JP4006795B2 - Information processing apparatus having heat dissipation structure - Google Patents

Information processing apparatus having heat dissipation structure Download PDF

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Publication number
JP4006795B2
JP4006795B2 JP30838597A JP30838597A JP4006795B2 JP 4006795 B2 JP4006795 B2 JP 4006795B2 JP 30838597 A JP30838597 A JP 30838597A JP 30838597 A JP30838597 A JP 30838597A JP 4006795 B2 JP4006795 B2 JP 4006795B2
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Prior art keywords
heat
information processing
processing apparatus
heat dissipation
case
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JP30838597A
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JPH11143585A (en
Inventor
功 村上
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明はＣＰＵ等の発熱部品を内蔵し、この放熱のための放熱構造を有するポータブルコンピューター等の情報処理装置に関するものである。
【０００２】
【従来の技術】
従来、ポータブルコンピューターなどの情報処理装置は内部にＣＰＵなどの発熱を伴う部品を有しており、発熱が他の部品等に与える影響を防止するため、種々の放熱のための構造を有している。
【０００３】
従来の放熱構造を有する情報処理装置の内部構成を図３に示す。
図３において、３１は発熱部品であるＣＰＵ、３２はＣＰＵ３１と金属製の放熱板３３との間に密着して設けられる放熱ゴム、３４は金属製のヒートシンク３５に保持されるヒートパイプで、ＣＰＵ３１に先端を接触させている。さらにヒートパイプ３４とこれを保持したヒートシンク３５を樹脂製の本体ケース３６の側面に設けられた空冷ファンモータ３７の近傍まで延ばして配置している。
【０００４】
ＣＰＵ３１から発生する熱は、放熱板３３によって放熱されるとともに、ヒートパイプ３４を介してヒートシンク３５に伝達され、ヒートシンク３５から放熱される。そして、これらの熱は空冷ファンモータ３７により、強制的に外部に放出される。
【０００５】
【発明が解決しようとする課題】
しかしこのような放熱構造を有する情報処理装置においては、効率的な放熱を行なうことができる面積が限られており、十分な自然対流放熱が実現できないため、空冷ファンモータ等の設置による強制放熱が必要であった。
【０００６】
さらにこのような放熱構造においては、ヒートパイプやヒートシンクの配置された部分が局部的に熱くなるため、外装ケースやその付近の部品が熱的な悪影響を受けないように対策を行なう必要があった。
【０００７】
本発明は、発熱部品の熱を局部的に熱くすることなく均等に分散させると同時に放熱面積を広げて、効率的に自然対流放熱ができる放熱構造を有する情報処理装置を提供することを目的とする。
【０００８】
【課題を解決するための手段】
この課題を解決するために本発明は、情報処理装置本体の外装ケースを金属製としヒートシンクとして利用するとともに、ヒートパイプを発熱部品からの受熱部では外装ケースから浮かせて配置し、それ以外の部分では外装ケースに直接または放熱板を介して密着させて配置するものである。
【０００９】
この発明によれば、発熱部品の熱を局部的に熱くすることなく均等に分散させると同時に放熱面積を広げることができ、効率的に自然対流放熱ができる放熱構造が得られる。
【００１０】
【発明の実施の形態】
