JPH10298518A - Insulating adhesive composition and heat seal connector - Google Patents
Insulating adhesive composition and heat seal connectorInfo
- Publication number
- JPH10298518A JPH10298518A JP12148797A JP12148797A JPH10298518A JP H10298518 A JPH10298518 A JP H10298518A JP 12148797 A JP12148797 A JP 12148797A JP 12148797 A JP12148797 A JP 12148797A JP H10298518 A JPH10298518 A JP H10298518A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- insulating adhesive
- heat seal
- seal connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、絶縁性接着剤組
成物およびヒートシールコネクタ、詳しくは、液晶表示
器（ＬＣＤ）やプラズマ表示パネル（ＰＤＰ）とそれら
の駆動回路を搭載した回路基板との間等の電気的接続に
用いられるヒートシールコネクタ、および、この種のヒ
ートシールコネクタに適した絶縁性接着剤組成物に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating adhesive composition and a heat seal connector, and more particularly, to a liquid crystal display (LCD) or a plasma display panel (PDP) and a circuit board on which a driving circuit is mounted. The present invention relates to a heat seal connector used for electrical connection between the members and the like, and an insulating adhesive composition suitable for this type of heat seal connector.
【０００２】[0002]
【従来の技術】ヒートシールコネクタは、従来より、Ｌ
ＣＤやＤＰＤ等の表示体とプリント回路基板（ＰＣ
Ｂ）、フレキシブルプリント回路（ＦＰＣ）との接続、
あるいは、ＰＣＢ，ＦＣＰ間の接続等に用いられ、図
１，２に示すもの、図３に示すもの等が知られる（特開
平８−３３５４７２号公報等参照）。前者のヒートシー
ルコネクタは、図１に示すように、可撓性基材１２の一
面に所望の導電ライン１３を導電ペースト等でスクリー
ン印刷することで形成するとともに、導電ライン１３の
端部の接続部分上に導電粒子１４を熱接着性の絶縁性接
着剤１５に分散してなる異方導電性接着剤層１６を設
け、また、導電ライン１３の接続に関与しない他の部位
上に絶縁レジスト層１７を設けて構成される。2. Description of the Related Art Conventionally, a heat seal connector has been known as an L connector.
Display body such as CD or DPD and printed circuit board (PC
B), connection with a flexible printed circuit (FPC),
Alternatively, it is used for connection between a PCB and an FCP, and the one shown in FIGS. 1 and 2 and the one shown in FIG. 3 are known (see Japanese Patent Application Laid-Open No. 8-335472). As shown in FIG. 1, the former heat seal connector is formed by screen-printing a desired conductive line 13 on one surface of a flexible base material 12 using a conductive paste or the like, and connecting an end of the conductive line 13. An anisotropic conductive adhesive layer 16 formed by dispersing conductive particles 14 in a heat-bonding insulating adhesive 15 is provided on the portion, and an insulating resist layer is provided on other portions not involved in the connection of the conductive line 13. 17 is provided.
【０００３】このようなヒートシールコネクタは、図２
に示すように、その導電ライン１３を他のＩＴＯ（indi
um tin oxide）基板の透明電極２１と接続する場合等
は、異方導電性接着剤層１６を透明電極２１と接触さ
せ、この状態で加熱により接着剤層１６を熱融着させて
接着し、導電粒子１４が導電ライン１３と透明電極２１
の双方に接触して導電ライン１３と透明電極２１とを電
気的に導通する。[0003] Such a heat seal connector is shown in FIG.
As shown in FIG. 2, the conductive line 13 is connected to another ITO (individual).
In the case of connecting to the transparent electrode 21 of the um tin oxide) substrate, the anisotropic conductive adhesive layer 16 is brought into contact with the transparent electrode 21, and in this state, the adhesive layer 16 is thermally fused and bonded by heating. The conductive particles 14 are composed of the conductive line 13 and the transparent electrode 21
To electrically connect the conductive line 13 and the transparent electrode 21 to each other.
【０００４】また、後者のヒートシールコネクタは、図
３に示すように、導電ライン１３を導電粒子１４を分散
配合した導電ペーストで形成し、この導電ライン１３の
接続部分を被覆する絶縁性接着剤層１５’を設けて構成
される。このヒートシールコネクタも、絶縁性接着剤層
１５’を熱融着させて接着し、導電ライン１３から突出
した導電粒子１４を透明電極２１と当接させて電気的な
導通を得る。In the latter heat seal connector, as shown in FIG. 3, a conductive line 13 is formed of a conductive paste in which conductive particles 14 are dispersed and compounded, and an insulating adhesive for covering a connecting portion of the conductive line 13 is used. It is constituted by providing a layer 15 '. Also in this heat seal connector, the insulating adhesive layer 15 ′ is bonded by heat fusion, and the conductive particles 14 protruding from the conductive line 13 are brought into contact with the transparent electrode 21 to obtain electrical conduction.
