JPH11177264A - Accommodation case for portable electronic apparatus - Google Patents
Accommodation case for portable electronic apparatusInfo
- Publication number
- JPH11177264A JPH11177264A JP34625797A JP34625797A JPH11177264A JP H11177264 A JPH11177264 A JP H11177264A JP 34625797 A JP34625797 A JP 34625797A JP 34625797 A JP34625797 A JP 34625797A JP H11177264 A JPH11177264 A JP H11177264A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- portable electronic
- electronic device
- storage case
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、限られた空間に
収納される発熱素子を搭載する携帯型電子機器を収納す
る携帯型電子機器の収納ケースに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage case for a portable electronic device for housing a portable electronic device having a heating element accommodated in a limited space.
【０００２】[0002]
【従来の技術】近年、ノートパソコン等、携帯・可搬型
情報処理装置の処理能力アップの要求に答える為、高機
能、高性能のＣＰＵが搭載されてきており、素子や装置
の消費電力は次第に増加してきている。そのため、ヒュ
ーマンインタフェース（エルゴノ）から見た装置表面温
度の問題や、限られた空間での放熱処理が困難となって
いる。2. Description of the Related Art In recent years, high-performance, high-performance CPUs have been mounted in order to respond to the demand for increasing the processing capability of portable and portable information processing devices such as notebook personal computers, and the power consumption of elements and devices has been gradually reduced. It is increasing. For this reason, there is a problem with the surface temperature of the device as viewed from the human interface (ergono), and it is difficult to perform heat radiation processing in a limited space.
【０００３】もちろん高機能、高性能のＣＰＵを搭載す
るにあたって、低消費電力モードの設定ができるように
したり、低電圧で駆動できるようにしたりする等、様々
な工夫がなされているが装置表面温度の問題や、限られ
た空間での放熱処理において解決するまでには至ってい
ないのが実情である。Of course, when a high-performance, high-performance CPU is mounted, various measures have been taken such as setting of a low power consumption mode and driving at a low voltage. In fact, the problem has not yet been solved in heat dissipation treatment in a limited space.
【０００４】図８は従来技術の図を示すものである。同
図において、ノート型パソコン等の携帯型電子機器５１
は、本体部６１と、本体部６１に回動自在に連結される
表示部６３と、表示部６３の背面に装着されファン装置
が組み込まれた放熱部５５とを主構成としている。FIG. 8 shows a diagram of the prior art. In the figure, a portable electronic device 51 such as a notebook computer is shown.
Has a main body 61, a display 63 that is rotatably connected to the main body 61, and a radiator 55 mounted on the back of the display 63 and incorporating a fan device.
【０００５】本体部６１の内部には実装基板６２を備え
ており、当該実装基板６２の上面には高発熱素子５２が
実装されており、当該高発熱素子５２と前記放熱部５５
とは、高発熱素子５２の上面に設けた受熱部５３から例
えばヒートパイプ等で形成された伝熱部５４により熱的
に連結されている。A mounting board 62 is provided inside the main body 61, and a high heat generating element 52 is mounted on the upper surface of the mounting board 62, and the high heat generating element 52 and the heat radiating section 55 are provided.
Is thermally connected to a heat receiving portion 53 provided on the upper surface of the high heat generating element 52 by a heat transfer portion 54 formed by, for example, a heat pipe or the like.
【０００６】上記の構成において、携帯型電子機器５１
は、受熱部５３で高発熱素子５２の発熱を受熱し伝熱部
５４を介して放熱部５５に伝熱し、表示部６３の背面か
ら放熱している。このため、高発熱素子５２が多数個実
装される場合は受熱部５３および伝熱部５４を高発熱素
子５２に対応して設ける必要があり、冷却構造が複雑と
なる。In the above configuration, the portable electronic device 51
The heat receiving portion 53 receives the heat generated by the high heat generating element 52, transfers the heat to the heat radiating portion 55 via the heat transferring portion 54, and radiates the heat from the rear surface of the display portion 63. For this reason, when a large number of high heat generating elements 52 are mounted, it is necessary to provide the heat receiving section 53 and the heat transfer section 54 corresponding to the high heat generating elements 52, and the cooling structure becomes complicated.
【０００７】また、受熱部５３や伝熱部５４あるいは放
熱部５５を交換する場合は、携帯型電子機器５１の内部
を開放して交換する必要があり、交換作業が困難とな
る。When the heat receiving section 53, the heat transfer section 54, or the heat radiating section 55 is replaced, it is necessary to open and replace the inside of the portable electronic device 51, which makes replacement work difficult.
【０００８】[0008]
【発明が解決しようとする課題】前記のごとく、従来の
技術では次のような問題点がある。As described above, the prior art has the following problems.
【０００９】１）放熱部の筺体表面温度が高温となるに
つれ、表示部の表面温度も高温になり、表示部の視認性
が低下する。1) As the surface temperature of the housing of the heat radiating section becomes higher, the surface temperature of the display section becomes higher, and the visibility of the display section is reduced.
【００１０】２）冷却構造が複雑であり、冷却部材の交
換が困難である。2) The cooling structure is complicated, and it is difficult to replace the cooling member.
【００１１】３）受熱部は局部的に形成されるので、受
熱部を形成しない他の発熱素子等の発熱も含めて携帯型
電子機器の放熱処理に限界がある。3) Since the heat receiving portion is formed locally, there is a limit to the heat radiation processing of the portable electronic device including the heat generated by other heat generating elements which do not form the heat receiving portion.
【００１２】[0012]
【課題を解決するための手段】前記の問題点を解決する
ために、この発明では次のような手段を取る。In order to solve the above problems, the present invention takes the following measures.
【００１３】携帯型電子機器を覆う収納ケースを設け、
収納ケースは受熱部と放熱部とを形成し、かつ受熱部と
放熱部とをフレキシブル性と熱伝導性とを兼備えた伝熱
部で接続する。[0013] A storage case for covering the portable electronic device is provided.
The storage case forms a heat receiving portion and a heat radiating portion, and connects the heat receiving portion and the heat radiating portion with a heat transfer portion having both flexibility and heat conductivity.
