JPH11209727A - Insulating adhesive composition for heat-sealing connector - Google Patents
Insulating adhesive composition for heat-sealing connectorInfo
- Publication number
- JPH11209727A JPH11209727A JP1291998A JP1291998A JPH11209727A JP H11209727 A JPH11209727 A JP H11209727A JP 1291998 A JP1291998 A JP 1291998A JP 1291998 A JP1291998 A JP 1291998A JP H11209727 A JPH11209727 A JP H11209727A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- styrene
- insulating adhesive
- seal connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液晶ディスプレイ
パネル（以下、ＬＣＤという）やプラズマディスプレイ
パネル（以下、ＰＤＰという）等の表示体と、これらの
駆動回路を実装した回路基板との間の電気的接続等に利
用されるヒートシールコネクタ用絶縁性接着剤組成物に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric connection between a display such as a liquid crystal display panel (hereinafter referred to as LCD) or a plasma display panel (hereinafter referred to as PDP) and a circuit board on which these driving circuits are mounted. The present invention relates to an insulating adhesive composition for a heat seal connector used for electrical connection and the like.
【０００２】[0002]
【従来の技術】Ｊ型コネクタ等のヒートシールコネクタ
は、ＬＣＤやＰＤＰ等の表示体と、プリント基板（以
下、ＰＣＢという）やフレキシブルプリント基板（以
下、ＦＰＣという）との接続に使用されたり、あるいは
ＰＣＢとＦＰＣとの接続等に使用される。2. Description of the Related Art A heat seal connector such as a J-type connector is used to connect a display such as an LCD or PDP to a printed circuit board (hereinafter referred to as PCB) or a flexible printed circuit board (hereinafter referred to as FPC). Alternatively, it is used for connection between a PCB and an FPC.
【０００３】この種のヒートシールコネクタ１１は、図
２に示すように、可撓性基材１２の少なくとも表面（図
２では一面）に所定の導電ライン１３が導電ペーストで
スクリーン印刷されること等で設けられ、この導電ライ
ン１３の一面の接続部となるべき部位に導電性粒子１４
を絶縁性接着剤１５に分散してなる異方導電性接着剤層
１６が設けられており、導電ライン１３の表面の非接続
部には絶縁レジスト層１７が設けられている。このよう
に構成されたヒートシールコネクタ１１は、ＬＣＤ１８
の接続電極に異方導電性接着剤層１６が接着される。As shown in FIG. 2, a heat conductive connector 11 of this kind has a structure in which a predetermined conductive line 13 is screen-printed with a conductive paste on at least one surface (one surface in FIG. 2) of a flexible substrate 12. The conductive particles 14 are provided on a portion of the conductive line 13 which is to be a connection portion on one surface.
Are provided in an insulating adhesive 15 and an anisotropic conductive adhesive layer 16 is provided. An insulating resist layer 17 is provided in a non-connection portion on the surface of the conductive line 13. The heat seal connector 11 configured as described above is connected to the LCD 18.
An anisotropic conductive adhesive layer 16 is adhered to the connection electrodes of FIG.
【０００４】次に、図３は従来の他のヒートシールコネ
クタ１１を示すもので、この場合には、導電ペーストか
らなる導電ライン１３上のみに、導電性粒子１４よりも
若干大きな導電性粒子１４Ａをまぶして突出させたもの
から形成され、導電ライン１３上に絶縁性接着剤層１５
Ａが設けられて異方導電性接着剤層１６Ａを構成してい
る。FIG. 3 shows another conventional heat seal connector 11. In this case, conductive particles 14A slightly larger than conductive particles 14 are provided only on conductive lines 13 made of conductive paste. The conductive adhesive layer 15 is formed on the conductive line 13 by projecting it.
A is provided to constitute the anisotropic conductive adhesive layer 16A.
【０００５】[0005]
【発明が解決しようとする課題】従来のヒートシールコ
ネクタは、その電気的特性の信頼性が絶縁性接着剤１
５、１５Ａの特性に大きく依存する。このため、絶縁性
接着剤１５、１５Ａには長期にわたる使用環境下におい
ても接着力を維持し続けるという観点から耐熱性や耐湿
性が要求されるが、これは通常、コーティング等の方法
で導電ライン１３上に設けられるので、汎用溶剤に容易
に溶解することが望ましいものとされる。したがって、
これについては、粘着力、接着力、及び加工の容易化と
いう観点からスチレン系エラストマー、熱可塑性ポリエ
ステル、熱可塑性ポリウレタン、クロロプレン、又はア
クリロニトリルプタジエンゴム等を主成分とするものが
多い。しかしながら、これらは熱可塑性樹脂なので、耐
熱性に乏しく、高温時の電気的特性が不安定になるとい
う特徴がある。A conventional heat-seal connector has an insulating adhesive 1 whose electrical characteristics are reliable.
It greatly depends on the characteristics of 5, 15A. For this reason, the insulating adhesives 15 and 15A are required to have heat resistance and moisture resistance from the viewpoint of maintaining the adhesive force even under a long-term use environment, and this is usually performed by a method such as coating. 13, it is desirable that it be easily dissolved in a general-purpose solvent. Therefore,
In many cases, styrene-based elastomers, thermoplastic polyesters, thermoplastic polyurethanes, chloroprene, acrylonitrile butadiene rubber, or the like are used as main components from the viewpoints of adhesive strength, adhesive strength, and ease of processing. However, since these are thermoplastic resins, they are poor in heat resistance, and are characterized by unstable electrical characteristics at high temperatures.
【０００６】特に、ヒートシールコネクタ１１が夏季の
自動車内等、高温の環境下でも使用されるようになる
と、熱可塑性樹脂では耐熱性に問題が生じてくる。そこ
で、この点に鑑み、熱可塑性樹脂に代えて熱硬化性樹脂
を使用する試みが数多くなされているが、熱硬化性樹脂
は、その分子構造上、可撓性に乏しく、そのせん断接着
力が強いものの、剥離接着力が弱いという特徴がある。
また、接着剤として塗布されてから熱圧着されるまでに
硬化が進行し、熱圧着が不可能になるまでの時間制限、
いわゆるポットライフが短く、低温保存が不可欠であ
り、しかも、熱サイクルによる衝撃で接着界面が剥離し
やすいという欠点がある。[0006] In particular, when the heat seal connector 11 is used in a high temperature environment such as in an automobile in summer, the heat resistance of a thermoplastic resin causes a problem. In view of this point, many attempts have been made to use a thermosetting resin instead of a thermoplastic resin, but the thermosetting resin has poor flexibility due to its molecular structure, and its shear adhesive strength is low. Although it is strong, it has the feature that the peel adhesion is weak.
Also, the curing progresses from being applied as an adhesive to being subjected to thermocompression bonding, and the time limit until thermocompression bonding becomes impossible,
There is a drawback that the so-called pot life is short, low-temperature storage is indispensable, and the adhesive interface is easily peeled off by the impact of a thermal cycle.