【０００５】ところで、このヒートシールコネクタは、
絶縁性接着剤（層）が通常、印刷やコーティング等の方
法で導電ライン上に設けられることから汎用溶剤に容易
に溶解することが望まれる。したがって、絶縁性接着剤
には、粘着力、接着力、加工の容易さという点から、ス
チレン系エラストマ、熱可塑性ポリエステル、熱可塑性
ポリウレタン、クロロプレン、アクリロニトリルブタジ
エンゴム等の熱可塑性樹脂を主成分とするものが多用さ
れている。[0005] By the way, this heat seal connector,
Since an insulating adhesive (layer) is usually provided on a conductive line by a method such as printing or coating, it is desired that the insulating adhesive (layer) be easily dissolved in a general-purpose solvent. Therefore, the insulating adhesive has, as a main component, a thermoplastic resin such as styrene-based elastomer, thermoplastic polyester, thermoplastic polyurethane, chloroprene, and acrylonitrile butadiene rubber in terms of adhesive strength, adhesive strength, and ease of processing. Things are heavily used.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上述し
たヒートシールコネクタは、絶縁性接着剤に熱可塑性樹
脂を用いるため、耐熱性に乏しく、高温時の電気的接続
の信頼性に劣るという問題があった。すなわち、このよ
うなヒートシールコネクタは、電気的な接続の信頼性が
絶縁性接着剤の特性に大きく依存するため、接着剤の接
着力等が低下すると電気的な接続も不安定となる。特
に、近年においては、ヒートシールコネクタの用途も拡
大し、熱的に過酷な環境、例えば、夏期の自動車内部等
の高温環境下等にも使用され、また、電気機器の小型化
に伴ってヒートシールコネクタに要求される接続端子ピ
ッチも従来の最小０．３ｍｍピッチ程度から最小０．２
ｍｍピッチ程度にまで精細化し、導電粒子の粒径が微少
化、さらに、接着剤の塗布厚さが薄くなる傾向にあるた
め、上述の問題も顕著であった。However, since the above-mentioned heat seal connector uses a thermoplastic resin for the insulating adhesive, it has poor heat resistance and poor electrical connection reliability at high temperatures. Was. That is, in such a heat seal connector, since the reliability of the electrical connection greatly depends on the characteristics of the insulating adhesive, the electrical connection becomes unstable when the adhesive strength of the adhesive decreases. In particular, in recent years, the use of heat seal connectors has also expanded, and they have been used in thermally harsh environments, for example, in high-temperature environments such as the interior of automobiles in the summer season. The connection terminal pitch required for the seal connector is 0.2
Since the fineness is reduced to about the mm pitch, the particle size of the conductive particles tends to be small, and the thickness of the adhesive applied tends to be small, the above-mentioned problem has been remarkable.
【０００７】一方、上述した問題の対策として、絶縁性
接着剤に熱可塑性樹脂に変えて熱硬化性樹脂を使用する
試みが数多くなされているが、熱硬化性樹脂はその分子
構造上、可撓性に乏しく、その剪断接着力は強いものの
剥離接着力が弱く、また、接着剤として塗布されてから
熱圧着されるまでに硬化が進み、熱圧着が不可能になっ
てしまうまでの時間制限、いわゆる、ポットライフが短
く、低温保存が不可欠であり、さらに、熱サイクルによ
る衝撃で接着界面が剥離しやすいという欠点を持ってい
た。この発明は、上記問題に鑑みてなされたもので、初
期接着力、接着保持力に優れた絶縁性接着剤の組成物、
また、高温、および熱衝撃によっても電気的接続を確実
かつ高信頼性に保ちことができるヒートシールコネクタ
を提供することを目的とする。On the other hand, many attempts have been made to use a thermosetting resin instead of a thermoplastic resin for the insulating adhesive as a measure against the above-mentioned problem. However, the thermosetting resin is flexible due to its molecular structure. Poor properties, its shear adhesive strength is strong, but peel adhesive strength is weak, and curing progresses from being applied as an adhesive to thermocompression bonding, time limit until thermocompression bonding becomes impossible, So-called pot life is short, storage at low temperature is indispensable, and furthermore, it has the drawback that the adhesive interface is easily peeled off by the impact of a thermal cycle. The present invention has been made in view of the above problems, a composition of an insulating adhesive excellent in initial adhesive strength, adhesive holding power,
It is another object of the present invention to provide a heat seal connector that can maintain electrical connection reliably and highly reliably even at high temperatures and thermal shock.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、請求項１に記載の発明にかかる絶縁性接着剤組成物
は、ジエン系ゴムあるいはスチレン系エラストマから選
ばれる１種あるいは複数種のエラストマ成分１００重量
部と、エポキシ当量２００〜５０００の固形または半固
形のエポキシ樹脂２０〜１５０重量部と、分子量３００
〜７０００である１種または複数種のフェノール性水酸
基含有成分２０〜２００重量部と、前記エラストマ成分
を架橋させる架橋剤０．１〜１０重量部と、金属酸化物
１〜５０重量部と、を含んで構成される。In order to achieve the above object, the insulating adhesive composition according to the first aspect of the present invention comprises one or more types of elastomers selected from diene rubbers and styrene elastomers. 100 parts by weight of a component, 20 to 150 parts by weight of a solid or semi-solid epoxy resin having an epoxy equivalent of 200 to 5000, and a molecular weight of 300
20 to 200 parts by weight of one or more kinds of phenolic hydroxyl group-containing components which are 7000 to 7000, 0.1 to 10 parts by weight of a crosslinking agent for crosslinking the elastomer component, and 1 to 50 parts by weight of metal oxide. It is comprised including.