【００１４】上記の手段を取ることにより、装置表面全
体を受熱部や放熱部として使用することで携帯型電子機
器の放熱処理を向上する。By taking the above measures, the entire surface of the device is used as a heat receiving portion and a heat radiating portion, thereby improving the heat radiating process of the portable electronic device.
【００１５】[0015]
【発明の実施の形態】この発明は、次に示したような実
施の形態をとる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention adopts the following embodiments.
【００１６】図１に示すように、携帯型電子機器１の装
置表面を覆う携帯型電子機器の収納ケース２であって、
受熱部３と放熱部５とを形成し、受熱部３と放熱部５と
をフレキシブル性と熱伝導性の良好な部材からなる伝熱
部４で接続する。As shown in FIG. 1, a storage case 2 for a portable electronic device, which covers the device surface of the portable electronic device 1,
The heat receiving section 3 and the heat radiating section 5 are formed, and the heat receiving section 3 and the heat radiating section 5 are connected by the heat transfer section 4 made of a member having good flexibility and heat conductivity.
【００１７】上記の実施の形態をとることにより、携帯
型電子機器の装置表面全体を受熱部や放熱部として使用
することで携帯型電子機器の放熱処理が向上する。According to the above-described embodiment, the heat radiation processing of the portable electronic device is improved by using the entire device surface of the portable electronic device as a heat receiving portion and a heat radiating portion.
【００１８】さらに、図１に示すように、前記携帯型電
子機器の収納ケース２は、受熱部３を高発熱素子１２ａ
が内蔵された本体部１１の筺体底面１６に設置され、放
熱部５を本体部１１に開閉自在に連結された表示部１３
の背面に設置される。Further, as shown in FIG. 1, the storage case 2 of the portable electronic device includes a heat receiving portion 3 having a high heat generating element 12a.
The display unit 13 is installed on the bottom surface 16 of the housing of the main body 11 in which the heat radiating unit 5 is openably and closably connected to the main body 11.
It is installed on the back of.
【００１９】さらに、図２（ａ）に示すように、前記携
帯型電子機器の収納ケース２は、受熱部３を高発熱素子
と表示部１３とを備える本体部１１の筺体底面１６に設
置され、放熱部５を本体部１１に開閉自在に連結された
表示部１３を覆う保護カバー１８の背面に設置される。Further, as shown in FIG. 2 (a), the storage case 2 of the portable electronic device has a heat receiving portion 3 installed on a housing bottom surface 16 of a main body 11 having a high heat generating element and a display portion 13. The heat radiating unit 5 is installed on the back of a protective cover 18 that covers the display unit 13 that is connected to the main unit 11 so as to be openable and closable.
【００２０】さらに、図２（ｂ）および図２（ｃ）に示
すように、前記携帯型電子機器の収納ケース２は、受熱
部３を高発熱素子と表示部１３とを備える本体部１１の
筺体底面１６に設置され、放熱部５を本体部１１から延
長して形成される。Further, as shown in FIGS. 2 (b) and 2 (c), the storage case 2 of the portable electronic device includes a heat receiving section 3 of a main body section 11 having a high heat generating element and a display section 13. It is installed on the housing bottom surface 16, and is formed by extending the heat radiating portion 5 from the main body 11.
【００２１】上記の実施の形態をとることにより、収納
ケースは携帯型電子機器の放熱処理に加えて、携帯型電
子機器の耐衝撃性、機器表面の保護等の機能を有する。By adopting the above-described embodiment, the storage case has functions such as shock resistance of the portable electronic device and protection of the surface of the device, in addition to heat radiation processing of the portable electronic device.
【００２２】さらに、図３（ａ）に示すように、前記携
帯型電子機器の収納ケース２は、断熱性の良好な断熱層
２５を受熱層２２および伝熱層２３および放熱層２４の
表面に形成する。Further, as shown in FIG. 3A, the storage case 2 of the portable electronic device has a heat insulating layer 25 having good heat insulating properties on the surfaces of the heat receiving layer 22, the heat transfer layer 23 and the heat radiation layer 24. Form.
【００２３】上記の実施の形態をとることにより、断熱
層は携帯型電子機器の筺体表面の体感温度を低減する。By adopting the above embodiment, the heat insulating layer reduces the sensible temperature on the surface of the housing of the portable electronic device.
【００２４】さらに、図３（ｂ）に示すように、前記携
帯型電子機器の収納ケース２の表面に形成する断熱層２
５は、通気性の良好な通気性断熱部材２６からなる。Further, as shown in FIG. 3B, a heat insulating layer 2 formed on the surface of the storage case 2 of the portable electronic device.
5 is made of a gas permeable heat insulating member 26 having good gas permeability.
【００２５】さらに、図３（ｃ）に示すように、前記携
帯型電子機器の収納ケースの表面に形成する断熱層は、
所定間隔に突起を形成して受熱層２２および伝熱層２３
および放熱層２４に直接接触することを禁止する接触防
護体２７からなる。Further, as shown in FIG. 3 (c), the heat insulating layer formed on the surface of the storage case of the portable electronic device includes:
The heat receiving layer 22 and the heat transfer layer 23 are formed with projections at predetermined intervals.
And a contact protector 27 that prohibits direct contact with the heat radiation layer 24.
【００２６】上記の実施の形態をとることにより、断熱
層は受熱層や伝熱層から伝熱された熱を放出するととも
に、筺体表面の体感温度を低減する。By adopting the above-described embodiment, the heat-insulating layer emits heat transferred from the heat-receiving layer and the heat-transfer layer and reduces the sensed temperature of the surface of the housing.
【００２７】さらに、図４（ａ）に示すように、受熱部
および伝熱部および放熱部は、密着性と弾性とを有し所
定の熱容量を確保する容量を持ったパック材３２からな
る。Further, as shown in FIG. 4A, the heat receiving portion, the heat transfer portion and the heat radiating portion are made of a pack material 32 having adhesiveness and elasticity and having a capacity to secure a predetermined heat capacity.
【００２８】さらに、図４（ａ）に示すように、前記パ
ック材３２は、熱伝導性の良好なフィラーあるいは粉末
を混入したゲル・ゾル状またはフロリナート等の絶縁性
の液体を充填しパック表皮３１によって封入する。Further, as shown in FIG. 4 (a), the pack material 32 is filled with an insulating liquid such as a gel sol or florinate mixed with a filler or a powder having good heat conductivity, and the pack surface is filled. 31.