本発明の請求項１に記載の発明の情報処理装置は、外装ケースを発熱部品の放熱のためのヒートシンクとした情報処理装置であって、前記外装ケース内面と発熱部品に接触し前記発熱部品の熱を前記外装ケースに伝達するヒートパイプとを備え、前記ヒートパイプを前記発熱部品からの受熱部では前記外装ケースから浮かせて配置し、それ以外の部分では前記外装ケースに直接密着させて配置して、さらに前記外装ケースには立壁を設け、前記ヒートパイプの少なくとも１箇所に取り付けまたは接触させたＬ字の放熱板を前記外装ケースの底面と前記立壁の両方に密着して配置することを特徴とする放熱構造を有するもので、以下のような作用を有する。つまり、この構成により外装ケースがヒートパイプからの熱を分散して受け取ることができるので、外装ケースが均一に熱せられる。さらに外装ケースであるため広い範囲で直接外気と触れることができ、情報処理装置内部の熱を大量に放熱できる。この結果、空冷ファンモータ等による強制放熱の手段を必要とすることなく、効率的に自然対流放熱ができる放熱構造を得ることができる。また、この構成により、直接およびＬ字の放熱板を介して外装ケースとヒートパイプの接触面積を増大させることができ、この結果ヒートパイプから外装ケースへの放熱量を増加させるという作用を有する。
【００１２】
請求項２に記載の発明は、請求項１記載の放熱構造を有する情報処理装置において、外装ケースの少なくとも発熱部品に接近した外装面を、薄い断熱性のシートで覆うことを特徴とするもので、以下のような作用を有する。つまり、金属製であるため、熱伝導率が大きく同じ温度でも感覚的に樹脂よりは熱く感じる外装ケースの外装面を薄い樹脂製のシートで覆うことで、金属をそのまま外装面とする場合と比べて外装ケースをさらに熱くし外気との温度差を大きくすることができ、外気への放熱効率を向上させるという作用を有する。
【００１３】
以下、本発明の実施の形態について、図１および図２を用いて説明する。
（実施の形態１）
図１は本発明の実施の形態による放熱構造を有する情報処理装置の内部構成を示す平面、および側面より視た構成図である。図１において、１は情報処理装置本体の底面側の外装ケースであり、金属製で、材料としては軽くできる点からマグネシウム合金が好ましい。
【００１４】
そして、外装ケースの内部は以下に示すような構成とする。つまり、内蔵する回路基板２に実装された発熱部品であるＣＰＵ３の天面に放熱ゴム４を接触させ、さらに放熱板５との間にヒートパイプ６をはさみ込んだ構成のブロック７を放熱ゴム４と接触させて配置する。放熱板５およびブロック７は金属製で、好ましくは銅またはアルミニウムにより構成される。また本実施の形態では、ヒートパイプ６を確実に保持するために、放熱板５をヒートパイプ６をはさみ込んだ状態でブロック７にかしめる構造をとっている。そしてこの構成により、ＣＰＵ３の熱を効率的にヒートパイプ６に伝えることができる。
【００１５】
次にヒートパイプ６は、図１に示すようにＵ字の形状をしており、放熱板５とブロック７にはさみ込まれた受熱部６ａはＵ字のほぼ真ん中に位置する。またこの受熱部６ａの付近では、ヒートパイプに高さ方向の曲げ加工が施されている。この構成によりヒートパイプ６を、受熱部６ａでは外装ケース１の内面と接触することなく浮いた状態にし、両端部を含むそれ以外の部分では外装ケース１に密着させた状態に配置することができる。
【００１６】
なお本実施の形態では、受熱部６ａの周囲においてはヒートパイプ６の下側に放熱板５を配置しているが、この放熱板５も外装ケース１に対し、ねじ締めによる固定部以外は接触しないように配置している。この結果、相対的に温度が高いヒートパイプ６の受熱部６ａより集中して外装ケース１に熱を伝えるのではなく、熱源が分散されて外装ケース１にほぼ均等に熱を伝えることができ、外装ケース１から外気への放熱が有利になるばかりでなく、情報処理装置本体に内蔵するハードディスクユニットやバッテリー等の熱に弱い要素部品に特別な放熱対策をおこなう必要がなく比較的自由に配置ができる点でも優れている。
【００１７】
さらに本実施の形態においては、ヒートパイプ６の片方の端を放熱板８により外装ケース１に押しつけるように固定する。そして放熱板８はＬ字の形状をしており、外装ケース１の底面と立壁の両方に密着するように外装ケース１にねじ締めして固定する。またヒートパイプ６のもう一方の端は、Ｌ字の形状をした放熱板９がかしめによって取り付けられており、この放熱板９も外装ケース１の底面と立壁の両方に密着するように同様に外装ケース１にねじ締めして固定している。そしてこの構成により、直接および放熱板を介して外装ケース１とヒートパイプ６の接触面積を増大させ、より効率的に外装ケース１に熱を伝えることができる。
【００１８】