【０００９】また、請求項２に記載の発明は、可撓性基
材の少なくとも片面に導電ラインを有し、該導電ライン
の少なくとも接続に関与する部分に絶縁性接着剤と導電
粒子を含む異方導電手段を設けたヒートシールコネクタ
において、前記絶縁性接着剤を構成する組成物が、ジエ
ン系ゴムあるいはスチレン系エラストマから選ばれる１
種あるいは複数種のエラストマ成分１００重量部と、エ
ポキシ当量２００〜５０００のエポキシ樹脂２０〜１５
０重量部と、分子量３００〜７０００である１種または
複数種のフェノール性水酸基含有成分２０〜２００重量
部と、前記エラストマ成分を架橋させる架橋剤０．１〜
１０重量部と、金属酸化物１〜５０重量部と、を含む。According to a second aspect of the present invention, a flexible substrate has a conductive line on at least one surface thereof, and an insulating adhesive and conductive particles are included in at least a portion of the conductive line involved in connection. In a heat seal connector provided with one side conductive means, the composition constituting the insulating adhesive is selected from diene rubber or styrene elastomer.
100 parts by weight of one or more kinds of elastomer components and epoxy resin 20 to 15 having an epoxy equivalent of 200 to 5000
0 parts by weight, one or more phenolic hydroxyl group-containing components having a molecular weight of 300 to 7000, 20 to 200 parts by weight, and a crosslinking agent 0.1 to crosslinking the elastomer component.
10 parts by weight and 1 to 50 parts by weight of a metal oxide.
【００１０】そして、この発明にかかる絶縁性接着剤組
成物およびヒートシールコネクタは、前記フェノール性
水酸基含有成分として、ｔ−ブチルフェノール、ポリ−
ｐ−ビニルフェノール、テルペンフェノールから選ばれ
た少なくとも１種を用いる態様（請求項３）に構成する
ことができる。The insulating adhesive composition and the heat seal connector according to the present invention are characterized in that the phenolic hydroxyl group-containing component comprises t-butylphenol, poly-
An embodiment (claim 3) using at least one selected from p-vinylphenol and terpene phenol can be provided.
【００１１】すなわち、本発明者は、上述した課題を解
決する方法について種々検討した結果、この絶縁性接着
剤については、エラストマ成分と、エポキシ樹脂と、エ
ポキシ樹脂の硬化剤として作用するフェノール性水酸基
含有成分とを主成分として、エラストマ成分を架橋すべ
く架橋剤と、架橋助剤および耐熱性フィラーとしての金
属酸化物を配合することにより、長期にわたる高温環境
下において絶縁性接着剤成分が徐々にかつ緩やかに硬化
していくことにより接着力を増大するという知見を得、
この知見によって電気的接続の信頼性についての研究を
進め、本発明を完成させた。That is, the present inventor has conducted various studies on methods for solving the above-mentioned problems. As a result, this insulating adhesive has an elastomer component, an epoxy resin, and a phenolic hydroxyl group acting as a curing agent for the epoxy resin. By blending a cross-linking agent, a cross-linking aid and a metal oxide as a heat-resistant filler in order to cross-link the elastomer component, the insulating adhesive component gradually increases in a high-temperature environment for a long time. And gained the knowledge of increasing the adhesive force by gradually curing,
Based on this finding, the research on the reliability of the electrical connection was advanced, and the present invention was completed.
【００１２】エラストマ成分としては、ＮＢＲ（アクリ
ロニトリルブタジエン共重合ゴム）、ＳＢＳ（スチレン
−ブタジエン−スチレンブロックコポリマ）、ＳＥＢＳ
（水素添加型ＳＢＳ）、ＳＩＳ（スチレン−イソプレン
−スチレンブロックコポリマ）が例示されるが、これら
はその分子構造中に無水ジカルボン酸基、カルボン酸基
等の無水有機酸基、有機酸基を含むものでもよく、市販
のものを用いることができ、１種または複数種を使用す
ることができる。このエラストマ成分としては、耐熱性
の点からＮＢＲが好ましく、また特には、エポキシ樹脂
と反応可能なカルボン酸基含有ＮＢＲが可撓性向上の効
果が大きく望ましい。As the elastomer component, NBR (acrylonitrile butadiene copolymer rubber), SBS (styrene-butadiene-styrene block copolymer), SEBS
(Hydrogenated SBS) and SIS (styrene-isoprene-styrene block copolymer), which include an organic anhydride group such as a dicarboxylic anhydride group or a carboxylic acid group in the molecular structure thereof. And a commercially available product may be used, and one or more types may be used. As the elastomer component, NBR is preferable from the viewpoint of heat resistance, and particularly, NBR containing a carboxylic acid group capable of reacting with an epoxy resin is preferable because it has a large effect of improving flexibility.
【００１３】エポキシ樹脂は、市販のものを適宜用いる
ことができるが、そのエポキシ当量が２００〜５０００
程度の半固形または固形のもの、特に、ＩＴＯやＦＰＣ
表面との接着性に優れるビスフェノールＡ型のエポキシ
樹脂が好ましい。このエポキシ樹脂は、液状であると、
絶縁性接着剤としたときにエポキシ分子が動きやすく、
絶縁性接着剤をヒートシールコネクタに塗布してから圧
着するまでの接着可能な可使時間（ポットライフ）が短
くなることから、半固形または固形のものが選ばれる。
このエポキシ樹脂は、エポキシ当量が２００より小さい
と液状になりやすく、また、５０００より大きいとその
溶融温度がヒートシールコネクタの圧着温度よりも高く
なりすぎて接着性が得られなくなるので、エポキシ当量
の範囲は２００〜５０００、望ましくは、２００〜３０
００とされる。As the epoxy resin, a commercially available epoxy resin can be appropriately used, and its epoxy equivalent is 200 to 5000.