【０００７】さらに、近年の電気機器の小型化に伴い、
ヒートシールコネクタ１１に要求される接続端子ピッチ
も従来の最小０．３ｍｍピッチオーダから最小０．２ｍ
ｍピッチオーダまで精細化したことから、導電性粒子の
粒径も微小化し、接着剤の塗布厚さも薄くなってきてい
る。したがって、従来のヒートシールコネクタ１１で
は、電気的接続の信頼性及び接着力に限界が生じてきて
いる。Further, with the recent miniaturization of electric equipment,
The connection terminal pitch required for the heat seal connector 11 is also 0.2 m minimum from the conventional minimum 0.3 mm pitch order.
Since the fineness has been reduced to the order of m pitches, the particle size of the conductive particles has also been reduced, and the applied thickness of the adhesive has also been reduced. Therefore, in the conventional heat seal connector 11, the reliability and the adhesive strength of the electrical connection have been limited.
【０００８】本発明は、上記従来の問題に鑑みなされた
もので、高温や熱衝撃が作用しても電気的接続を確実に
維持して高信頼性を確保し、初期接着力と接着保持力と
を強力に得ることのできるヒートシールコネクタ用絶縁
性接着剤組成物を提供することを目的としている。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and ensures high reliability by reliably maintaining electrical connection even when a high temperature or thermal shock is applied. It is an object of the present invention to provide an insulating adhesive composition for a heat-seal connector which can strongly obtain the following.
【０００９】[0009]
【課題を解決するための手段】請求項１記載の発明にお
いては、上記課題を達成するため、可撓性基材の少なく
とも一面に導電ラインを備え、この導電ラインの少なく
とも接続部に絶縁性接着剤と導電性粒子とからなる異方
導電性手段を有するヒートシールコネクタの上記絶縁性
接着剤を構成するヒートシールコネクタ用絶縁性接着剤
組成物であって、(Ａ)アクリロニトリルブタジエンゴ
ム、スチレン・ブタジエン・スチレン共重合体、スチレ
ン・エチレン・ブチレン・スチレン共重合体、スチレン
・イソプレン・スチレン共重合体から選択される一種又
は二種以上のエラストマー成分１００重量部と、(Ｂ)エ
ポキシ当量２００〜５０００から選択されたビスフェノ
ール型エポキシ樹脂１００〜２５０重量部と、(Ｃ)イミ
ダゾール系硬化剤１０〜１００重量部と、(Ｄ)ｔ−ブチ
ルフェノール、ｐ−ビニルフェノール、テルペンフェノ
ールから選択され重量平均分子量３００〜７０００であ
る一種又は二種以上のフェノール性水酸基含有成分２０
〜２００重量部とを含んでなることを特徴としている。According to the first aspect of the present invention, in order to achieve the above object, a conductive line is provided on at least one surface of a flexible base material, and an insulating adhesive is provided on at least a connection portion of the conductive line. An insulating adhesive composition for a heat-seal connector comprising the above-mentioned insulating adhesive of a heat-seal connector having an anisotropic conductive means comprising an agent and conductive particles, wherein (A) acrylonitrile butadiene rubber, styrene. 100 parts by weight of one or more elastomer components selected from butadiene / styrene copolymer, styrene / ethylene / butylene / styrene copolymer, styrene / isoprene / styrene copolymer, and (B) epoxy equivalent 200 to 100 to 250 parts by weight of a bisphenol epoxy resin selected from 5000, and (C) an imidazole-based curing agent 10 100 parts by weight, (D) t-butylphenol, p- vinylphenol, one or two or more phenolic hydroxyl group-containing component 20 is selected from the terpene phenol is the weight average molecular weight from 300 to 7,000
２００200 parts by weight.
【００１０】また、請求項２記載の発明においては、上
記課題を達成するため、可撓性基材の少なくとも一面に
導電ラインを備え、この導電ラインの少なくとも接続部
に絶縁性接着剤と導電性粒子とからなる異方導電性手段
を有するヒートシールコネクタの上記絶縁性接着剤を構
成するヒートシールコネクタ用絶縁性接着剤組成物であ
って、(Ａ)アクリロニトリルブタジエンゴム、スチレン
・ブタジエン・スチレン共重合体、スチレン・エチレン
・ブチレン・スチレン共重合体、スチレン・イソプレン
・スチレン共重合体から選択される一種又は二種以上の
エラストマー成分１００重量部と、(Ｂ)エポキシ当量２
００〜５０００のビスフェノール型エポキシ樹脂１００
〜２５０重量部と、(Ｃ)イミダゾール系硬化剤１０〜１
００重量部と、(Ｄ)ｔ−ブチルフェノール、ｐ−ビニル
フェノール、テルペンフェノールから選択され重量平均
分子量３００〜７０００である一種又は二種以上のフェ
ノール性水酸基含有成分２０〜２００重量部と、(Ｅ)Ｚ
ｎＯ、ＭｇＯ、ＣａＯ、ＴｉＯ2から選択される一種又
は二種以上の金属酸化物１〜２００重量部とを含んでな
ることを特徴としている。According to the second aspect of the present invention, in order to achieve the above object, a conductive line is provided on at least one surface of a flexible base material, and at least a connecting portion of the conductive line is provided with an insulating adhesive and a conductive line. An insulating adhesive composition for a heat-seal connector, comprising the above-mentioned insulating adhesive of a heat-seal connector having anisotropic conductive means composed of particles, wherein (A) acrylonitrile-butadiene rubber, styrene-butadiene-styrene 100 parts by weight of one or more elastomer components selected from a polymer, styrene / ethylene / butylene / styrene copolymer, styrene / isoprene / styrene copolymer, and (B) epoxy equivalent 2
Bisphenol type epoxy resin of 100 to 5000
To 250 parts by weight and (C) an imidazole-based curing agent 10 to 1
(D) 20 to 200 parts by weight of one or more phenolic hydroxyl group-containing components having a weight average molecular weight of 300 to 7000 selected from (D) t-butylphenol, p-vinylphenol and terpene phenol; ) Z
nO, MgO, CaO, is characterized in that it comprises a one or two or more metal oxides 1-200 parts by weight is selected from TiO 2.
【００１１】すなわち、本発明者は、上記課題を解決す
る方法について種種検討した結果、絶縁性接着剤につい
ては、エラストマー成分と、ビスフェノール型エポキシ
樹脂と、フェノール性水酸基含有成分とを主成分とし、
エポキシ樹脂成分を硬化すべくイミダゾール系硬化剤、
接着補強材、耐熱性フィラーとしての金属酸化物を配合
することにより、長期にわたる高温環境下で絶縁性接着
剤成分が徐々に、かつ緩やかに硬化していくことにより
接着力が増大し、この増大により電気的接続の信頼性に
ついても高温下での安定性が向上することを見いだし、
これら各成分の種類や配合比等についての鋭意研究を進
め、本発明を完成させたものである。That is, the present inventor has conducted various studies on a method for solving the above-mentioned problem, and as a result, the insulating adhesive has an elastomer component, a bisphenol-type epoxy resin, and a phenolic hydroxyl group-containing component as main components.