以上の結果、発熱部品の熱をヒートパイプから外装ケース、さらに外気へと最適な条件で伝えることができ、空冷ファンモータ等による強制放熱の手段を利用しなくても効率的な自然対流放熱が実現できるのである。そして、空冷ファンモータを内蔵しないため、空冷ファンモータによる騒音や振動の発生がなく静かで品位の高い情報処理装置を提供できる。さらに衝撃に弱い空冷ファンモータを使用しないことや外装ケースに通風孔をあける必要がないことは、フィールド用の情報処理装置に要求される耐衝撃、防塵、防水設計の点からも有利である。
【００１９】
（実施の形態２）
また、図２に示すような実施の形態では、外装ケース１の外装底面１ａのうちヒートパイプ６を配置する面をすべてカバーするように薄い樹脂製のシート１０を両面テープで貼り付けている。シート１０は、好ましくは耐熱性や難燃性が良好なＰＶＣまたはポリカーボネートを使用し、薄さも外気への放熱効率をそこなわずに、熱伝導率が大きく樹脂と比較して感覚的に熱く感じやすい金属表面をカバーして熱さを和らげる効果が得られるように、０．３ｍｍ〜０．５ｍｍ程度が好ましい。そしてこの構成により、外装ケースの外装底面１ａをシート１０で覆わない場合に比べ、外装ケース１に伝える熱量をさらに増加させ外気との温度差を大きくすることができ、外装ケース１から外気への放熱効率をさらに向上させることが可能になる。また、外装ケース１のマグネシウム合金の外装面をカバーすることで、成型時の湯じわ等の外観不良を隠すことができるため、マグネシウム合金の成型品のパテ塗りや塗装等の２次加工の処理が軽減できたり、成型品の歩留まりを上げることができる。さらに、シート１０の表記内容や色を変えることが容易にできるため、デザイン的にも有利である。
【００２０】
【発明の効果】
以上のように本発明によれば、発熱部品の熱を局部的に熱くすることなく均等に分散させると同時に放熱面積を広げることができ、効率的に自然対流放熱ができる放熱構造が得られ、しかも次のような有利な効果が得られる。
【００２１】
すなわち本発明では、情報処理装置内部に局部的に熱い部分を持たないため、内蔵するハードディスクユニットやバッテリー等の熱に弱い要素部品に特別な放熱対策をおこなう必要なく、比較的自由に配置ができる。また、効率的な自然対流放熱ができるため、空冷ファンモータを実装しなくてすむので、騒音や振動の発生がなく静かで品位の高い情報処理装置を提供できる。さらに衝撃に弱い空冷ファンモータを使用しないことや、外装ケースに通風孔をあける必要がないことは、フィールド用の情報処理装置に要求される耐衝撃、防塵、防水設計の点からも有利である。
【図面の簡単な説明】
【図１】本発明の実施の形態による放熱構造を有する情報処理装置の内部構成を示す構成図
【図２】本発明の実施の形態による放熱構造を有する情報処理装置の外装面を樹脂シートで覆った状態を示す図
【図３】従来の放熱構造を有する情報処理装置の内部構成を示す構成図
【符号の説明】
１ 外装ケース
１ａ 外装ケースの外装底面
３ ＣＰＵ
５、８、９放熱板
６ ヒートパイプ
６ａ ヒートパイプの受熱部
１０ シート[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an information processing apparatus such as a portable computer which incorporates a heat generating component such as a CPU and has a heat dissipation structure for heat dissipation.
[0002]
[Prior art]
Conventionally, information processing devices such as portable computers have internal components that generate heat, such as a CPU, and have various heat dissipation structures to prevent the effects of heat generation on other components. Yes.
[0003]
FIG. 3 shows an internal configuration of an information processing apparatus having a conventional heat dissipation structure.