【００２９】さらに、図４（ｂ）に示すように、パック
表皮３１は、薄くて強度を持つ材料からなる薄膜樹脂層
３６と、熱拡散性の良好な材料からなる高い熱伝導性を
有する熱伝導性薄膜部材３５とで多層構造にする。Further, as shown in FIG. 4 (b), the pack skin 31 is composed of a thin resin layer 36 made of a thin and strong material and a heat conductive material made of a material having a good heat diffusion property and having a high thermal conductivity. The conductive thin film member 35 forms a multilayer structure.
【００３０】さらに、図４（ｃ）に示すように、前記パ
ック材は、密着性と弾性とを有し、相応の厚みを持つ熱
伝導シート３７に熱拡散性の良好な材料からなる高い熱
伝導性を有する熱伝導性薄膜部材３８を貼り合わせて多
層構造にする。Further, as shown in FIG. 4 (c), the pack material has adhesiveness and elasticity, and the heat conductive sheet 37 having an appropriate thickness is made of a material having a high heat diffusion property and a high heat diffusion property. A heat conductive thin film member 38 having conductivity is attached to form a multilayer structure.
【００３１】上記の実施の形態をとることにより、パッ
ク材は放熱処理できる熱容量を拡大して携帯型電子機器
が動作している時の温度上昇を抑制する。By adopting the above-described embodiment, the pack material increases the heat capacity capable of radiating heat and suppresses a temperature rise when the portable electronic device is operating.
【００３２】さらに、図６に示すように、放熱部５は、
断熱性の良好な断熱部材４１と、熱拡散性の良好な材料
からなる高い熱伝導性を有する熱伝導性薄膜部材４３と
で多層構造とするとともに、表示部１３との固定におい
ては密着性の低い固定構造とする。Further, as shown in FIG.
A heat insulating member 41 having good heat insulating properties and a heat conductive thin film member 43 having high heat conductivity made of a material having good heat diffusing properties have a multilayer structure. Use a low fixed structure.
【００３３】上記の実施の形態をとることにより、放熱
部は携帯型電子機器への伝熱を抑止するとともに断熱部
材によって筺体表面の体感温度を低減する。By adopting the above-described embodiment, the heat radiating portion suppresses the heat transfer to the portable electronic device and reduces the sensible temperature on the housing surface by the heat insulating member.
【００３４】さらに、図６に示すように、前記放熱部５
は、放熱を促進する多数の小孔またはスリットからなる
通気部４５を表面に形成した断熱部材４２を備える。Further, as shown in FIG.
Is provided with a heat insulating member 42 having on its surface a ventilation portion 45 formed of a number of small holes or slits for promoting heat radiation.
【００３５】さらに、図７に示すように、前記放熱部５
は、断熱部材４２との間に通気路４６を構成する。Further, as shown in FIG.
Constitutes a ventilation path 46 between itself and the heat insulating member 42.
【００３６】上記の実施の形態をとることにより、放熱
部は伝熱部から伝熱された熱を放出するとともに、筺体
表面の体感温度を低減する。By adopting the above-described embodiment, the heat radiating portion emits the heat transferred from the heat transferring portion and reduces the sensible temperature on the surface of the housing.
【００３７】[0037]
【実施例】この発明による代表的な実施例を図１ないし
図７によって説明する。なお、以下において、同じ箇所
は同一の符号を付して有り、詳細な説明を省略すること
がある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A representative embodiment according to the present invention will be described with reference to FIGS. In the following, the same portions are denoted by the same reference numerals, and detailed description may be omitted.
【００３８】図１は本発明の実施例の図を示す。FIG. 1 shows a diagram of an embodiment of the present invention.
【００３９】同図（ａ）において、ノート型パソコン等
の携帯型電子機器１は、本体部１１と、本体部１１に回
動自在に連結される表示部１３と、携帯型電子機器１の
装置表面を覆う収納ケース２とを主構成としている。In FIG. 1A, a portable electronic device 1 such as a notebook personal computer includes a main body 11, a display unit 13 rotatably connected to the main body 11, and a device of the portable electronic device 1. The main configuration is a storage case 2 that covers the surface.
【００４０】本体部１１の内部には実装基板１２を備え
ており、当該実装基板１２の下面には高発熱素子１２ａ
が実装されており、当該高発熱素子１２ａの下面には高
い熱伝導性を有する放熱ラバー１４が装着され、本体部
１１の内面に形成した高い熱伝導性を有する例えば銅箔
やアルミニウム箔等を用いた放熱板１５に熱的に接続し
ている。即ち、高発熱素子１２ａの発熱は筺体底面１６
に伝熱されている。A mounting board 12 is provided inside the main body 11, and a high heat generating element 12a is provided on the lower surface of the mounting board 12.
Is mounted on the lower surface of the high-heat-generating element 12a. A heat-dissipating rubber 14 having high thermal conductivity is mounted on the lower surface of the high-heat-generating element 12a. It is thermally connected to the used heat sink 15. That is, the heat generated by the high heat generating element 12a is
Heat is being transferred to.
【００４１】収納ケース２は、前記の筺体底面１６に設
置される受熱部３と、表示部１３の背面に設置される放
熱部５と、受熱部３と放熱部５とを熱的に接続するフレ
キシブル性と熱伝導性の良好な部材からなる伝熱部４と
で構成する。なお、収納ケース２の詳細な構造は後述す
る。The storage case 2 thermally connects the heat receiving portion 3 installed on the bottom surface 16 of the housing, the heat radiating portion 5 installed on the back of the display portion 13, and the heat receiving portion 3 to the heat radiating portion 5. It comprises a heat transfer section 4 made of a member having good flexibility and heat conductivity. The detailed structure of the storage case 2 will be described later.
【００４２】この構成において、筺体底面１６に伝熱さ
れた高発熱素子１２ａの発熱は、収納ケース２の受熱部
３に受熱され、伝熱部４を介して放熱部５から放熱され
る。In this configuration, the heat generated by the high heat generating element 12 a transmitted to the bottom surface 16 of the housing is received by the heat receiving section 3 of the storage case 2 and is radiated from the heat radiating section 5 through the heat transmitting section 4.