Imidazole-based curing agent to cure the epoxy resin component,
By blending the metal oxide as an adhesive reinforcing material and a heat-resistant filler, the insulating adhesive component gradually and slowly cures in a long-term high-temperature environment, thereby increasing the adhesive strength. Has also improved the reliability of electrical connections at high temperatures.
The present invention has been completed by intensive studies on the types and mixing ratios of these components.
【００１２】本発明に係るヒートシールコネクタ用絶縁
性接着剤組成物は、(Ａ)成分としてのエラストマー成
分、(Ｂ)成分としてのビスフェノール型エポキシ樹脂、
及び(Ｄ)成分としてのフェノール性水酸基含有成分を主
剤とするものである。(Ａ)成分のエラストマー成分とし
ては、アクリロニトリルブタジエンゴム(以下、ＮＢＲ
という)、スチレン・ブタジエン・スチレン共重合体(以
下、ＳＢＳという)、スチレン・エチレン・ブチレン・
スチレン共重合体(以下、ＳＥＢＳという)、スチレン・
イソプレン・スチレン共重合体(以下、ＳＩＳという)か
ら選択された各種（重合度、粘度、成分比率）のものが
例示されるが、これらは、その分子構造中に無水ジカル
ボン酸基、カルボン酸基等の無水有機酸基、又は有機酸
基を含むものでも良く、市販されているものを使用する
こともできる。これらのうち、特に耐熱性に優れるＮＢ
ＲやＳＥＢＳを選択することが好ましい。なお、接着性
や粘着性の観点からはＳＢＳやＳＥＢＳの方が優れてお
り、これはその１種又は２種以上を要求特性に応じ適宜
選択して使用すれば良い。The insulating adhesive composition for a heat seal connector according to the present invention comprises: an elastomer component as a component (A); a bisphenol type epoxy resin as a component (B);
And a phenolic hydroxyl group-containing component as the component (D). As the elastomer component (A), acrylonitrile butadiene rubber (hereinafter referred to as NBR)
Styrene-butadiene-styrene copolymer (hereinafter referred to as SBS), styrene-ethylene-butylene-
Styrene copolymer (hereinafter referred to as SEBS), styrene
Examples include various types (polymerization degree, viscosity, component ratio) selected from isoprene / styrene copolymer (hereinafter referred to as SIS), and these have dicarboxylic anhydride groups, carboxylic acid groups in their molecular structures. And the like containing an organic acid anhydride group or an organic acid group, and commercially available organic acid groups can also be used. Among them, NB which is particularly excellent in heat resistance
It is preferable to select R or SEBS. Note that SBS and SEBS are superior from the viewpoint of adhesiveness and tackiness, and one or more of them may be appropriately selected and used according to required characteristics.
【００１３】(Ｂ)成分のビスフェノール型エポキシ樹脂
としては、市販のものとすれば良く、例えばエピコート
８３４、１００１、１００２、１００４、１００７、１
０１０（油化シェルエポキシ製）やアデカレジンＥＰ−
４３４０、ＥＰ−５１００（旭電化製）等があげられ、
そのエポキシ当量が２００〜５０００から選択された半
固形又は固形のものが好ましい。半固形又は固形とする
のは、液状の場合、絶縁性接着剤としたときにエポキシ
分子が動きやすく、絶縁性接着剤をヒートシールコネク
タに塗布してから圧着するまでの接着可能な可使時間が
短くなるからである。また、上記数値範囲に限定するの
は、エポキシ当量が２００よりも小さいと液状になりや
すく、５０００よりも大きいと溶融温度がヒートシール
コネクタの圧着温度よりも高くなり、接着性が得られな
くなるからである。The bisphenol-type epoxy resin of the component (B) may be a commercially available one, for example, Epicoat 834, 1001, 1002, 1004, 1007, 1
010 (made of Yuka Shell Epoxy) and Adeka Resin EP-
4340, EP-5100 (made by Asahi Denka) and the like.
A semi-solid or solid epoxy equivalent selected from 200 to 5000 is preferred. The reason for semi-solid or solid is that, when it is liquid, the epoxy molecules are easy to move when used as an insulating adhesive, and the potable working time from application of the insulating adhesive to the heat seal connector to pressure bonding Is shortened. Also, limiting to the above numerical range is that if the epoxy equivalent is less than 200, it tends to be liquid, and if it is more than 5000, the melting temperature becomes higher than the pressure bonding temperature of the heat seal connector, and it becomes impossible to obtain adhesiveness. It is.
【００１４】(Ｄ)成分のフェノール性水酸基含有成分と
しては、t-butylphenol、p-vinylphenol、terpenepheno
lから選択され、その分子量が３００〜７０００であれ
ば良く、市販のものを使用することができる。数値範囲
を限定するのは、３００よりも小さいと樹脂の軟化点が
低く、耐熱性の低いものとなるし、７０００よりも大き
いと溶融温度がヒートシールコネクタの圧着温度よりも
高くなり、接着性が得られなくなるからである。よっ
て、数値は、３００〜７０００の範囲とされ、好ましく
は１０００〜４０００とされる。The phenolic hydroxyl group-containing component (D) includes t-butylphenol, p-vinylphenol and terpenepheno.
l, and the molecular weight may be 300-7000, and commercially available ones can be used. If the numerical value range is limited, if it is smaller than 300, the softening point of the resin is low and the heat resistance is low. If it is larger than 7000, the melting temperature is higher than the crimping temperature of the heat seal connector, and the adhesiveness is low. Is no longer obtained. Therefore, the numerical value is in the range of 300 to 7000, and preferably 1000 to 4000.
【００１５】(Ａ)成分のエラストマー成分１００重量部
に対する(Ｂ)成分のビスフェノール型エポキシ樹脂の配
合量は、１００〜２５０重量部とされるが、これは１０
０重量部よりも小さいと絶縁性接着剤としての接着力が
減少するとともに、耐熱性が劣化し、２５０重量部より
も多いと可撓性が悪化し、剥離強度が小さくなるからで
ある。また、(Ｄ)成分のフェノール性水酸基含有成分の
配合量は、２０〜２００重量部とすることが好ましい。
２０重量部よりも少ないと初期接着力が小さく、２００
重量部よりも多いと可撓性の減少や耐湿性の悪化を招く
からである。The amount of the bisphenol type epoxy resin (B) is 100 to 250 parts by weight, based on 100 parts by weight of the elastomer component (A).
If the amount is less than 0 parts by weight, the adhesive strength as an insulating adhesive decreases, and the heat resistance deteriorates. If the amount is more than 250 parts by weight, flexibility deteriorates and peel strength decreases. The blending amount of the phenolic hydroxyl group-containing component (D) is preferably 20 to 200 parts by weight.
