-08-15 | General Electric Company | Light collimating and diffusing film and system for making the film |
US7645337B2 (en) | 2004-11-18 | 2010-01-12 | The Trustees Of Columbia University In The City Of New York | Systems and methods for creating crystallographic-orientation controlled poly-silicon films |
US8221544B2 (en) | 2005-04-06 | 2012-07-17 | The Trustees Of Columbia University In The City Of New York | Line scan sequential lateral solidification of thin films |
WO2006122056A2 (en) * | 2005-05-09 | 2006-11-16 | Kids Story Book, Llc | Personalized digital sound recording |
US8278590B2 (en) * | 2005-05-27 | 2012-10-02 | Resonetics, LLC | Apparatus for minimizing a heat affected zone during laser micro-machining |
GB0518105D0 (en) * | 2005-09-06 | 2005-10-12 | Plastic Logic Ltd | Step-and-repeat laser ablation of electronic devices |
GB0511132D0 (en) * | 2005-06-01 | 2005-07-06 | Plastic Logic Ltd | Layer-selective laser ablation patterning |
JP2007054992A (ja) * | 2005-08-23 | 2007-03-08 | Sii Printek Inc | インクジェットヘッド用ノズルプレートの製造方法、インクジェットヘッド用ノズルプレートの製造装置、インクジェットヘッド用ノズルプレート、インクジェットヘッド、およびインクジェット記録装置 |
US7577396B2 (en) * | 2005-09-21 | 2009-08-18 | Oki Data Corporation | Printing apparatus |
CN101617069B (zh) | 2005-12-05 | 2012-05-23 | 纽约市哥伦比亚大学理事会 | 处理膜的***和方法以及薄膜 |
US20070235902A1 (en) * | 2006-03-31 | 2007-10-11 | 3M Innovative Properties Company | Microstructured tool and method of making same using laser ablation |
US20070231541A1 (en) * | 2006-03-31 | 2007-10-04 | 3M Innovative Properties Company | Microstructured tool and method of making same using laser ablation |
GB2438600B (en) * | 2006-05-19 | 2008-07-09 | Exitech Ltd | Method for patterning thin films on moving substrates |
GB2438601B (en) * | 2006-05-24 | 2008-04-09 | Exitech Ltd | Method and unit for micro-structuring a moving substrate |
US8262381B2 (en) * | 2006-06-22 | 2012-09-11 | Sabic Innovative Plastics Ip B.V. | Mastering tools and systems and methods for forming a cell on the mastering tools |
US7807938B2 (en) * | 2006-06-22 | 2010-10-05 | Sabic Innovative Plastics Ip B.V. | Mastering tools and systems and methods for forming a plurality of cells on the mastering tools |
US20080027199A1 (en) | 2006-07-28 | 2008-01-31 | 3M Innovative Properties Company | Shape memory polymer articles with a microstructured surface |
US7951319B2 (en) * | 2006-07-28 | 2011-05-31 | 3M Innovative Properties Company | Methods for changing the shape of a surface of a shape memory polymer article |
US7800825B2 (en) | 2006-12-04 | 2010-09-21 | 3M Innovative Properties Company | User interface including composite images that float |
KR101386173B1 (ko) * | 2007-04-26 | 2014-04-29 | 삼성디스플레이 주식회사 | 렌즈 형성용 원판 제조 방법 및 렌즈 형성용 원판을 이용한박막 트랜지스터 기판 제조 방법 |
US20080315459A1 (en) * | 2007-06-21 | 2008-12-25 | 3M Innovative Properties Company | Articles and methods for replication of microstructures and nanofeatures |
US20090114618A1 (en) * | 2007-06-21 | 2009-05-07 | 3M Innovative Properties Company | Method of making hierarchical articles |
US20090041986A1 (en) * | 2007-06-21 | 2009-02-12 | 3M Innovative Properties Company | Method of making hierarchical articles |
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TW200942935A (en) | 2007-09-21 | 2009-10-16 | Univ Columbia | Collections of laterally crystallized semiconductor islands for use in thin film transistors and systems and methods for making same |
KR20100074179A (ko) | 2007-09-25 | 2010-07-01 | 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 측방향으로 결정화된 박막상에 제조된 박막 트랜지스터 장치에 높은 균일성을 생산하기 위한 방법 |