【００４３】また、同図（ｂ）において、携帯型電子機
器１を使用しない時や持ち運ぶ時は、表示部１３を回転
させて本体部１１側に閉じることになる。この時、収納
ケース２は、携帯型電子機器１の表面全体を覆うことで
携帯型電子機器の耐衝撃性や機器表面の保護などの機能
を果たすことになる。In FIG. 2B, when the portable electronic device 1 is not used or when it is carried, the display unit 13 is rotated and closed to the main unit 11 side. At this time, the storage case 2 covers the entire surface of the portable electronic device 1 to perform functions such as impact resistance of the portable electronic device and protection of the device surface.
【００４４】図２は本発明の実施例の図を示す。FIG. 2 shows a diagram of an embodiment of the present invention.
【００４５】同図（ａ）において、ノート型パソコン等
の携帯型電子機器１は、本体部１１と、本体部１１に回
動自在に連結される保護カバー１８と、携帯型電子機器
１の装置表面を覆う収納ケース２とを主構成としてい
る。In FIG. 1A, a portable electronic device 1 such as a notebook computer has a main body 11, a protective cover 18 rotatably connected to the main body 11, and a device of the portable electronic device 1. The main configuration is a storage case 2 that covers the surface.
【００４６】本体部１１は前述の図１で示した高発熱素
子１２ａが実装されており、高発熱素子１２ａの発熱は
筺体底面１６に伝熱されている。また、本体部１１はタ
ッチパネル等からなる表示部１３を備えている。さら
に、保護カバー１８は、携帯型電子機器１を使用しない
時に表示部１３を覆うことで表示面を保護することがで
きる。The high heat generating element 12a shown in FIG. 1 is mounted on the main body 11, and the heat generated by the high heat generating element 12a is transmitted to the bottom surface 16 of the housing. Further, the main body unit 11 includes a display unit 13 including a touch panel or the like. Further, the protective cover 18 can protect the display surface by covering the display unit 13 when the portable electronic device 1 is not used.
【００４７】この構成において、筺体底面１６に伝熱さ
れた高発熱素子１２ａの発熱は、収納ケース２の受熱部
３に受熱され、伝熱部４を介して保護カバー１８の背面
に設置した放熱部５から放熱される。In this configuration, the heat generated by the high heat generating element 12 a transferred to the bottom surface 16 of the housing is received by the heat receiving portion 3 of the storage case 2, and the heat is disposed on the back of the protective cover 18 via the heat transferring portion 4. The heat is radiated from the part 5.
【００４８】同図（ｂ）において、ノート型パソコン等
の携帯型電子機器１は、本体部１１と、携帯型電子機器
１の装置表面を覆う収納ケース２とを主構成としてい
る。In FIG. 1B, a portable electronic device 1 such as a notebook personal computer has a main body 11 and a storage case 2 that covers the surface of the portable electronic device 1.
【００４９】本体部１１は前述の図１で示した高発熱素
子１２ａが実装されており、高発熱素子１２ａの発熱は
筺体底面１６に伝熱されている。また、本体部１１はタ
ッチパネル等からなる表示部１３を備えている。収納ケ
ース２の受熱部３は筺体底面１６に設置され、放熱部５
は本体部１１から延長して形成されている。The high heat generating element 12a shown in FIG. 1 is mounted on the main body 11, and the heat generated by the high heat generating element 12a is transmitted to the bottom surface 16 of the housing. Further, the main body unit 11 includes a display unit 13 including a touch panel or the like. The heat receiving portion 3 of the storage case 2 is installed on the bottom surface 16 of the housing, and the heat radiating portion 5 is provided.
Is formed to extend from the main body 11.
【００５０】携帯型電子機器１を手に持って使用する時
は、放熱部５は携帯型電子機器１の下方に吊り下がった
状態となる。また、携帯型電子機器１を机等に設置して
使用する時は、図２（ｃ）に示すように、放熱部５は本
体部１１の後方に配置することになる。When the portable electronic device 1 is used while being held in hand, the heat radiating portion 5 is in a state of being suspended below the portable electronic device 1. When the portable electronic device 1 is installed on a desk or the like and used, the heat radiating section 5 is arranged behind the main body 11 as shown in FIG.
【００５１】図３は本発明の実施例の図を示す。FIG. 3 shows a diagram of an embodiment of the present invention.
【００５２】同図（ａ）において、収納ケース２は、受
熱層２２および伝熱層２３および放熱層２４の表面両側
に表面層２１を形成している。さらに収納ケース２が携
帯型電子機器１の表面を覆った時の収納ケース２の表面
側には、断熱性の良好な断熱層２５を形成して、収納ケ
ース２で覆われた携帯型電子機器の筺体表面の体感温度
を低減するものである。In FIG. 5A, the storage case 2 has surface layers 21 on both sides of the heat receiving layer 22, the heat transfer layer 23, and the heat radiation layer 24. Further, on the front side of the storage case 2 when the storage case 2 covers the surface of the portable electronic device 1, a heat insulating layer 25 having good heat insulating properties is formed, and the portable electronic device covered with the storage case 2 is formed. To reduce the perceived temperature on the surface of the housing.
【００５３】また、同図（ｂ）において、前述の断熱層
２５を通気性の良好な例えば発泡樹脂部材からなる通気
性断熱部材２６で形成することができる。さらに、同図
（ｃ）において、前述の断熱層２５を所定間隔に突起を
形成して受熱層２２および伝熱層２３および放熱層２４
に指が直接接触することを禁止する接触防護体２７で形
成することができる。この接触防護体２７は、断熱性の
良好な材料で形成され、先端に球面を備えた突起部を散
点状に配置して形成してもよい。また、碁盤目を有した
板状の突起部を配置してもよい。In FIG. 5B, the heat insulating layer 25 can be formed of a gas permeable heat insulating member 26 having good air permeability, for example, a foamed resin member. Further, in FIG. 2C, the heat-receiving layer 22, the heat-conducting layer 23, and the heat-radiating layer
Can be formed by a contact protection body 27 that prohibits a finger from directly contacting the contact protection member. The contact protection body 27 may be formed of a material having good heat insulating properties, and may be formed by arranging projections having spherical surfaces at the tips in a scattered manner. Further, a plate-shaped projection having a grid may be arranged.