Semi-solid or solid, especially ITO or FPC
A bisphenol A type epoxy resin having excellent adhesion to the surface is preferred. When this epoxy resin is liquid,
When used as an insulating adhesive, epoxy molecules move easily,
A semi-solid or solid material is selected because the potable life (pot life) from application of the insulating adhesive to the heat seal connector to pressure bonding is reduced.
When the epoxy equivalent is less than 200, the epoxy resin tends to be in a liquid state. When the epoxy equivalent is more than 5,000, the melting temperature becomes too high than the crimping temperature of the heat seal connector, so that the adhesiveness cannot be obtained. The range is 200-5000, preferably 200-30.
00 is set.
【００１４】フェノール性水酸基含有成分はエポキシ樹
脂の硬化剤および／または粘着付与剤等として機能す
る。このフェノール性水酸基含有成分は、粘着付与性に
優れたｔ−ブチルフェノール（t-butylphenol）、テル
ペンフェノール（terpenephenol）、また、硬化剤とし
て優れたポリ−ｐ−ビニルフェノール（poly-p-vinylph
enol）等で代表され、市販のものが使用できるが、耐熱
性の点からはｔ−ブチルフェノール、ポリ−ｐ−ビニル
フェノールが好ましく、特には、分子構造が単純で配合
設計が容易なポリ−ｐ−ビニルフェノールがより好まし
い。このフェノール性水酸基含有成分は、分子量が３０
０より小さいと樹脂の軟化点が低く耐熱性の低いものと
なるし、７０００より大きいとその溶融温度がヒートシ
ールコネクタの圧着温度よりも高くなりすぎて接着性が
得られなくなるので、分子量が３００〜７０００のもの
から選ばれる。The phenolic hydroxyl group-containing component functions as an epoxy resin curing agent and / or tackifier. The phenolic hydroxyl group-containing component includes t-butylphenol and terpenephenol which are excellent in tackiness, and poly-p-vinylphenol which is an excellent curing agent.
enol) and the like, and commercially available ones can be used. However, from the viewpoint of heat resistance, t-butylphenol and poly-p-vinylphenol are preferable. In particular, poly-p which has a simple molecular structure and is easy to mix and design can be used. -Vinyl phenol is more preferred. This phenolic hydroxyl group-containing component has a molecular weight of 30.
If it is less than 0, the resin has a low softening point and low heat resistance, and if it is more than 7000, its melting temperature becomes too high than the crimping temperature of the heat seal connector, and it becomes impossible to obtain adhesiveness. ~ 7000.
【００１５】また、エラストマ成分１００重量部に対す
るエポキシ樹脂の配合量は２０〜１５０重量部とするこ
とが望ましく、２０重量部よりも少ないと絶縁性接着剤
としての接着力が減少するのみならず耐熱性も満足でき
ないものとなるし、１５０重量部よりも多いと可撓性が
なくなり剥離強度が小さくなる。さらに、エラストマ成
分１００重量部に対するフェノール性水酸基含有成分の
配合量は２０〜２００重量部とすることがよく、２０重
量部より少ないと初期接着力が小さく、また、２００重
量部よりも多いと可撓性の減少や耐湿性の悪化を招くこ
とがある。The amount of the epoxy resin is preferably 20 to 150 parts by weight based on 100 parts by weight of the elastomer component. If the amount is less than 20 parts by weight, not only the adhesive strength as an insulating adhesive is reduced but also the heat resistance is reduced. The properties are not satisfactory, and if the amount is more than 150 parts by weight, flexibility is lost and peel strength is reduced. Further, the compounding amount of the phenolic hydroxyl group-containing component is preferably 20 to 200 parts by weight with respect to 100 parts by weight of the elastomer component. When the amount is less than 20 parts by weight, the initial adhesive strength is small. This may lead to a decrease in flexibility and a deterioration in moisture resistance.
【００１６】またさらに、架橋剤としては、硫黄、エチ
レンチオウレア（ethylene thiourea）、ジエチルチオ
ウレア（diethyl thiourea）、Ｎ−シクロヘキシル−２
−ベンゾチアゾール（N-cyclohexyl-2-benzothiazol
e）、テトラメチルチウラムジスルフィド（tetramethyl
thiuram disulfide）、２−ベンゾチアゾリルジスルフ
ィド（2-benzothiazolyl disulfide）等が挙げられる
が、スコーチ性や表面へのブリードを考慮すると硫黄以
外のものが望ましい。この架橋剤の配合量としては、エ
ラストマ成分１００重量部に対して、０．１〜１０重量
部が望ましく、０．１重量部よりも小さいと十分に架橋
が進まない場合があり、また、１０重量部よりも大きい
とスコーチしやすく望ましくない。Further, as a crosslinking agent, sulfur, ethylene thiourea, diethyl thiourea, N-cyclohexyl-2
-Benzothiazole (N-cyclohexyl-2-benzothiazol
e), tetramethylthiuram disulfide (tetramethyl
thiuram disulfide), 2-benzothiazolyl disulfide (2-benzothiazolyl disulfide), etc., but those other than sulfur are preferable in consideration of scorch property and bleeding to the surface. The amount of the crosslinking agent is preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the elastomer component. If the amount is less than 0.1 part by weight, the crosslinking may not proceed sufficiently. If the amount is larger than the weight part, scorch tends to occur, which is not desirable.