If the amount is less than 20 parts by weight, the initial adhesive strength is small, and
If the amount is more than the weight part, the flexibility is reduced and the moisture resistance is deteriorated.
【００１６】(Ｂ)成分のエポキシ樹脂を硬化させる(Ｃ)
成分のイミダゾール系硬化剤１０〜１００重量部として
は、2-メチルイミタ゛ソ゛ール（2-metylimidazol）、2-ウンテ゛シルイミタ゛ソ
゛ール（2-undecylimidazol）、2-ヘフ゜タテ゛シルイミタ゛ソ゛ール（2-hep
tadecylimidazol）、2-エチル、4-メチルイミタ゛ソ゛ール（2-ethyl-4-m
ethylimidazol）、2-フェニルイミタ゛ソ゛ール（2-phenylimidazol）
等があげられ、その配合量は(Ａ)成分１００重量部に対
して１０〜１００重量部が望ましい。数値範囲を限定す
るのは、１０重量部よりも少ないと硬化が十分に進行し
ない場合があり、１００重量部よりも多いとポットライ
フが短くなり、取り扱いが困難になるからである。Curing the epoxy resin (B) (C)
10 to 100 parts by weight of the imidazole-based curing agent as a component include 2-methylimidazole (2-metylimidazol), 2-undecylimidazol, and 2-heptydiimidazole (2-hepta).
tadecylimidazol), 2-ethyl, 4-methylimidazole (2-ethyl-4-m
ethylimidazol), 2-phenylimidazol
The amount is preferably 10 to 100 parts by weight based on 100 parts by weight of the component (A). The reason for limiting the numerical range is that if it is less than 10 parts by weight, curing may not proceed sufficiently, and if it is more than 100 parts by weight, the pot life is shortened and handling becomes difficult.
【００１７】請求項２における(Ｅ)成分としての金属酸
化物は、接着補強材としての役割を果たすとともに、無
機化合物として有機化合物である絶縁性接着剤の耐熱性
を向上させるものである。これはＺｎＯ、ＭｇＯ、Ｃａ
Ｏ、ＴｉＯ2から選択される一種又は二種以上の金属酸
化物からなり、その配合量は(Ａ)成分１００重量部に対
して１〜２００重量部とされる。１重量部未満であると
上記効果を期待することができず、２００重量部よりも
多いと接着力が低下し、接着剤の低下や絶縁性接着剤の
母材強度の低下を招くからである。The metal oxide as the component (E) in claim 2 serves as an adhesive reinforcing material and improves the heat resistance of the insulating adhesive which is an organic compound as an inorganic compound. This is ZnO, MgO, Ca
O, made one or two or more metal oxides selected from TiO 2, the amount thereof are 1 to 200 weight parts per 100 weight parts component (A). If the amount is less than 1 part by weight, the above effect cannot be expected. If the amount is more than 200 parts by weight, the adhesive strength is reduced, and the adhesive and the base material of the insulating adhesive are reduced. .
【００１８】本発明に係るヒートシールコネクタ用絶縁
性接着剤組成物は、異方導電性手段としてこれに導電性
粒子を分散させて異方導電性接着剤（図２における１６
参照）として使用することができる。この導電性粒子１
４としては、例えば金、銀、銅、ニッケル、パラジウ
ム、ステンレス、真鍮、若しくは半田等の金属粒子、タ
ングステンカーバイト、シリカカーバイト等のセラミッ
ク粒子、カーボン粒子、又は表面を金属被覆したプラス
チック粒子、あるいはこれらの組み合わせ等があげられ
る。導電性粒子は、その配合量が少なすぎると導通不良
を起こしやすく、多すぎると絶縁不良を起こしやすいの
で、上記絶縁性接着剤組成物１００容量部に対して０．
０１〜５０重量部、好ましくは１〜１０重量部とすると
良い。The insulating adhesive composition for a heat seal connector according to the present invention is obtained by dispersing conductive particles into anisotropic conductive means (16 in FIG. 2).
Reference). This conductive particle 1
As 4, metal particles such as gold, silver, copper, nickel, palladium, stainless steel, brass, or solder, ceramic particles such as tungsten carbide and silica carbide, carbon particles, or plastic particles whose surface is metal-coated, Alternatively, a combination thereof may be used. If the amount of the conductive particles is too small, poor conduction is likely to occur, and if the amount is too high, poor insulation is likely to occur.
It is good to be 01 to 50 parts by weight, preferably 1 to 10 parts by weight.
【００１９】本発明に係るヒートシールコネクタ用絶縁
性接着剤組成物には、上記材料の他に粘着付与剤、各種
カップリング剤、老化防止剤、着色剤、又は紫外線吸収
剤等を適宜添加しても良い。なお、異方導電性手段とし
て図３のように使用する場合には、導電ライン１３上に
設けられた接着剤組成物層中に導電性粒子が埋置して含
まれるようにすることが必要である。この場合の導電性
粒子１４Ａは、上記異方導電性接着剤に使用したものと
同様のものとすれば良いが、配合量が少なすぎると導通
不良を起こしやすく、多すぎると導電ラインの形成が困
難になるので、導電ラインを形成すべき導電ペースト固
形部１００容量部に対して０．０１〜５０重量部、好ま
しくは１〜１０重量部とすると良い。The insulating adhesive composition for a heat-seal connector according to the present invention may optionally contain a tackifier, various coupling agents, an antioxidant, a coloring agent, or an ultraviolet absorber in addition to the above-mentioned materials. May be. When used as the anisotropic conductive means as shown in FIG. 3, it is necessary that the conductive particles are embedded and included in the adhesive composition layer provided on the conductive line 13. It is. The conductive particles 14A in this case may be the same as those used for the anisotropic conductive adhesive. However, if the amount is too small, poor conduction tends to occur, and if the amount is too large, the formation of conductive lines may occur. Since it becomes difficult, the amount is preferably 0.01 to 50 parts by weight, and more preferably 1 to 10 parts by weight with respect to 100 parts by volume of the conductive paste solid portion on which the conductive line is to be formed.
【００２０】なお、ヒートシールコネクタ用絶縁性接着
剤組成物は、使用に際しては溶剤に溶解して溶液とし、
これを適宜のコート法や印刷法でヒートシールコネクタ
の所定の位置に塗布すれば良い。溶剤としては、エステ
ル系、ケトン系、エーテルエステル系、エーテル系、ア
ルコール系、又は炭化水素系の溶剤、例えば酢酸エチ
ル、メチルエチルケトン、酢酸ブチルセロソルブ、酢酸
エチルカルピトール、ジイソアミルエーテル、シクロヘ
キサノール、石油スピリット、若しくはトルエン等が使
用される。When used, the insulating adhesive composition for a heat seal connector is dissolved in a solvent to form a solution.