【００５４】この構成において、受熱層や伝熱層から伝
熱された熱を放出するとともに、筺体表面の体感温度を
低減するものである。In this configuration, the heat transmitted from the heat receiving layer and the heat transfer layer is released, and the sensible temperature on the surface of the housing is reduced.
【００５５】図４は本発明の実施例の図を示す。FIG. 4 shows a diagram of an embodiment of the present invention.
【００５６】同図（ａ）において、前述の受熱部３およ
び伝熱部４は、密着性と弾性とを有し所定の熱容量を確
保する容量を持ったパック材３２をパック表皮３１で包
みこんでいる。パック材３２は、例えば熱伝導性の良好
なフィラーあるいは粉末を混入したゲル・ゾル状または
フロリナート等の絶縁性の液体を充填することが好まし
い。In FIG. 5A, the above-described heat receiving portion 3 and heat transfer portion 4 enclose a pack material 32 having adhesiveness and elasticity and having a capacity to secure a predetermined heat capacity in a pack skin 31. In. The packing material 32 is preferably filled with an insulating liquid such as a gel sol or a florinate mixed with a filler or powder having good thermal conductivity.
【００５７】なお、フロリナート中にフィラーや粉末を
混入すると、比重の違いにより偏りが生じる。このた
め、図５に示すように、パック材３２を小分けして、例
えば千鳥状に配列することが好ましい。これにより、伝
熱成分の偏りによる伝熱性の低下が抑えられる。When fillers or powders are mixed in Fluorinert, bias occurs due to a difference in specific gravity. For this reason, as shown in FIG. 5, it is preferable to divide the pack materials 32 into small parts and arrange them in a staggered pattern, for example. As a result, a decrease in the heat transfer property due to the bias of the heat transfer component is suppressed.
【００５８】さらに、図４（ｂ）において、パック表皮
３１は、薄くて引張応力や耐熱性が大きく、さらに耐化
学変化に強い性質を有する材料で、例えばカプトンを使
用した薄膜樹脂層３６と、熱拡散性の良好な材料で、例
えばアルミニウム箔や銅箔からなる高い熱伝導性を有す
る熱伝導性薄膜部材３５とで多層構造にする。Further, in FIG. 4 (b), the pack skin 31 is a thin material having high tensile stress and heat resistance and a property resistant to chemical change. It is made of a material having good thermal diffusivity and has a multilayer structure with a heat conductive thin film member 35 made of, for example, aluminum foil or copper foil and having high heat conductivity.
【００５９】また、図４（ｃ）において、前記パック材
は、密着性と弾性とを有し、相応の厚みを持つ熱伝導シ
ート３７と、熱拡散性の良好な材料で、例えばアルミニ
ウム箔や銅箔からなる高い熱伝導性を有する熱伝導性薄
膜部材３８とを互いに貼り合わせて多層構造にすること
もできる。In FIG. 4C, the pack material has adhesiveness and elasticity, and a heat conductive sheet 37 having an appropriate thickness and a material having a good heat diffusion property such as aluminum foil or the like. A heat conductive thin film member 38 made of copper foil and having high heat conductivity can be bonded to each other to form a multilayer structure.
【００６０】この構成において、パック材は、放熱処理
できる熱容量を拡大して携帯型電子機器が動作している
時の温度上昇を抑制するものである。In this configuration, the pack material expands the heat capacity capable of radiating heat and suppresses a rise in temperature when the portable electronic device is operating.
【００６１】図６は本発明の実施例の図を示す。FIG. 6 shows a diagram of an embodiment of the present invention.
【００６２】同図において、表示部１３の背面に設置さ
れる放熱部５は、表示部１３の背面側に断熱性の良好な
断熱部材４１を形成している。また、断熱部材４１には
突起部４４を設けて表示部１３の背面との接触面積を小
さくして、適当な着脱可能な固定手段によって固定され
ている。In the figure, the heat radiating section 5 installed on the back of the display section 13 has a heat insulating member 41 having good heat insulating properties formed on the back side of the display section 13. Further, the heat insulating member 41 is provided with a protrusion 44 to reduce the contact area with the back surface of the display unit 13 and is fixed by a suitable detachable fixing means.
【００６３】また、放熱部５の表面側には、熱拡散性の
良好な材料で、例えばアルミニウム箔や銅箔からなる高
い熱伝導性を有する熱伝導性薄膜部材４３を形成し、熱
伝導性薄膜部材４３の表面側には、放熱を促進するため
に多数の小孔またはスリットからなる通気部４５を形成
した断熱部材４２を形成している。On the surface side of the heat radiating portion 5, a heat conductive thin film member 43 made of a material having good heat diffusion property, for example, made of aluminum foil or copper foil and having high heat conductivity is formed. On the surface side of the thin film member 43, a heat insulating member 42 having a ventilation portion 45 formed of a large number of small holes or slits is formed to promote heat radiation.
【００６４】この構成において、放熱部５は、表示部１
３への伝熱をしにくくするとともに断熱部材によって筺
体表面の体感温度を低減するとともに、伝熱部４から伝
熱された熱を放出するものである。なお、前述の伝熱部
４が放熱機能を有している場合は、前記の熱伝導性薄膜
部材４３を必ずしも設ける必要はない。In this configuration, the heat radiating section 5 includes the display section 1
In addition to reducing the heat transfer to the heat transfer member 4 and reducing the sensible temperature on the surface of the housing by the heat insulating member, the heat transfer portion 4 releases the heat transferred from the heat transfer portion 4. When the heat transfer section 4 has a heat dissipation function, the heat conductive thin film member 43 does not always need to be provided.
【００６５】図７は本発明の実施例の図を示す。FIG. 7 shows a diagram of an embodiment of the present invention.