In FIG. 3, 31 is a CPU which is a heat generating component, 32 is a heat radiating rubber provided in close contact between the CPU 31 and a metal heat radiating plate 33, and 34 is a heat pipe held by a metal heat sink 35. The tip is touching. Further, the heat pipe 34 and the heat sink 35 holding the heat pipe 34 are arranged so as to extend to the vicinity of the air cooling fan motor 37 provided on the side surface of the resin main body case 36.
[0004]
The heat generated from the CPU 31 is radiated by the heat radiating plate 33, transmitted to the heat sink 35 through the heat pipe 34, and radiated from the heat sink 35. These heats are forcibly released to the outside by the air cooling fan motor 37.
[0005]
[Problems to be solved by the invention]
However, in an information processing apparatus having such a heat dissipation structure, the area where efficient heat dissipation can be performed is limited, and sufficient natural convection heat dissipation cannot be realized. It was necessary.
[0006]
Furthermore, in such a heat dissipation structure, the portion where the heat pipe or heat sink is disposed becomes locally hot, so it was necessary to take measures to prevent the external case and nearby components from being adversely affected by heat. .
[0007]
It is an object of the present invention to provide an information processing apparatus having a heat dissipation structure that can efficiently dissipate natural convection heat by spreading the heat dissipation area evenly without spreading the heat of the heat generating component locally and at the same time. To do.
[0008]
[Means for Solving the Problems]
In order to solve this problem, the present invention uses the exterior case of the information processing apparatus main body made of metal as a heat sink, and arranges the heat pipe so as to float from the exterior case at the heat receiving part from the heat generating component, and other parts. Then, it arrange | positions in close contact with an exterior case directly or through a heat sink.
[0009]
According to the present invention, it is possible to obtain a heat dissipating structure that can disperse the heat of the heat-generating component evenly without locally heating and at the same time widen the heat dissipating area and can efficiently perform natural convection heat dissipation.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
An information processing apparatus according to claim 1 of the present invention is an information processing apparatus in which an exterior case is a heat sink for heat dissipation of a heat generating component, and contacts the inner surface of the exterior case and the heat generating component to and a heat pipe for transferring heat to the outer case, in the heat receiving section of the heat pipe from said heat-generating components disposed float from the outer casing, and the other portion was directly densely deposited on the outer casing disposed Further, the exterior case is provided with a standing wall, and an L-shaped heat sink attached or brought into contact with at least one location of the heat pipe is disposed in close contact with both the bottom surface of the exterior case and the standing wall. It has the characteristic heat dissipation structure and has the following effects. That is, this configuration allows the outer case to receive heat from the heat pipe in a distributed manner, so that the outer case can be heated uniformly. Furthermore, since it is an exterior case, it can be in direct contact with outside air over a wide range, and a large amount of heat inside the information processing apparatus can be dissipated. As a result, it is possible to obtain a heat dissipation structure capable of efficiently performing natural convection heat dissipation without requiring forced heat dissipation means such as an air-cooled fan motor. Also, with this configuration, the contact area between the outer case and the heat pipe can be increased directly and via the L-shaped heat radiating plate. As a result, the amount of heat released from the heat pipe to the outer case is increased.
[0012]
According to a second aspect of the present invention, in the information processing apparatus having the heat dissipation structure according to the first aspect, at least an exterior surface of the exterior case that is close to the heat generating component is covered with a thin heat insulating sheet. Have the following effects. In other words, because it is made of metal, the exterior surface of the exterior case that has a high thermal conductivity and feels hotter than the resin even at the same temperature is covered with a thin resin sheet, compared to the case where the metal is directly used as the exterior surface. Thus, the outer case can be further heated to increase the temperature difference from the outside air, and the heat radiation efficiency to the outside air can be improved.
[0013]
Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2.
(Embodiment 1)
FIG. 1 is a plan view showing an internal configuration of an information processing apparatus having a heat dissipation structure according to an embodiment of the present invention, and a configuration view seen from a side. In FIG. 1, reference numeral 1 denotes an outer case on the bottom side of the information processing apparatus main body, which is made of metal and is preferably a magnesium alloy because it can be made lighter.