This may be applied to a predetermined position of the heat seal connector by an appropriate coating method or printing method. Examples of the solvent include ester, ketone, ether ester, ether, alcohol, and hydrocarbon solvents such as ethyl acetate, methyl ethyl ketone, butyl cellosolve acetate, ethyl carbitol acetate, diisoamyl ether, cyclohexanol, and petroleum spirit. Or toluene is used.
【００２１】[0021]
【発明の実施の形態】以下、図面を参照して本発明に係
るヒートシールコネクタ用絶縁性接着剤組成物を使用し
たヒートシールコネクタの実施形態を説明する。図１
中、１はヒートシールコネクタで、このヒートシールコ
ネクタ１は、厚さ１０μｍ〜１００μｍのポリエステル
やポリイミド等からなる断面視帯形の可撓性基材２を備
え、この可撓性基材２の表面には導電ペーストが印刷さ
れて導電ライン３が設けられ、この導電ライン３の表面
の接続部に導電性粒子４を含有した絶縁性接着剤５から
なる異方導電性接着剤層６が積層塗布されており、他の
部分には絶縁レジスト層７が積層して設けられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a heat seal connector using an insulating adhesive composition for a heat seal connector according to the present invention will be described with reference to the drawings. FIG.
In the figure, reference numeral 1 denotes a heat seal connector. The heat seal connector 1 includes a flexible base material 2 having a thickness of 10 μm to 100 μm and having a band-shaped cross section made of polyester, polyimide, or the like. A conductive paste is printed on the surface to provide conductive lines 3, and an anisotropic conductive adhesive layer 6 made of an insulating adhesive 5 containing conductive particles 4 is laminated on a connection portion on the surface of the conductive line 3. It is applied, and an insulating resist layer 7 is provided on other portions in a laminated manner.
【００２２】導電ライン３は、有機バインダに０．０１
μｍ〜１０μｍ程度の粒径を有する銀粉、銅粉、カーボ
ンブラック、又はグラファイト等の導電性付与剤を混合
した導電ペーストがスクリーン印刷等で形成されること
により構成される。また、これ以外でも周知の構造の導
電ライン３を使用することができる。構成としては、可
撓性基材２の片表面のみに形成することが多いが、例え
ばスルーホールにより可撓性基材の両面に導電ライン３
を形成する場合もある。The conductive line 3 is formed by adding 0.01% to the organic binder.
The conductive paste is formed by screen printing or the like in which a conductive paste mixed with a conductive agent such as silver powder, copper powder, carbon black, or graphite having a particle size of about 10 μm to 10 μm is formed. Other than this, a conductive line 3 having a known structure can be used. As a configuration, it is often formed only on one surface of the flexible base material 2.
May be formed.
【００２３】絶縁レジスト層７としては、ポリアミド系
やポリエステル系等の合成樹脂、各種の合成ゴム類、又
はその混合物をベースに、必要に応じて硬化剤、加流
剤、又は劣化防止剤等の添加物を加えたものを上記溶剤
に溶解し、スクリーン印刷等により形成したものが使用
される。また、ポリエステルや塩化ビニル等のフィルム
にアクリル系樹脂等の粘着剤が塗布され、これを貼付し
たものがあげられる。これらは、必要とされる絶縁性、
表面保護性、及び又はコスト等の兼ね合いにより選択さ
れる。The insulating resist layer 7 is made of a synthetic resin such as polyamide or polyester, various kinds of synthetic rubbers, or a mixture thereof, and optionally contains a curing agent, a flowing agent, or a deterioration preventing agent. A solution obtained by dissolving the additive in the above solvent and forming the solution by screen printing or the like is used. In addition, there may be mentioned a film in which an adhesive such as an acrylic resin is applied to a film of polyester or vinyl chloride and the film is adhered thereto. These are the required insulation,
It is selected in consideration of surface protection properties and / or cost.
【００２４】[0024]
【実施例】以下、本発明に係るヒートシールコネクタ用
絶縁性接着剤組成物の実施例を説明する。 実施例１． (1) 絶縁性接着剤溶液の製作 ＮＢＲ１００重量部、エポキシ当量８００〜１１００の
ビスフェノール型エポキシ樹脂１５０重量部、重量平均
分子量７００のt-butylphenol １００重量部、2-metyl
imidazol ２０重量部に、シクロヘキサノン３００重量
部を加えてこれを溶解した。 (２) 異方導電性接着剤の製作 製作した上記絶縁性接着剤溶液の固形分１００重量部に
粒径１０μｍの表面を金めっきしたアクリル樹脂粒子を
１０容量部加え、異方導電性接着剤を製作した。EXAMPLES Hereinafter, examples of the insulating adhesive composition for a heat seal connector according to the present invention will be described. Embodiment 1 FIG. (1) Preparation of insulating adhesive solution 100 parts by weight of NBR, 150 parts by weight of bisphenol type epoxy resin having an epoxy equivalent of 800 to 1100, 100 parts by weight of t-butylphenol having a weight average molecular weight of 700, 2-metyl
To 20 parts by weight of imidazol, 300 parts by weight of cyclohexanone was added and dissolved. (2) Production of anisotropic conductive adhesive Anisotropic conductive adhesive was prepared by adding 10 parts by volume of acrylic resin particles having a 10 μm particle size to the surface thereof to 100 parts by weight of the solid content of the insulating adhesive solution thus prepared. Was made.
【００２５】(３) ヒートシールコネクタの製作 厚さ２５μｍのＰＥＴフィルムからなる可撓性基材の表
面に市販の銀ペースト(DW-250H-5、東洋紡績製)をスクリ
ーン印刷して０．２ｍｍピッチの導電ラインを形成し、
１３０℃のオーブンで５時間乾燥させて硬化させた。そ
して、溶媒の除去後の厚さが９μｍとなるようその接続
部に上記異方導電性接着剤をスクリーン印刷で塗布して
異方導電性接着剤層を形成し、残りの部位には市販の絶
縁レジスト(JEH-112、日本アチソン製)を設け、これを所望の
寸法に切断してヒートシールコネクタを製作した。(3) Production of heat seal connector A commercially available silver paste (DW-250H-5, manufactured by Toyobo Co., Ltd.) was screen-printed on the surface of a flexible substrate made of a PET film having a thickness of 25 μm by 0.2 mm. Forming conductive lines of pitch,
It was dried and cured in an oven at 130 ° C. for 5 hours. Then, the anisotropic conductive adhesive is applied to the connection portion by screen printing so that the thickness after removing the solvent is 9 μm to form an anisotropic conductive adhesive layer. An insulating resist (JEH-112, manufactured by Acheson Japan) was provided and cut into desired dimensions to produce a heat seal connector.