【００６６】同図において、放熱部５の表面側に形成し
た断熱部材４２と放熱機能を有した伝熱部４との間に、
下部に吸気孔を形成し、上部に排気孔を形成した通気路
４６を形成している。これにより、断熱部材４２によっ
て筺体表面の体感温度を低減するとともに、通気路４６
によって伝熱部４に伝熱された熱を自然対流によって放
出するものである。In the same figure, between a heat insulating member 42 formed on the surface side of the heat radiating section 5 and the heat transfer section 4 having a heat radiating function,
An air passage 46 having an intake hole formed at a lower portion and an exhaust hole formed at an upper portion is formed. Thereby, the heat sensing temperature on the surface of the housing is reduced by the heat insulating member 42 and the ventilation passage 46 is formed.
The heat transferred to the heat transfer section 4 is released by natural convection.
【００６７】[0067]
【発明の効果】以上説明したように本発明によれば、次
に示すような効果が期待できる。As described above, according to the present invention, the following effects can be expected.
【００６８】装置表面を覆う携帯型電子機器の収納ケー
スであって、受熱部と放熱部とを形成し、受熱部と放熱
部とを伝熱部で接続することにより、携帯型電子機器の
装置表面全体を受熱部や放熱部として使用することで、
筺体表面温度を低減するとともに、携帯型電子機器の放
熱処理を向上させることができる。A storage case for a portable electronic device which covers the surface of the device, wherein a heat receiving portion and a heat radiating portion are formed, and the heat receiving portion and the heat radiating portion are connected by a heat transfer portion, whereby the device of the portable electronic device is formed. By using the entire surface as a heat receiving part and a heat radiating part,
The surface temperature of the housing can be reduced, and the heat radiation processing of the portable electronic device can be improved.
【００６９】さらに、前記携帯型電子機器の収納ケース
は、受熱部を高発熱素子が内蔵された本体部の筺体底面
に設置され、放熱部を表示部あるいは保護カバーの背面
に設置するか、または本体部から延長して形成すること
により、携帯型電子機器の放熱処理に加えて、携帯型電
子機器の耐衝撃性、機器表面の保護等の機能を有するこ
とができる。Further, in the storage case of the portable electronic device, the heat receiving portion is installed on the bottom surface of the housing of the main body in which the high heat generating element is built, and the heat radiating portion is installed on the back of the display portion or the protective cover, or By being formed to extend from the main body, in addition to the heat radiation treatment of the portable electronic device, the portable electronic device can have functions such as impact resistance and protection of the device surface.
【００７０】さらに、前記携帯型電子機器の収納ケース
は、断熱性の良好な断熱層を受熱層や伝熱層あるいは放
熱層の表面に形成することにより、携帯型電子機器の筺
体表面の体感温度を低減することができる。Further, in the storage case of the portable electronic device, by forming a heat insulating layer having good heat insulating properties on the surface of the heat receiving layer, the heat transfer layer or the heat radiation layer, the sensible temperature of the housing surface of the portable electronic device can be improved. Can be reduced.
【００７１】さらに、前記携帯型電子機器の収納ケース
の表面に形成する断熱層は、通気性の良好な通気性断熱
部材とする。または、所定間隔に突起を形成して受熱層
および伝熱層あるいは放熱層に直接接触することを禁止
する接触防護体とすることにより、受熱層や伝熱層から
伝熱された熱を放出するとともに、筺体表面の体感温度
を低減することができる。Further, the heat insulating layer formed on the surface of the storage case of the portable electronic device is a gas permeable heat insulating member having good air permeability. Alternatively, by forming protrusions at predetermined intervals to form a contact protector that prohibits direct contact with the heat receiving layer and the heat transfer layer or the heat dissipation layer, the heat transferred from the heat reception layer or the heat transfer layer is released. At the same time, the sensible temperature on the housing surface can be reduced.
【００７２】さらに、受熱部や伝熱部あるいは放熱部
は、密着性と弾性とを有し所定の熱容量を確保する容量
を持ったパック材とする。パック材は、パック表皮に熱
伝導性の良好なフィラーあるいは粉末を混入したゲル・
ゾル状または絶縁性の液体を充填する。さらに、パック
表皮は、薄くて強度を持つ材料からなる薄膜樹脂層と、
熱拡散性の良好な熱伝導性薄膜部材とで多層構造にす
る。また、前記パック材は、密着性と弾性とを有し、相
応の厚みを持つ熱伝導シートに熱拡散性の良好な熱伝導
性薄膜部材を貼り合わせて多層構造にすることにより、
放熱処理できる熱容量を拡大して携帯型電子機器が動作
している時の温度上昇を抑制することができる。Further, the heat receiving portion, the heat transfer portion or the heat radiating portion is made of a pack material having adhesiveness and elasticity and having a capacity to secure a predetermined heat capacity. Packing material is gel / gel with good heat conductive filler or powder mixed into the packing skin.
Fill with sol or insulating liquid. Furthermore, the pack skin has a thin resin layer made of a thin and strong material,
A multilayer structure is formed with a heat conductive thin film member having good thermal diffusivity. In addition, the pack material has adhesiveness and elasticity, and a heat conductive sheet having an appropriate thickness is bonded to a heat conductive thin film member having good heat diffusion to form a multilayer structure.
By increasing the heat capacity that can perform the heat radiation processing, it is possible to suppress a rise in temperature when the portable electronic device is operating.
【００７３】さらに、放熱部は、断熱性の良好な断熱部
材と、熱拡散性の良好な材料からなる高い熱伝導性を有
する熱伝導性薄膜部材とで多層構造とするとともに、表
示部との固定においては密着性の低い固定構造とするこ
とにより、携帯型電子機器への伝熱を抑止するとともに
断熱部材によって筺体表面の体感温度を低減することが
できる。Further, the heat radiating portion has a multilayer structure including a heat insulating member having good heat insulating properties and a heat conductive thin film member having high heat conductivity made of a material having good heat diffusing properties. In the fixing, a fixing structure having low adhesion can suppress the heat transfer to the portable electronic device and reduce the sensible temperature of the housing surface by the heat insulating member.
【００７４】さらに、前記放熱部は、通気部を表面に形
成した断熱部材を備える。また、断熱部材との間に通気
路を構成することにより、伝熱部から伝熱された熱を放
出するとともに、筺体表面の体感温度を低減することが
できる。Further, the heat radiating section includes a heat insulating member having a ventilation section formed on the surface. In addition, by forming a ventilation path between the heat-insulating member and the heat-insulating member, the heat transmitted from the heat-transfer portion can be released, and the sensible temperature on the surface of the housing can be reduced.