[0014]
And the inside of an exterior case is taken as the structure as shown below. That is, the block 7 having a configuration in which the heat radiation rubber 4 is brought into contact with the top surface of the CPU 3 which is a heat generating component mounted on the built-in circuit board 2 and the heat pipe 6 is sandwiched between the heat radiation plate 5 and the heat radiation rubber 4. Place in contact with. The heat radiating plate 5 and the block 7 are made of metal, preferably made of copper or aluminum. Moreover, in this Embodiment, in order to hold | maintain the heat pipe 6 reliably, the structure which crimps the heat sink 5 to the block 7 in the state which pinched | interposed the heat pipe 6 is taken. With this configuration, the heat of the CPU 3 can be efficiently transmitted to the heat pipe 6.
[0015]
Next, the heat pipe 6 has a U shape as shown in FIG. 1, and the heat receiving portion 6 a sandwiched between the heat radiating plate 5 and the block 7 is positioned almost in the middle of the U shape. In the vicinity of the heat receiving portion 6a, the heat pipe is bent in the height direction. With this configuration, the heat pipe 6 can be placed in a floating state without being in contact with the inner surface of the outer case 1 at the heat receiving portion 6a, and in a state of being in close contact with the outer case 1 at other portions including both ends. .
[0016]
In the present embodiment, the heat radiating plate 5 is disposed below the heat pipe 6 around the heat receiving portion 6a, but this heat radiating plate 5 is also in contact with the exterior case 1 except for the fixed portion by screw tightening. Arranged not to. As a result, instead of concentrating from the heat receiving part 6a of the heat pipe 6 having a relatively high temperature and transferring heat to the outer case 1, the heat source is dispersed and heat can be transferred to the outer case 1 almost evenly. Not only is heat dissipation from the outer case 1 to the outside air advantageous, but there is no need to take special heat dissipation measures for heat-sensitive element parts such as hard disk units and batteries built into the main body of the information processing device. It is also excellent in that it can be done.
[0017]
Further, in the present embodiment, one end of the heat pipe 6 is fixed to the outer case 1 by the heat radiating plate 8. The heat radiating plate 8 has an L shape, and is fixed by screwing to the outer case 1 so as to be in close contact with both the bottom surface and the standing wall of the outer case 1. The other end of the heat pipe 6 is attached with a heat sink 9 having an L shape by caulking, and the heat sink 9 is similarly attached to both the bottom surface and the standing wall of the outer case 1 in the same manner. The case 1 is fixed by screwing. And by this structure, the contact area of the exterior case 1 and the heat pipe 6 can be increased directly and via a heat sink, and heat can be transmitted to the exterior case 1 more efficiently.
[0018]
As a result of the above, heat from the heat-generating components can be transferred from the heat pipe to the outer case and further to the outside air under optimal conditions, and efficient natural convection heat dissipation can be achieved without using forced heat dissipation means such as an air-cooled fan motor. It can be realized. Since the air cooling fan motor is not built in, it is possible to provide a quiet and high quality information processing apparatus without generating noise and vibration due to the air cooling fan motor. Further, the fact that an air-cooling fan motor that is weak against impact is not used and that it is not necessary to make a ventilation hole in the outer case is advantageous in terms of impact resistance, dust resistance, and waterproof design required for field information processing apparatuses.