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Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5064989B1 (en) | 1957-06-27 | 1996-10-29 | Jerome H Lemelson | Surface shaping and finishing apparatus and method |
CH572798A5 (en) * | 1974-01-14 | 1976-02-27 | Lasag Sa | Conical holes produced by laser beam - using diaphragm with apertures of different dia. and driven by stepper motor |
DE3145278C2 (de) * | 1981-11-14 | 1985-02-14 | Schott-Zwiesel-Glaswerke Ag, 8372 Zwiesel | Verfahren zum berührungslosen Abtragen von Material von der Oberfläche eines Glasgegenstandes und Vorrichtung zur Durchführung des Verfahrens |
US4508749A (en) | 1983-12-27 | 1985-04-02 | International Business Machines Corporation | Patterning of polyimide films with ultraviolet light |
US4822975A (en) * | 1984-01-30 | 1989-04-18 | Canon Kabushiki Kaisha | Method and apparatus for scanning exposure |
US5171965A (en) * | 1984-02-01 | 1992-12-15 | Canon Kabushiki Kaisha | Exposure method and apparatus |
US5262718A (en) | 1985-08-05 | 1993-11-16 | Raychem Limited | Anisotropically electrically conductive article |
US4856513A (en) | 1987-03-09 | 1989-08-15 | Summit Technology, Inc. | Laser reprofiling systems and methods |
US4752668A (en) | 1986-04-28 | 1988-06-21 | Rosenfield Michael G | System for laser removal of excess material from a semiconductor wafer |
US4842784A (en) | 1986-07-30 | 1989-06-27 | Miyama Kogyo Kabushiki Kaisha | Method of manufacturing a climbing step with embedded reflection plate |
US4786358A (en) | 1986-08-08 | 1988-11-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a pattern of a film on a substrate with a laser beam |
JPS6384789A (ja) | 1986-09-26 | 1988-04-15 | Semiconductor Energy Lab Co Ltd | 光加工方法 |
US5053171A (en) | 1986-10-14 | 1991-10-01 | Allergan, Inc. | Manufacture of ophthalmic lenses by excimer laser |
US5179262A (en) | 1986-10-14 | 1993-01-12 | Allergan, Inc. | Manufacture of ophthalmic lenses by excimer laser |
US4842782A (en) | 1986-10-14 | 1989-06-27 | Allergan, Inc. | Manufacture of ophthalmic lenses by excimer laser |
EP0400071A1 (en) | 1988-02-05 | 1990-12-05 | Raychem Limited | Laminar polymeric sheet |
JPH01245993A (ja) | 1988-03-27 | 1989-10-02 | Semiconductor Energy Lab Co Ltd | 薄膜加工装置 |
ATE110952T1 (de) * | 1988-06-09 | 1994-09-15 | Visx Inc | Vorrichtung zur laserformung der hornhaut. |
KR900702568A (ko) | 1988-09-30 | 1990-12-07 | 원본미기재 | 하이브리드 마이크로칩 접착제품 |
US4909818A (en) | 1988-11-16 | 1990-03-20 | Jones William F | System and process for making diffractive contact |
US4894115A (en) * | 1989-02-14 | 1990-01-16 | General Electric Company | Laser beam scanning method for forming via holes in polymer materials |
GB8916133D0 (en) * | 1989-07-14 | 1989-08-31 | Raychem Ltd | Laser machining |
CA2021110A1 (en) * | 1989-09-05 | 1991-03-06 | Colloptics, Inc. | Laser shaping with an area patterning mask |
US5018164A (en) | 1989-09-12 | 1991-05-21 | Hughes Aircraft Company | Excimer laser ablation method and apparatus for microcircuit fabrication |
US5066357A (en) * | 1990-01-11 | 1991-11-19 | Hewlett-Packard Company | Method for making flexible circuit card with laser-contoured vias and machined capacitors |
US5223693A (en) | 1990-04-28 | 1993-06-29 | Mitsubishi Denki Kabushiki Kaisha | Optical machining apparatus |
US5061342A (en) | 1990-05-18 | 1991-10-29 | Bausch & Lomb Incorporated | Target domain profiling of target optical surfaces using excimer laser photoablation |
US5240553A (en) | 1990-05-18 | 1993-08-31 | Bausch & Lomb Incorporated | One and two dimensional target domain profiling of target optical surfaces using excimer laser photoablation |
US5170191A (en) | 1990-05-18 | 1992-12-08 | Bausch & Lomb Incorporated | Target domain profiling of target optical surfaces using excimer laser photoablation |