【図１】本発明の実施例の図である。FIG. 1 is a diagram of an embodiment of the present invention.
【図２】本発明の実施例の図である。FIG. 2 is a diagram of an embodiment of the present invention.
【図３】本発明の実施例の図である。FIG. 3 is a diagram of an embodiment of the present invention.
【図４】本発明の実施例の図である。FIG. 4 is a diagram of an embodiment of the present invention.
【図５】本発明の実施例の図である。FIG. 5 is a diagram of an embodiment of the present invention.
【図６】本発明の実施例の図である。FIG. 6 is a diagram of an embodiment of the present invention.
【図７】本発明の実施例の図である。FIG. 7 is a diagram of an embodiment of the present invention.
【図８】従来技術の図である。FIG. 8 is a diagram of the prior art.
１：携帯型電子機器 ２：収納ケース ３：受熱部 ４：伝熱部 ５：放熱部 １１：本体部 １２ａ：高発熱素子 １３：表示部 １６：筺体底面 １７：保護カバー ２２：受熱層 ２３：伝熱層 ２４：放熱層 ２５：断熱層 ２６：通気性断熱部材 ２７：接触防護体 ３１：パック表皮 ３２：パック材 ３５，３８，４３：熱伝導性薄膜部材 ３６：薄膜樹脂層 ３７：熱伝導シート ４１，４２：断熱部材 ４４：突起部 ４５：通気部 ４６：通気路 1: Portable electronic device 2: Storage case 3: Heat receiving section 4: Heat transfer section 5: Heat radiating section 11: Main body section 12a: High heat generating element 13: Display section 16: Housing bottom 17: Protective cover 22: Heat receiving layer 23: Heat transfer layer 24: Heat dissipating layer 25: Heat insulating layer 26: Air permeable heat insulating member 27: Contact protective body 31: Pack skin 32: Pack material 35, 38, 43: Heat conductive thin film member 36: Thin film resin layer 37: Heat conduction Sheets 41, 42: heat insulating member 44: protrusion 45: ventilation section 46: ventilation path
Claims (14)
ス（２）であって、 受熱部（３）と放熱部（５）とを形成し、 受熱部と放熱部とをフレキシブル性と熱伝導性の良好な
部材からなる伝熱部（４）で接続する、 ことを特徴とする携帯型電子機器の収納ケース。1. A storage case (2) for a portable electronic device covering a surface of a device, wherein a heat receiving part (3) and a heat radiating part (5) are formed, and the heat receiving part and the heat radiating part are formed with flexibility and heat. A storage case for a portable electronic device, wherein the case is connected by a heat transfer part (4) made of a member having good conductivity.
は、 受熱部（３）を高発熱素子が内蔵された本体部（１１）
の筺体底面（１６）に設置され、放熱部（５）を本体部
（１１）に開閉自在に連結された表示部（１３）の背面
に設置される、 ことを特徴とする請求項１に記載の携帯型電子機器の収
納ケース。2. A storage case (2) for the portable electronic device.
The heat receiving part (3) is a main body part (11) in which a high heat generating element is incorporated.
2. The display device according to claim 1, wherein the display unit is disposed on a bottom surface of the display unit, and the heat radiating unit is disposed on a back surface of the display unit, the radiator unit being openably and closably connected to the main body unit. Storage case for portable electronic devices.
は、 受熱部（３）を高発熱素子と表示部（１３）とを備える
本体部（１１）の筺体底面（１６）に設置され、放熱部
（５）を本体部（１１）に開閉自在に連結された表示部
（１３）を覆う保護カバー（１８）の背面に設置され
る、 ことを特徴とする請求項１に記載の携帯型電子機器の収
納ケース。3. A storage case (2) for said portable electronic device.
The heat receiving part (3) is installed on the bottom surface (16) of the main body (11) including the high heat generating element and the display part (13), and the heat radiating part (5) can be opened and closed on the main body (11). The storage case for a portable electronic device according to claim 1, wherein the storage case is installed on a back surface of a protective cover (18) that covers the connected display unit (13).
は、 受熱部（３）を高発熱素子と表示部（１３）とを備える
本体部（１１）の筺体底面（１６）に設置され、放熱部
（５）を本体部（１１）から延長して形成される、 ことを特徴とする請求項１に記載の携帯型電子機器の収
納ケース。4. A storage case (2) for the portable electronic device.
The heat receiving part (3) is installed on the bottom surface (16) of the main body (11) including the high heat generating element and the display part (13), and the heat radiating part (5) is extended from the main body (11). The storage case for a portable electronic device according to claim 1, wherein the storage case is formed.
は、 断熱性の良好な断熱層（２５）を受熱層（２２）または
／および伝熱層（２３）または／および放熱層（２４）
の表面に形成する、 ことを特徴とする請求項１ないし請求項４のいずれか１
項記載の携帯型電子機器の収納ケース。5. A storage case (2) for the portable electronic device.
A heat-receiving layer (22) or / and a heat-conducting layer (23) or / and a heat-dissipating layer (24)
5. The method according to claim 1, wherein:
A storage case for a portable electronic device according to the item.
形成する断熱層（２５）は、 通気性の良好な材料からなる通気性断熱部材（２６）か
らなる、 ことを特徴とする請求項５に記載の携帯型電子機器の収
納ケース。6. The heat insulating layer (25) formed on the surface of the storage case of the portable electronic device comprises a gas permeable heat insulating member (26) made of a material having good air permeability. A storage case for the portable electronic device according to 5.
形成する断熱層は、 所定間隔に突起を形成して受熱層（２２）または／およ
び伝熱層（２３）または／および放熱層（２４）に直接
接触することを禁止する接触防護体（２７）からなる、 ことを特徴とする請求項５に記載の携帯型電子機器の収
納ケース。7. A heat insulating layer formed on the surface of the storage case of the portable electronic device, wherein protrusions are formed at predetermined intervals to form a heat receiving layer (22) and / or a heat transfer layer (23) or / and a heat radiation layer ( The storage case for a portable electronic device according to claim 5, further comprising a contact protection body (27) for inhibiting direct contact with (24).