[0019]
(Embodiment 2)
Further, in the embodiment as shown in FIG. 2, a thin resin sheet 10 is attached with a double-sided tape so as to cover all the surfaces on which the heat pipes 6 are arranged in the exterior bottom surface 1 a of the exterior case 1. The sheet 10 is preferably made of PVC or polycarbonate having good heat resistance and flame retardancy, and its thinness does not impair the heat dissipation efficiency to the outside air, and its thermal conductivity is large and feels sensuously hot compared to the resin. About 0.3 mm to 0.5 mm is preferable so as to obtain an effect of softening the heat by covering the easy metal surface. And by this structure, compared with the case where the exterior bottom face 1a of an exterior case is not covered with the sheet | seat 10, the amount of heat transmitted to the exterior case 1 can be increased further, and the temperature difference with external air can be enlarged, and the exterior case 1 to external air can be increased. The heat dissipation efficiency can be further improved. Also, by covering the exterior surface of the magnesium alloy of the exterior case 1, it is possible to conceal appearance defects such as hot water wrinkles during molding, so secondary processing such as putty coating and painting of magnesium alloy molded products Processing can be reduced and the yield of molded products can be increased. Furthermore, the written contents and color of the sheet 10 can be easily changed, which is advantageous in terms of design.
[0020]
【The invention's effect】
As described above, according to the present invention, a heat radiating structure capable of spreading the heat radiation area evenly without spreading the heat locally and at the same time expanding the heat radiation area and efficiently performing natural convection heat radiation can be obtained. In addition, the following advantageous effects can be obtained.
[0021]
In other words, in the present invention, since there is no locally hot part inside the information processing apparatus, it is possible to arrange it relatively freely without the need for special heat dissipation measures for the heat-sensitive component parts such as the built-in hard disk unit and battery. . In addition, since efficient natural convection heat radiation can be performed, it is not necessary to mount an air-cooled fan motor, so that it is possible to provide a quiet and high-quality information processing apparatus without generating noise and vibration. Furthermore, the fact that no air-cooled fan motor that is vulnerable to shocks is used and that there is no need to make ventilation holes in the exterior case is advantageous from the viewpoint of impact resistance, dust resistance, and waterproof design required for field information processing devices. .
[Brief description of the drawings]
FIG. 1 is a block diagram showing an internal configuration of an information processing apparatus having a heat dissipation structure according to an embodiment of the present invention. FIG. 2 is a resin sheet for an exterior surface of the information processing apparatus having a heat dissipation structure according to an embodiment of the present invention. FIG. 3 is a block diagram illustrating the internal configuration of an information processing apparatus having a conventional heat dissipation structure.
1 exterior case 1a exterior bottom surface of exterior case 3 CPU
5, 8, 9 Heat sink 6 Heat pipe 6a Heat receiving part 10 sheet of heat pipe

Claims (2)

外装ケースを発熱部品の放熱のためのヒートシンクとした情報処理装置であって、
前記外装ケース内面と発熱部品に接触し前記発熱部品の熱を前記外装ケースに伝達するヒートパイプとを備え、
前記ヒートパイプを前記発熱部品からの受熱部では前記外装ケースから浮かせて配置し、
それ以外の部分では前記外装ケースに直接密着させて配置して、
さらに前記外装ケースには立壁を設け、前記ヒートパイプの少なくとも１箇所に取り付けまたは接触させたＬ字の放熱板を前記外装ケースの底面と前記立壁の両方に密着して配置することを特徴とする放熱構造を有する情報処理装置。An information processing apparatus having an outer case as a heat sink for heat dissipation of heat-generating components,
A heat pipe that contacts the inner surface of the outer case and the heat generating component and transmits heat of the heat generating component to the outer case;
In the heat receiving part from the heat generating component, the heat pipe is arranged to float from the outer case,
The other portions are arranged by directly intimately wear the outer casing,
Further, the exterior case is provided with a standing wall, and an L-shaped heat radiating plate attached or brought into contact with at least one portion of the heat pipe is disposed in close contact with both the bottom surface of the exterior case and the standing wall. An information processing apparatus having a heat dissipation structure. 外装ケースの少なくとも発熱部品に接近した外装面を、薄い樹脂製のシートで覆うことを特徴とする請求項１記載の放熱構造を有する情報処理装置。The information processing apparatus having a heat dissipation structure according to claim 1, wherein an exterior surface of the exterior case that is close to the heat generating component is covered with a thin resin sheet.
JP30838597A 1997-11-11 1997-11-11 Information processing apparatus having heat dissipation structure Expired - Lifetime JP4006795B2 (en)

Priority Applications (1)

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