【００２６】次いで、製作したヒートシールコネクタを
面積抵抗率５０Ω／□の透明導電酸化膜基板(ＩＴＯ)の
接続端子とＦＰＣとの間に１６０℃、３０ｋｇ、１２秒
の条件で熱圧着し、高温１１０℃〜低温−２０℃の環境
試験を行い、両側接続端子間の抵抗値と、９０°剥離強
度とを測定したところ、表１に示した通りの結果が得ら
れた。Next, the heat-sealed connector was thermocompression-bonded between a connection terminal of a transparent conductive oxide film substrate (ITO) having an area resistivity of 50 Ω / □ and an FPC at 160 ° C., 30 kg, for 12 seconds. An environmental test was performed at 110 ° C. to a low temperature of −20 ° C., and the resistance value between the both-side connection terminals and the 90 ° peel strength were measured. The results shown in Table 1 were obtained.
【００２７】実施例２． (1) 絶縁性接着剤溶液の製作 ＮＢＲ１００重量部、エポキシ当量１５００〜２３００
のビスフェノール型エポキシ樹脂１５０重量部、重量平
均分子量２０００のp-vinylphenol １００重量部、2-m
etylimidazol ２０重量部、Ｔｉｏ2５０重量部に、シ
クロヘキサノン３００重量部を加えてこれを溶解した。
(1)以外は実施例１と同様にしてヒートシールコネクタ
を製作し、環境試験を行ったところ、表１の結果を得
た。Embodiment 2 FIG. (1) Production of insulating adhesive solution NBR 100 parts by weight, epoxy equivalent 1500-2300
150 parts by weight of bisphenol type epoxy resin, 100 parts by weight of p-vinylphenol having a weight average molecular weight of 2000, 2-m
To 20 parts by weight of etylimidazol and 50 parts by weight of TiO 2 , 300 parts by weight of cyclohexanone was added and dissolved.
Except for (1), a heat-seal connector was manufactured in the same manner as in Example 1, and an environmental test was performed. The results in Table 1 were obtained.
【００２８】実施例３． (1) 絶縁性接着剤溶液の製作 カルボキシル基変性ＮＢＲ ５０重量部、ＳＥＢＳ５０
重量部、エポキシ当量１５００〜２３００のビスフェノ
ール型エポキシ樹脂１５０重量部、重量平均分子量７０
０のt-butylphenol １００重量部、2-undecylimidazol
２０重量部、ＭｇＯ２０重量部に、シクロヘキサノン
３００重量部を加えてこれを溶解した。(1)以外は実施
例１と同様にしてヒートシールコネクタを製作し、環境
試験を行ったところ、表１の結果を得た。Embodiment 3 FIG. (1) Production of insulating adhesive solution Carboxyl group-modified NBR 50 parts by weight, SEBS50
Parts by weight, 150 parts by weight of a bisphenol-type epoxy resin having an epoxy equivalent of 1500 to 2300, and a weight average molecular weight of 70
100 parts by weight of 0 t-butylphenol, 2-undecylimidazol
To 20 parts by weight of MgO and 20 parts by weight of MgO, 300 parts by weight of cyclohexanone was added and dissolved. Except for (1), a heat-seal connector was manufactured in the same manner as in Example 1, and an environmental test was performed. The results in Table 1 were obtained.
【００２９】比較例１． (1) 絶縁性接着剤溶液の製作 ＮＢＲ１００重量部、エポキシ当量１６０〜１７０のビ
スフェノール型エポキシ樹脂１５０重量部、重量平均分
子量７００のt-butylphenol １００重量部、2-undecyl
imidazol ２０重量部に、シクロヘキサノン３００重量
部を加えてこれを溶解した。(1)以外は実施例１と同様
にしてヒートシールコネクタを製作し、環境試験を行
い、表１の結果を得た。Comparative Example 1 (1) Preparation of insulating adhesive solution 100 parts by weight of NBR, 150 parts by weight of bisphenol type epoxy resin having an epoxy equivalent of 160 to 170, 100 parts by weight of t-butylphenol having a weight average molecular weight of 700, 2-undecyl
To 20 parts by weight of imidazol, 300 parts by weight of cyclohexanone was added and dissolved. Except for (1), a heat seal connector was manufactured in the same manner as in Example 1, and an environmental test was performed. The results in Table 1 were obtained.
【００３０】比較例２． (1) 絶縁性接着剤溶液の製作 ＮＢＲ１００重量部、エポキシ当量５０００〜５５００
のビスフェノール型エポキシ樹脂１５０重量部、重量平
均分子量７００のt-butylphenol １００重量部、2-und
ecylimidazol ２０重量部、ＭｇＯ２０重量部に、シク
ロヘキサノン３００重量部を加えてこれを溶解した。
(1)以外は実施例１と同様にしてヒートシールコネクタ
を製作し、環境試験を行い、表１の結果を得た。Comparative Example 2 (1) Production of insulating adhesive solution NBR 100 parts by weight, epoxy equivalent 5000 to 5500
150 parts by weight of bisphenol type epoxy resin, 100 parts by weight of t-butylphenol having a weight average molecular weight of 700, 2-und
To 20 parts by weight of ecylimidazol and 20 parts by weight of MgO, 300 parts by weight of cyclohexanone was added and dissolved.
Except for (1), a heat seal connector was manufactured in the same manner as in Example 1, and an environmental test was performed. The results in Table 1 were obtained.
【００３１】比較例３． (1) 絶縁性接着剤溶液の製作 ＮＢＲ１００重量部、エポキシ当量１５００〜２３００
のビスフェノール型エポキシ樹脂１５０重量部、重量平
均分子量９０００のp-vinylphenol １００重量部、2-m
ethylimidazol ２０重量部、ＭｇＯ２０重量部に、シ
クロヘキサノン３００重量部を加えてこれを溶解した。
(1)以外は実施例１と同様にしてヒートシールコネクタ
を製作し、環境試験を行い、表１の結果を得た。Comparative Example 3 (1) Production of insulating adhesive solution NBR 100 parts by weight, epoxy equivalent 1500-2300
150 parts by weight of bisphenol type epoxy resin, 100 parts by weight of p-vinylphenol having a weight average molecular weight of 9000, 2-m
To 20 parts by weight of ethylimidazol and 20 parts by weight of MgO, 300 parts by weight of cyclohexanone was added and dissolved.
Except for (1), a heat seal connector was manufactured in the same manner as in Example 1, and an environmental test was performed. The results in Table 1 were obtained.
【００３２】比較例４． (1) 絶縁性接着剤溶液の製作 ＮＢＲ１００重量部、エポキシ当量１５００〜２３００
のビスフェノール型エポキシ樹脂１５０重量部、重量平
均分子量７００のt-butylphenol １００重量部、2-und
ecylimidazol ２０重量部、ＭｇＯ２０重量部に、シク
ロヘキサノン３００重量部を加えてこれを溶解した。
(1)以外は実施例１と同様にしてヒートシールコネクタ
を製作し、環境試験を行い、表１の結果を得た。Comparative Example 4 (1) Production of insulating adhesive solution NBR 100 parts by weight, epoxy equivalent 1500-2300
150 parts by weight of bisphenol type epoxy resin, 100 parts by weight of t-butylphenol having a weight average molecular weight of 700, 2-und
To 20 parts by weight of ecylimidazol and 20 parts by weight of MgO, 300 parts by weight of cyclohexanone was added and dissolved.