（４）または／および放熱部（５）は、 密着性と弾性とを有し所定の熱容量を確保する容量を持
ったパック材（３２）からなる、 ことを特徴とする請求項１に記載の携帯型電子機器の収
納ケース。8. A pack material having a heat-receiving part (3) and / or a heat-transfer part (4) and / or a heat-dissipating part (5) which has adhesiveness and elasticity and has a capacity to secure a predetermined heat capacity. The storage case for a portable electronic device according to claim 1, comprising: (32).
・ゾル状または絶縁性の液体を充填しパック表皮（３
１）によって封入する、 ことを特徴とする請求項８に記載の携帯型電子機器の収
納ケース。9. The packing material (32) is filled with a gel sol or an insulating liquid mixed with a filler or a powder having good thermal conductivity, and is filled with a packing skin (3).
The storage case for a portable electronic device according to claim 8, wherein the case is enclosed by 1).
熱拡散性の良好な材料からなる高い熱伝導性を有する熱
伝導性薄膜部材（３５）とで多層構造にする、 ことを特徴とする請求項８に記載の携帯型電子機器の収
納ケース。10. The pack skin (31) includes a thin resin layer (36) made of a thin and strong material;
The storage case for a portable electronic device according to claim 8, wherein a multilayer structure is formed by a heat conductive thin film member (35) having a high thermal conductivity made of a material having good heat diffusion properties.
（３７）に熱拡散性の良好な材料からなる高い熱伝導性
を有する熱伝導性薄膜部材（３８）を貼り合わせて多層
構造にする、 ことを特徴とする請求項８に記載の携帯型電子機器の収
納ケース。11. The pack material (32) has adhesiveness and elasticity, and a heat conductive sheet (37) having an appropriate thickness has a high thermal conductivity made of a material having good thermal diffusivity. The storage case for a portable electronic device according to claim 8, wherein the conductive thin film member (38) is bonded to form a multilayer structure.
材料からなる高い熱伝導性を有する熱伝導性薄膜部材
（４３）とで多層構造とするとともに、表示部（１３）
との固定においては密着性の低い固定構造とする、 ことを特徴とする請求項１または請求項２に記載の携帯
型電子機器の収納ケース。12. The heat dissipating part (5) includes a heat insulating member (41) having good heat insulating properties and a heat conductive thin film member (43) made of a material having good heat diffusing properties and having high thermal conductivity. Display unit (13) with multi-layer structure
The storage case for a portable electronic device according to claim 1, wherein the storage case has a fixed structure having low adhesion.
部（４５）を表面に形成した断熱部材（４２）を備え
る、 ことを特徴とする請求項１２に記載の携帯型電子機器の
収納ケース。13. The heat radiating portion (5) includes a heat insulating member (42) having a ventilation portion (45) formed of a large number of small holes or slits formed on a surface thereof for promoting heat radiation. A storage case for a portable electronic device according to claim 12.
収納ケース。14. The storage case for a portable electronic device according to claim 12, wherein the heat radiating portion (5) forms a ventilation path (46) between the heat radiating portion (5) and the heat insulating member (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34625797A JPH11177264A (en) | 1997-12-16 | 1997-12-16 | Accommodation case for portable electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34625797A JPH11177264A (en) | 1997-12-16 | 1997-12-16 | Accommodation case for portable electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11177264A true JPH11177264A (en) | 1999-07-02 |
Family
ID=18382181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34625797A Pending JPH11177264A (en) | 1997-12-16 | 1997-12-16 | Accommodation case for portable electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11177264A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006024608A (en) * | 2004-07-06 | 2006-01-26 | Central Res Inst Of Electric Power Ind | Heat transfer cushion and thermoelectric conversion module provided therewith |
| US7155914B2 (en) | 2003-03-12 | 2007-01-02 | Fujitsu Limited | Cooling structure for electronic equipment |
| WO2007015521A1 (en) * | 2005-08-03 | 2007-02-08 | Matsushita Electric Industrial Co., Ltd. | Electronic device |
| JP2012503890A (en) * | 2008-09-26 | 2012-02-09 | パーカー．ハニフィン．コーポレイション | Thermally conductive gel pack |
| JP2012186692A (en) * | 2011-03-07 | 2012-09-27 | Shin Etsu Polymer Co Ltd | Cover member for electronic apparatus, and battery lid |
| US20130027886A1 (en) * | 2011-07-26 | 2013-01-31 | Crooijmans Wilhelmus | Thermal conductors in electronic devices |
| WO2018078796A1 (en) * | 2016-10-28 | 2018-05-03 | 三菱電機株式会社 | Cooling device |
-
1997
- 1997-12-16 JP JP34625797A patent/JPH11177264A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7155914B2 (en) | 2003-03-12 | 2007-01-02 | Fujitsu Limited | Cooling structure for electronic equipment |
| JP2006024608A (en) * | 2004-07-06 | 2006-01-26 | Central Res Inst Of Electric Power Ind | Heat transfer cushion and thermoelectric conversion module provided therewith |
| WO2007015521A1 (en) * | 2005-08-03 | 2007-02-08 | Matsushita Electric Industrial Co., Ltd. | Electronic device |
| JP2012503890A (en) * | 2008-09-26 | 2012-02-09 | パーカー．ハニフィン．コーポレイション | Thermally conductive gel pack |
| JP2012186692A (en) * | 2011-03-07 | 2012-09-27 | Shin Etsu Polymer Co Ltd | Cover member for electronic apparatus, and battery lid |
| US20130027886A1 (en) * | 2011-07-26 | 2013-01-31 | Crooijmans Wilhelmus | Thermal conductors in electronic devices |
| US8675363B2 (en) * | 2011-07-26 | 2014-03-18 | Hewlett-Packard Development Company, L.P. | Thermal conductors in electronic devices |
| WO2018078796A1 (en) * | 2016-10-28 | 2018-05-03 | 三菱電機株式会社 | Cooling device |
| JPWO2018078796A1 (en) * | 2016-10-28 | 2019-04-18 | 三菱電機株式会社 | Cooling system |
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