【００１７】金属酸化物は、エラストマ成分と架橋剤と
の架橋助剤としての役割を果たすとともに、無機化合物
として有機化合物である絶縁性接着剤の耐熱性を向上さ
せる。これは酸化亜鉛（ＺｎＯ）、酸化マグネシウム
（ＭｇＯ）、過酸化カルシウム（ＣａＯ2）、二酸化チ
タン（ＴｉＯ2）等から選ばれる１種または２種以上の
金属酸化物から選ばれ、その配合量は１〜５０重量部が
望ましい。この金属酸化物の配合量が、１重量部未満で
あると上述した効果を十分に発現させないし、５０重量
部より大きいと接着力の低下や絶縁性接着剤の母材強度
の低下をもたらす。特には、この金属酸化物は、フェノ
ール性水酸基含有成分としてｔ−ブチルフェノールを用
いた場合には酸化マグネシウムが耐熱性を向上させる効
果を奏することから好ましく、また、酸化亜鉛もエラス
トマ成分の架橋助剤として最も優れることから好まし
く、さらに、耐光性が望まれる環境で使用するものには
紫外線吸収効果を有する二酸化チタンを使用することが
好ましい。The metal oxide serves as a crosslinking aid between the elastomer component and the crosslinking agent, and improves the heat resistance of the insulating adhesive, which is an organic compound as an inorganic compound. This is selected from one or more metal oxides selected from zinc oxide (ZnO), magnesium oxide (MgO), calcium peroxide (CaO 2 ), titanium dioxide (TiO 2 ), etc. 1 to 50 parts by weight is desirable. If the amount of the metal oxide is less than 1 part by weight, the above-mentioned effects are not sufficiently exhibited. If the amount is more than 50 parts by weight, the adhesive strength and the base material strength of the insulating adhesive are reduced. In particular, this metal oxide is preferred because magnesium oxide has an effect of improving heat resistance when t-butylphenol is used as the phenolic hydroxyl group-containing component, and zinc oxide is also a crosslinking aid for the elastomer component. In addition, titanium dioxide having an ultraviolet absorbing effect is preferably used for those used in an environment where light resistance is desired.
【００１８】本発明の絶縁性接着剤組成物には、上記し
た材料のほかに、粘着付与剤、各種カップリング剤、老
化防止剤、着色剤、紫外線吸収剤等を適宜添加すること
ができ、特に、ヒートシールコネクタに異方導電手段と
して用いる場合（前述した図１，２と対応）は導電粒子
を分散させる。この導電粒子としては、例えば、金、
銀、銅、ニッケル、パラジウム、ステンレス、真鍮、半
田等の金属粒子、タングステンカーバイド、シリカカー
バイド等のセラミック粒子、カーボン粒子、表面を金属
被覆したプラスチック粒子等が例示される。この導電粒
子は、配合量が少なすぎると導通不良を起こしやすく、
多すぎると絶縁不良を起こしやすいので絶縁性接着剤組
成物１００容量部に対して０．０１〜５０容量部、好ま
しくは、１〜１０容量部とすることがよい。To the insulating adhesive composition of the present invention, in addition to the above-mentioned materials, a tackifier, various coupling agents, an antioxidant, a coloring agent, an ultraviolet absorber and the like can be appropriately added. In particular, when used as an anisotropic conductive means in a heat seal connector (corresponding to FIGS. 1 and 2 described above), conductive particles are dispersed. As the conductive particles, for example, gold,
Examples thereof include metal particles such as silver, copper, nickel, palladium, stainless steel, brass, and solder, ceramic particles such as tungsten carbide and silica carbide, carbon particles, and plastic particles having a metal-coated surface. If the amount of the conductive particles is too small, poor conduction tends to occur,
If the amount is too large, insulation failure is likely to occur. Therefore, the amount is preferably 0.01 to 50 parts by volume, preferably 1 to 10 parts by volume with respect to 100 parts by volume of the insulating adhesive composition.
【００１９】また、この絶縁性接着剤組成物は、図３に
示すような導電ラインが導電粒子を含むヒートシールコ
ネクタに用いて異方導電手段を構成することもできる。
この態様においても、導電粒子は前述した異方導電接着
剤に使用したものと同様のものとすればよいが、この配
合量は少なすぎると導通不良を起こしやすく、多すぎる
と導電ラインの形成が困難になるので、導電ライン１０
０容量部に対して０．０１〜５０重量部、好ましくは、
１〜１０重量部とすればよい。The insulating adhesive composition may be used for a heat seal connector having conductive lines containing conductive particles as shown in FIG. 3 to constitute anisotropic conductive means.
In this embodiment, the conductive particles may be the same as those used for the anisotropic conductive adhesive described above. However, if the amount is too small, poor conduction is likely to occur. Since it becomes difficult, the conductive line 10
0.01 to 50 parts by weight, preferably 0 parts by volume,
The amount may be 1 to 10 parts by weight.
【００２０】そして、この絶縁性接着剤組成物は、使用
にあたっては、これを溶剤に溶解して溶液とし、これを
適宜のコート法、印刷法によってヒートシールコネクタ
の所望の位置に塗布して接着剤層を形成する。この溶剤
には、通常、エステル系、ケトン系、エーテルエステル
系、エーテル系、アルコール系、炭化水素系の溶剤、例
えば、酢酸メチル、メチルエチルケトン、酢酸ブチルセ
ロソルブ、酢酸エチルカルビトール、ジイソアミルエー
テル、シクロヘキサノール、石油スピリット、トルエン
等が用いられる。When the insulating adhesive composition is used, it is dissolved in a solvent to form a solution, which is applied to a desired position of the heat seal connector by an appropriate coating method or printing method, and is adhered. Form an agent layer. This solvent is usually an ester, ketone, ether ester, ether, alcohol, or hydrocarbon solvent such as methyl acetate, methyl ethyl ketone, butyl cellosolve acetate, ethyl carbitol acetate, diisoamyl ether, and cyclohexanol. , Petroleum spirit, toluene and the like are used.