NL9002036A (nl) * | 1990-09-17 | 1992-04-16 | Philips Nv | Inrichting en werkwijze voor het met elektromagnetisch straling aanbrengen van merktekens op een voorwerp, en een voorwerp voorzien van merktekens. |
US5362940A (en) * | 1990-11-09 | 1994-11-08 | Litel Instruments | Use of Fresnel zone plates for material processing |
US5160823A (en) * | 1991-01-03 | 1992-11-03 | Hutchinson Technology, Inc. | Moving mask laser imaging |
DE69210858T2 (de) | 1991-02-21 | 1996-11-28 | Hewlett Packard Co | Photoabtrageverfahren von wenigstens einer gestuften Öffnung, die ein polymeres Material durchdringt und eine Düsenplatte, die eine gestufte Öffnung aufweist |
FR2679477B1 (fr) | 1991-07-26 | 1995-11-17 | Aerospatiale | Procede de decoupe par faisceau laser d'un materiau recouvrant un substrat et dispositifs pour sa mise en óoeuvre. |
IE912667A1 (en) * | 1991-07-29 | 1993-02-10 | Trinity College Dublin | Laser Profiling of Lens Edge |
US5368900A (en) * | 1991-11-04 | 1994-11-29 | Motorola, Inc. | Multistep laser ablation method for making optical waveguide reflector |
US5208818A (en) * | 1991-12-12 | 1993-05-04 | Creo Products Inc. | Laser system for recording data patterns on a planar substrate |
FR2692067A1 (fr) * | 1992-06-05 | 1993-12-10 | Laser Int Sa | Procédé de réalisation de pièces par transformation de matière grâce à l'action de la lumière et dispositif de mise en Óoeuvre de ce procédé. |
US5514850A (en) * | 1992-06-30 | 1996-05-07 | Sharp Kabushiki Kaisha | Defect compensation method for smoothing a surface of a transparent plate with an ArF excimer laser beam |
US5257706A (en) | 1992-09-29 | 1993-11-02 | Bausch & Lomb Incorporated | Method of cleaning laser ablation debris |
JP3211525B2 (ja) | 1993-04-22 | 2001-09-25 | オムロン株式会社 | 薄材メッシュ、その製造方法及びその製造装置 |
US5461212A (en) * | 1993-06-04 | 1995-10-24 | Summit Technology, Inc. | Astigmatic laser ablation of surfaces |
WO1994029071A1 (en) * | 1993-06-11 | 1994-12-22 | Bausch & Lomb Incorporated | Method of minimizing diffraction groove formation on laser etched surfaces |
US6263096B1 (en) | 1999-06-23 | 2001-07-17 | The Board Of Trustees Of The University Of Illinois | Multilevel domain decomposition method for fast reprojection of images |
-
1996
- 1996-03-29 EP EP96909891A patent/EP0822881B1/en not_active Expired - Lifetime
- 1996-03-29 AU AU53255/96A patent/AU5325596A/en not_active Abandoned
- 1996-03-29 CA CA002217018A patent/CA2217018C/en not_active Expired - Fee Related
- 1996-03-29 DE DE69637994T patent/DE69637994D1/de not_active Expired - Lifetime
- 1996-03-29 JP JP53252696A patent/JP4180654B2/ja not_active Expired - Lifetime
- 1996-03-29 KR KR1019970707452A patent/KR19990007929A/ko not_active Application Discontinuation
- 1996-03-29 WO PCT/US1996/004322 patent/WO1996033839A1/en not_active Application Discontinuation
-
1997
- 1997-05-05 US US08/841,822 patent/US6285001B1/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4557242B2 (ja) * | 2000-03-14 | 2010-10-06 | 孝 西 | 露光量制御用フォトマスクおよびその製造方法 |
WO2024105861A1 (ja) * | 2022-11-17 | 2024-05-23 | 信越エンジニアリング株式会社 | アブレーション加工方法、アブレーション加工装置、基板、及び基板を製造する方法 |
Also Published As
Publication number | Publication date |
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EP0822881A1 (en) | 1998-02-11 |
AU5325596A (en) | 1996-11-18 |
DE69637994D1 (de) | 2009-09-24 |
JP4180654B2 (ja) | 2008-11-12 |
CA2217018A1 (en) | 1996-10-31 |
WO1996033839A1 (en) | 1996-10-31 |
EP0822881B1 (en) | 2009-08-12 |
US6285001B1 (en) | 2001-09-04 |
KR19990007929A (ko) | 1999-01-25 |
CA2217018C (en) | 2006-10-17 |
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