Except for (1), a heat seal connector was manufactured in the same manner as in Example 1, and an environmental test was performed. The results in Table 1 were obtained.
【００３３】比較例５． (1) 絶縁性接着剤溶液の製作 カルボキシル基変性ＮＢＲ５０重量部、ＳＥＢＳ５０重
量部、エポキシ当量１５００〜２３００のビスフェノー
ル型エポキシ樹脂１５０重量部、重量平均分子量７００
のt-butylphenol １００重量部、2-undecylimidazol
２重量部、ＭｇＯ２０重量部に、シクロヘキサノン３０
０重量部を加えてこれを溶解した。(1)以外は実施例１
と同様にしてヒートシールコネクタを製作し、環境試験
を行い、表１の結果を得た。Comparative Example 5 (1) Production of insulating adhesive solution 50 parts by weight of carboxyl group-modified NBR, 50 parts by weight of SEBS, 150 parts by weight of bisphenol type epoxy resin having an epoxy equivalent of 1500 to 2300, weight average molecular weight 700
100 parts by weight of t-butylphenol, 2-undecylimidazol
2 parts by weight, 20 parts by weight of MgO, 30 parts of cyclohexanone
This was dissolved by adding 0 parts by weight. Example 1 except for (1)
A heat seal connector was manufactured in the same manner as described above, and an environmental test was performed. The results shown in Table 1 were obtained.
【００３４】比較例６． (1) 絶縁性接着剤溶液の製作 カルボキシル基変性ＮＢＲ５０重量部、ＳＥＢＳ５０重
量部、エポキシ当量１５００〜２３００のビスフェノー
ル型エポキシ樹脂１５０重量部、重量平均分子量７００
のt-butylphenol １００重量部、2-undecylimidazol
２重量部、ＭｇＯ２０重量部に、シクロヘキサノン４０
０重量部を加えてこれを溶解した。(1)以外は実施例１
と同様にしてヒートシールコネクタを製作し、環境試験
を行い、表１の結果を得た。Comparative Example 6 (1) Production of insulating adhesive solution 50 parts by weight of carboxyl group-modified NBR, 50 parts by weight of SEBS, 150 parts by weight of bisphenol type epoxy resin having an epoxy equivalent of 1500 to 2300, weight average molecular weight 700
100 parts by weight of t-butylphenol, 2-undecylimidazol
2 parts by weight, 20 parts by weight of MgO, 40 parts of cyclohexanone
This was dissolved by adding 0 parts by weight. Example 1 except for (1)
A heat seal connector was manufactured in the same manner as described above, and an environmental test was performed. The results shown in Table 1 were obtained.
【００３５】[0035]
【表１】 [Table 1]
【００３６】[0036]
【発明の効果】以上のように請求項１記載の発明によれ
ば、(Ａ)エラストマー成分、(Ｂ)ビスフェノール型エポ
キシ樹脂、及び(Ｄ)フェノール性水酸基含有成分を主成
分とするので、(Ａ)エラストマー成分が(Ｂ)ビスフェノ
ール型エポキシ樹脂の可撓性を向上させて耐熱衝撃性を
向上させる。また、(Ｂ)ビスフェノール型エポキシ樹脂
成分も(Ｃ)イミダゾール系硬化剤により硬化して耐熱性
に優れた樹脂となる。また、(Ｂ)ビスフェノール型エポ
キシ樹脂は、(Ｄ)フェノール性水酸基含有成分と反応し
て硬化が進むが、液状ではないので、反応性が低く、長
いポットライフを維持しながら高温耐久性に優れたもの
になる。As described above, according to the first aspect of the present invention, (A) an elastomer component, (B) a bisphenol-type epoxy resin, and (D) a phenolic hydroxyl group-containing component are used as main components. A) The elastomer component improves the flexibility of the bisphenol-type epoxy resin (B) and improves the thermal shock resistance. Further, the bisphenol-type epoxy resin component (B) is cured by the imidazole-based curing agent (C) to become a resin having excellent heat resistance. In addition, (B) bisphenol-type epoxy resin reacts with (D) phenolic hydroxyl group-containing component and cures. However, since it is not liquid, it has low reactivity and excellent high-temperature durability while maintaining a long pot life. It becomes something.
【００３７】また、(Ｄ)フェノール性水酸基含有成分
は、その分子中の水酸基により初期接着力を向上させる
よう機能し、(Ｂ)ビスフェノール型エポキシ樹脂との反
応後にも水酸基が発生するため、接着力の低下がない。
また、(Ｂ)ビスフェノール型エポキシ樹脂は、ＬＣＤ表
面のＩＴＯ（酸化インジウム錫透明導電膜、Indium Tin
Oxide）やＦＰＣ表面の金属との接着性が良好で、接着
力が環境試験時間の増加とともに、増大していくという
効果がある。Further, (D) the phenolic hydroxyl group-containing component functions to improve the initial adhesive strength by the hydroxyl groups in the molecule, and (B) hydroxyl groups are generated even after the reaction with the bisphenol type epoxy resin. There is no power drop.
Further, (B) bisphenol type epoxy resin is made of ITO (indium tin oxide transparent conductive film, Indium Tin oxide
Oxide) and the metal on the surface of the FPC are good in adhesion, and there is an effect that the adhesive strength increases as the environmental test time increases.
【００３８】さらに、請求項２記載の発明によれば、上
記効果の他に、(Ｅ)成分としての金属酸化物が接着剤の
母材強度を強化し、剥離強度を向上させるとともに、無
機物として接着剤の耐熱性をも向上させる。Further, according to the second aspect of the present invention, in addition to the above effects, the metal oxide as the component (E) enhances the base material strength of the adhesive and improves the peel strength, and at the same time, as an inorganic substance. It also improves the heat resistance of the adhesive.
【図１】本発明に係るヒートシールコネクタ用絶縁性接
着剤組成物が適用されるヒートシールコネクタの実施形
態を示す縦断面説明図である。FIG. 1 is an explanatory longitudinal sectional view showing an embodiment of a heat seal connector to which an insulating adhesive composition for a heat seal connector according to the present invention is applied.
【図２】従来のヒートシールコネクタを示す縦断面説明
図である。FIG. 2 is an explanatory longitudinal sectional view showing a conventional heat seal connector.
【図３】従来の他のヒートシールコネクタを示す縦断面
説明図である。FIG. 3 is an explanatory longitudinal sectional view showing another conventional heat seal connector.