【００２１】このようにして作られた絶縁性接着剤組成
物を使用したヒートシールコネクタは、前述した図１，
２、あるいは、図３に示すように構成される。そして、
同図を参照して説明すれば、可撓性基材１２はポリエス
テル、ポリイミド等の公知の材料を用いて製作されたシ
ートが用いられ、このシートは１０〜１００μｍの厚み
のものが選ばれる。導電ライン１３としては、有機バイ
ンダに０．０１〜１０μｍ程度の粒径を持つ銀粉、銅
粉、カーボンブラック、グラファイトなどの導電性付与
剤を混合した導電ペーストをスクリーン印刷等で形成し
たもので、これも公知のものでよい。導電ライン１３
は、通常、可撓性基材１２の片面にのみ形成することが
多いが、例えば、スルーホールにより導通させて可撓性
基材１２の両面に形成することも可能である。The heat seal connector using the insulating adhesive composition thus produced is described in FIG.
2, or as shown in FIG. And
Referring to FIG. 1, a sheet made of a known material such as polyester or polyimide is used for the flexible base material 12, and the sheet having a thickness of 10 to 100 μm is selected. The conductive lines 13 are formed by screen printing or the like of a conductive paste obtained by mixing an organic binder with a conductive agent such as silver powder having a particle size of about 0.01 to 10 μm, copper powder, carbon black, and graphite. This may also be a known one. Conductive line 13
Is usually formed only on one side of the flexible base material 12, but it is also possible to form the conductive base material on both sides of the flexible base material 12 by conducting through through holes, for example.
【００２２】絶縁性レジスト１７としては、ポリアミド
系、ポリエステル系等の合成樹脂や、各種の合成ゴム
類、若しくは、その混合物をベースに必要に応じて硬化
剤、加硫剤、各種劣化防止剤などの添加物を加えたもの
を上述したように溶剤に溶解し、スクリーン印刷などに
より形成したものや、ポリエステル、塩化ビニル等のフ
ィルムにアクリル系樹脂等の粘着剤を塗布して貼付した
ものが挙げられるが、必要とされる絶縁性、表面保護
性、コスト等の兼ね合いにより選択される。As the insulating resist 17, a hardening agent, a vulcanizing agent, various deterioration preventing agents and the like are used as needed based on a synthetic resin such as polyamide or polyester, various synthetic rubbers, or a mixture thereof. Dissolved in the solvent as described above with the addition of additives, and those formed by screen printing, etc., polyester, vinyl chloride and other films coated with an adhesive such as acrylic resin and stuck However, it is selected in consideration of required insulating properties, surface protection properties, costs, and the like.
【００２３】[0023]
【作用】この発明にかかる絶縁性接着剤組成物は、エラ
ストマ成分がエポキシ樹脂の可撓性を改善して剥離強
度、耐熱衝撃性を向上させるとともに、エラストマ成分
も架橋剤と金属酸化物により架橋して耐熱性に優れたエ
ラストマを形成する。また、エポキシ樹脂はフェノール
性水酸基含有成分と反応して硬化するが、エポキシ樹脂
は固形あるいは半固形で反応性が低いため長期のポット
ライフを得ることができるのみならず優れた高温耐久性
が得られ、さらに、フェノール性水酸基含有成分は分子
中の水酸基の働きにより初期接着力を向上させ、また、
反応後においても水酸基を発生し、接着力の低下を防止
できる。In the insulating adhesive composition according to the present invention, the elastomer component improves the flexibility of the epoxy resin to improve the peel strength and the thermal shock resistance, and the elastomer component is also cross-linked by a cross-linking agent and a metal oxide. To form an elastomer having excellent heat resistance. In addition, the epoxy resin reacts with the phenolic hydroxyl group-containing component and cures, but the epoxy resin is solid or semi-solid and has low reactivity, so that not only long pot life can be obtained but also excellent high-temperature durability can be obtained. Further, the phenolic hydroxyl group-containing component improves the initial adhesive force by the action of the hydroxyl group in the molecule,
Even after the reaction, a hydroxyl group is generated, and a decrease in adhesive strength can be prevented.
【００２４】[0024]
【実施例】以下に本発明の実施例を示す。 １．絶縁性接着剤溶液の製作 ＮＢＲ１００重量部、エポキシ当量３００〜５０００の
ビスフェノールＡ型エポキシ樹脂５０重量部、分子量７
００のｔ−ブチルフェノール１００重量部、エチレンチ
オウレア１重量部、ＺｎＯ５重量部に、シクロヘキサン
３００重量部を加えてこれを溶解した。Examples of the present invention will be described below. 1. Preparation of insulating adhesive solution 100 parts by weight of NBR, 50 parts by weight of bisphenol A type epoxy resin having an epoxy equivalent of 300 to 5000, molecular weight 7
To 100 parts by weight of t-butylphenol, 1 part by weight of ethylene thiourea, and 5 parts by weight of ZnO, 300 parts by weight of cyclohexane was added and dissolved.
【００２５】２．異方導電性接着剤の製作 上記で製作した絶縁性接着剤溶液の固形分１００容量部
に、粒径１０μｍの表面を金メッキしたアクリル樹脂粒
子を１０容量部加えて異方導電接着剤を製作した。2. Production of anisotropic conductive adhesive Anisotropic conductive adhesive was prepared by adding 10 parts by volume of gold-plated acrylic resin particles having a particle diameter of 10 μm to 100 parts by volume of solid content of the insulating adhesive solution prepared above. .
【００２６】３．ヒートシールコネクタの製作 厚さ２５μｍのＰＥＴフィルムよりなる可撓性基材の上
に、市販の銀ペースト（ＤＷ−２５０Ｈ−５ 東洋紡績
製）をスクリーン印刷により印刷して０．２ｍｍピッチ
の導電ラインを形成した後、１３０°Ｃのオーブンで５
時間乾燥させ、硬化させた。次いで、その接続端子部に
上記で製作した異方導電接着剤を溶媒を除去した後の厚
みが９μｍとなるようにスクリーン印刷で塗布して異方
導電接着剤層を形成し、残る部位に市販の絶縁レジスト
（ＪＥＨ−１１２ 日本アチソン製）を設け、これを所
望の寸法に切断してヒートシールコネクタを得た。3. Production of heat seal connector A commercially available silver paste (DW-250H-5 manufactured by Toyobo Co., Ltd.) is printed on a flexible base material made of a PET film having a thickness of 25 μm by screen printing, and a conductive line of 0.2 mm pitch is formed. Is formed and then 5 minutes in an oven at 130 ° C.
Dry for a time and cure. Next, the anisotropic conductive adhesive prepared above was applied to the connection terminal portion by screen printing so that the thickness after removing the solvent was 9 μm to form an anisotropic conductive adhesive layer. Was provided, and this was cut into desired dimensions to obtain a heat seal connector.
【００２７】次に、このようにして得たヒートシールコ
ネクタを面積抵抗率５０Ω／□の透明導電酸化膜基板
（ＩＴＯ）の接続端子とＦＰＣの間に１６０°Ｃ、４０
ｋｇ、１２秒の条件で熱圧着し、高温１１０°Ｃ〜低温
−２０°Ｃの環境試験を行って両接続端子間の抵抗値と
９０°剥離強度を測定したところ、表１に示した通りの
結果が得られた。Next, the heat-seal connector thus obtained was placed between a connection terminal of a transparent conductive oxide film substrate (ITO) having an area resistivity of 50 Ω / □ and an FPC at 160 ° C. and 40 ° C.
The thermocompression bonding was performed under the conditions of kg and 12 seconds, and an environmental test at a high temperature of 110 ° C. to a low temperature of −20 ° C. was performed to measure a resistance value between both connection terminals and a 90 ° peel strength. As shown in Table 1, Was obtained.
【００２８】[0028]
【表１】 [Table 1]
【００２９】[0029]
【発明の効果】以上説明したように、この発明にかかる
絶縁性接着剤組成物は、エラストマ成分と、エポキシ樹
脂と、フェノール性水酸基含有成分とを主成分として構
成され、エラストマ成分がエポキシ樹脂の可撓性を向上
して耐熱衝撃性を向上するとともに、エラストマ成分も
架橋剤、金属酸化物により架橋して耐熱性に優れたエラ
ストマになっていく。また、エポキシ樹脂はフェノール
性水酸基含有成分と反応して硬化が進むが、水酸基含有
成分は液状でないためにその反応性は低く、長いポット
ライフを持ちながらも高温耐久性に優れたものとなる。
さらに、フェノール性水酸基含有成分は、その分子中の
水酸基により初期接着力を向上する働きをし、またさら
に、エポキシ樹脂と反応した後も水酸基が発生するた
め、その接着力の低下がなく、優れた接着特性が得られ
る。As described above, the insulating adhesive composition according to the present invention comprises an elastomer component, an epoxy resin, and a phenolic hydroxyl group-containing component as main components, and the elastomer component is an epoxy resin. While improving flexibility and thermal shock resistance, the elastomer component is also cross-linked by a cross-linking agent and a metal oxide to become an elastomer having excellent heat resistance. Further, the epoxy resin reacts with the phenolic hydroxyl group-containing component and cures. However, since the hydroxyl group-containing component is not liquid, its reactivity is low, and it has a long pot life and excellent high-temperature durability.
Furthermore, the phenolic hydroxyl group-containing component functions to improve the initial adhesive force by the hydroxyl group in the molecule, and furthermore, the hydroxyl group is generated even after reacting with the epoxy resin, so that the adhesive force does not decrease and is excellent. The resulting adhesive properties are obtained.
【図１】この発明の一の実施の形態にかかるヒートシー
ルコネクタ用絶縁性接着剤組成物が適用されたヒートシ
ールコネクタの縦断面図である。FIG. 1 is a longitudinal sectional view of a heat seal connector to which an insulating adhesive composition for a heat seal connector according to one embodiment of the present invention is applied.
【図２】同ヒートシールコネクタの縦断面図である。FIG. 2 is a longitudinal sectional view of the heat seal connector.
【図３】他の態様にかかるヒートシールコネクタの縦断
面図である。FIG. 3 is a longitudinal sectional view of a heat seal connector according to another embodiment.