１ ヒートシールコネクタ ２ 可撓性基材 ３ 導電ライン ４ 導電性粒子 ５ 絶縁性接着剤 ６ 異方導電性接着剤層（異方導電性手段） ７ 絶縁レジスト層 １８ ＬＣＤ DESCRIPTION OF SYMBOLS 1 Heat seal connector 2 Flexible base material 3 Conductive line 4 Conductive particle 5 Insulating adhesive 6 Anisotropic conductive adhesive layer (anisotropic conductive means) 7 Insulating resist layer 18 LCD
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ // Ｃ０８Ｇ 59/50 Ｃ０８Ｇ 59/50 59/62 59/62 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI // C08G 59/50 C08G 59/50 59/62 59/62
Claims (2)
ンを備え、この導電ラインの少なくとも接続部に絶縁性
接着剤と導電性粒子とからなる異方導電性手段を有する
ヒートシールコネクタの上記絶縁性接着剤を構成するヒ
ートシールコネクタ用絶縁性接着剤組成物であって、 (Ａ)アクリロニトリルブタジエンゴム、スチレン・ブタ
ジエン・スチレン共重合体、スチレン・エチレン・ブチ
レン・スチレン共重合体、スチレン・イソプレン・スチ
レン共重合体から選択される一種又は二種以上のエラス
トマー成分１００重量部と、(Ｂ)エポキシ当量２００〜
５０００から選択されたビスフェノール型エポキシ樹脂
１００〜２５０重量部と、(Ｃ)イミダゾール系硬化剤１
０〜１００重量部と、(Ｄ)ｔ−ブチルフェノール、ｐ−
ビニルフェノール、テルペンフェノールから選択され重
量平均分子量３００〜７０００である一種又は二種以上
のフェノール性水酸基含有成分２０〜２００重量部とを
含んでなることを特徴とするヒートシールコネクタ用絶
縁性接着剤組成物。1. A heat seal connector according to claim 1, further comprising a conductive line on at least one surface of the flexible base material, wherein at least a connection portion of the conductive line has an anisotropic conductive means comprising an insulating adhesive and conductive particles. An insulating adhesive composition for a heat seal connector constituting an insulating adhesive, comprising: (A) acrylonitrile butadiene rubber, styrene / butadiene / styrene copolymer, styrene / ethylene / butylene / styrene copolymer, styrene / 100 parts by weight of one or more elastomer components selected from isoprene / styrene copolymers, and (B) an epoxy equivalent of 200 to
100 to 250 parts by weight of a bisphenol-type epoxy resin selected from 5000, and (C) an imidazole-based curing agent 1
0 to 100 parts by weight, (D) t-butylphenol, p-
An insulating adhesive for a heat seal connector, comprising 20 to 200 parts by weight of one or more phenolic hydroxyl group-containing components selected from vinyl phenol and terpene phenol and having a weight average molecular weight of 300 to 7000. Composition.
ンを備え、この導電ラインの少なくとも接続部に絶縁性
接着剤と導電性粒子とからなる異方導電性手段を有する
ヒートシールコネクタの上記絶縁性接着剤を構成するヒ
ートシールコネクタ用絶縁性接着剤組成物であって、 (Ａ)アクリロニトリルブタジエンゴム、スチレン・ブタ
ジエン・スチレン共重合体、スチレン・エチレン・ブチ
レン・スチレン共重合体、スチレン・イソプレン・スチ
レン共重合体から選択される一種又は二種以上のエラス
トマー成分１００重量部と、(Ｂ)エポキシ当量２００〜
５０００のビスフェノール型エポキシ樹脂１００〜２５
０重量部と、(Ｃ)イミダゾール系硬化剤１０〜１００重
量部と、(Ｄ)ｔ−ブチルフェノール、ｐ−ビニルフェノ
ール、テルペンフェノールから選択され重量平均分子量
３００〜７０００である一種又は二種以上のフェノール
性水酸基含有成分２０〜２００重量部と、(Ｅ)ＺｎＯ、
ＭｇＯ、ＣａＯ、ＴｉＯ2から選択される一種又は二種
以上の金属酸化物１〜２００重量部とを含んでなること
を特徴とするヒートシールコネクタ用絶縁性接着剤組成
物。2. A heat-seal connector according to claim 1, further comprising a conductive line provided on at least one surface of the flexible base material and having an anisotropic conductive means comprising an insulating adhesive and conductive particles at least at a connection portion of the conductive line. An insulating adhesive composition for a heat seal connector constituting an insulating adhesive, comprising: (A) acrylonitrile butadiene rubber, styrene / butadiene / styrene copolymer, styrene / ethylene / butylene / styrene copolymer, styrene / 100 parts by weight of one or more elastomer components selected from isoprene / styrene copolymers, and (B) an epoxy equivalent of 200 to
5000 bisphenol type epoxy resin 100-25
0 parts by weight, (C) 10 to 100 parts by weight of an imidazole-based curing agent, and (D) one or two or more kinds selected from t-butylphenol, p-vinylphenol, and terpenephenol having a weight average molecular weight of 300 to 7000. 20 to 200 parts by weight of a phenolic hydroxyl group-containing component, (E) ZnO,
MgO, CaO, one or a heat seal connector insulating adhesive composition characterized by comprising the two or more metal oxides 1-200 parts by weight is selected from TiO 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01291998A JP3846990B2 (en) | 1998-01-26 | 1998-01-26 | Insulating adhesive composition for heat seal connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01291998A JP3846990B2 (en) | 1998-01-26 | 1998-01-26 | Insulating adhesive composition for heat seal connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11209727A true JPH11209727A (en) | 1999-08-03 |
| JP3846990B2 JP3846990B2 (en) | 2006-11-15 |
Family
ID=11818754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01291998A Expired - Lifetime JP3846990B2 (en) | 1998-01-26 | 1998-01-26 | Insulating adhesive composition for heat seal connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3846990B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002121526A (en) * | 2000-10-17 | 2002-04-26 | Shin Etsu Polymer Co Ltd | Insulating adhesive, anisotropic electro-conductive adhesive, and heat-sealing connector |
| US7071263B2 (en) | 2003-05-19 | 2006-07-04 | 3M Innovative Properties Company | Epoxy adhesives and bonded substrates |
| WO2007108539A1 (en) * | 2006-03-23 | 2007-09-27 | Shin-Etsu Polymer Co., Ltd. | Flexible wiring board and heat seal connector |
-
1998
- 1998-01-26 JP JP01291998A patent/JP3846990B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002121526A (en) * | 2000-10-17 | 2002-04-26 | Shin Etsu Polymer Co Ltd | Insulating adhesive, anisotropic electro-conductive adhesive, and heat-sealing connector |
| US7071263B2 (en) | 2003-05-19 | 2006-07-04 | 3M Innovative Properties Company | Epoxy adhesives and bonded substrates |
| WO2007108539A1 (en) * | 2006-03-23 | 2007-09-27 | Shin-Etsu Polymer Co., Ltd. | Flexible wiring board and heat seal connector |
| JPWO2007108539A1 (en) * | 2006-03-23 | 2009-08-06 | 信越ポリマー株式会社 | Flexible wiring board and heat seal connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3846990B2 (en) | 2006-11-15 |
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