１２ 可撓性基材 １３ 導電ライン １４ 導電粒子 １５ 絶縁性接着剤 １７ 絶縁レジスト １５’ 絶縁性接着剤層 １６ 異方導電接着剤層 ２１ ＩＴＯ基板の透明電極 DESCRIPTION OF SYMBOLS 12 Flexible base material 13 Conductive line 14 Conductive particle 15 Insulating adhesive 17 Insulating resist 15 'Insulating adhesive layer 16 Anisotropic conductive adhesive layer 21 Transparent electrode of ITO substrate
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０１Ｂ 3/28 Ｈ０１Ｂ 3/28 Ｈ０１Ｒ 11/01 Ｈ０１Ｒ 11/01 Ａ // Ｈ０５Ｋ 3/36 Ｈ０５Ｋ 3/36 Ａ ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification symbol FI H01B 3/28 H01B 3/28 H01R 11/01 H01R 11/01 A // H05K 3/36 H05K 3/36 A
Claims (3)
トマから選ばれる１種あるいは複数種のエラストマ成分
１００重量部と、 エポキシ当量２００〜５０００の固形または半固形のエ
ポキシ樹脂２０〜１５０重量部と、 分子量３００〜７０００である１種または複数種のフェ
ノール性水酸基含有成分２０〜２００重量部と、 前記エラストマ成分を架橋させる架橋剤０．１〜１０重
量部と、 金属酸化物１〜５０重量部と、を含むことを特徴とする
絶縁性接着剤組成物。1. 100 parts by weight of one or more kinds of elastomer components selected from a diene rubber or a styrene-based elastomer, 20 to 150 parts by weight of a solid or semi-solid epoxy resin having an epoxy equivalent of 200 to 5,000, and a molecular weight of 300 20 to 200 parts by weight of one or more kinds of phenolic hydroxyl group-containing components which are 7000 to 7000, 0.1 to 10 parts by weight of a crosslinking agent for crosslinking the elastomer component, and 1 to 50 parts by weight of metal oxide. An insulating adhesive composition comprising:
ンを有し、該導電ラインの少なくとも接続に関与する部
分に絶縁性接着剤と導電粒子を含む異方導電手段を設け
たヒートシールコネクタにおいて、 前記絶縁性接着剤を構成する組成物が、ジエン系ゴムあ
るいはスチレン系エラストマから選ばれる１種あるいは
複数種のエラストマ成分１００重量部と、 エポキシ当量２００〜５０００のエポキシ樹脂２０〜１
５０重量部と、 分子量３００〜７０００である１種または複数種のフェ
ノール性水酸基含有成分２０〜２００重量部と、 前記エラストマ成分を架橋させる架橋剤０．１〜１０重
量部と、 金属酸化物１〜５０重量部と、を含むことを特徴とする
ヒートシールコネクタ。2. A heat seal connector having a conductive line on at least one surface of a flexible base material and an anisotropic conductive means containing an insulating adhesive and conductive particles provided on at least a portion of the conductive line involved in connection. The composition which constitutes the insulating adhesive comprises 100 parts by weight of one or more kinds of elastomer components selected from diene rubber or styrene elastomer, and epoxy resin 20 to 1 having an epoxy equivalent of 200 to 5000.
50 parts by weight, 20 to 200 parts by weight of one or more phenolic hydroxyl group-containing components having a molecular weight of 300 to 7000, 0.1 to 10 parts by weight of a crosslinking agent for crosslinking the elastomer component, and metal oxide 1 And 50 to 50 parts by weight.
ブチルフェノール、ポリ−ｐ−ビニルフェノール、テル
ペンフェノールから選ばれた少なくとも１種である請求
項１に記載の絶縁性接着剤組成物または請求項２に記載
のヒートシールコネクタ。3. The phenolic hydroxyl group-containing component is t-
The insulating adhesive composition according to claim 1, which is at least one selected from butylphenol, poly-p-vinylphenol, and terpene phenol, or the heat seal connector according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12148797A JPH10298518A (en) | 1997-04-25 | 1997-04-25 | Insulating adhesive composition and heat seal connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12148797A JPH10298518A (en) | 1997-04-25 | 1997-04-25 | Insulating adhesive composition and heat seal connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10298518A true JPH10298518A (en) | 1998-11-10 |
Family
ID=14812386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12148797A Pending JPH10298518A (en) | 1997-04-25 | 1997-04-25 | Insulating adhesive composition and heat seal connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10298518A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002121526A (en) * | 2000-10-17 | 2002-04-26 | Shin Etsu Polymer Co Ltd | Insulating adhesive, anisotropic electro-conductive adhesive, and heat-sealing connector |
| WO2007108539A1 (en) * | 2006-03-23 | 2007-09-27 | Shin-Etsu Polymer Co., Ltd. | Flexible wiring board and heat seal connector |
| US11384266B2 (en) | 2005-02-17 | 2022-07-12 | 3M Innovative Properties Company | Surfacing and/or joining method |
-
1997
- 1997-04-25 JP JP12148797A patent/JPH10298518A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002121526A (en) * | 2000-10-17 | 2002-04-26 | Shin Etsu Polymer Co Ltd | Insulating adhesive, anisotropic electro-conductive adhesive, and heat-sealing connector |
| US11384266B2 (en) | 2005-02-17 | 2022-07-12 | 3M Innovative Properties Company | Surfacing and/or joining method |
| WO2007108539A1 (en) * | 2006-03-23 | 2007-09-27 | Shin-Etsu Polymer Co., Ltd. | Flexible wiring board and heat seal connector |
| JPWO2007108539A1 (en) * | 2006-03-23 | 2009-08-06 | 信越ポリマー株式会社 | Flexible wiring board and heat seal connector |
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