JPH1117047A - Substrate for mounting electronic component - Google Patents

Substrate for mounting electronic component

Info

Publication number
JPH1117047A
JPH1117047A JP17015297A JP17015297A JPH1117047A JP H1117047 A JPH1117047 A JP H1117047A JP 17015297 A JP17015297 A JP 17015297A JP 17015297 A JP17015297 A JP 17015297A JP H1117047 A JPH1117047 A JP H1117047A
Authority
JP
Japan
Prior art keywords
conductor layer
heat
electronic component
insulating substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17015297A
Other languages
Japanese (ja)
Inventor
Masami Kaji
正己 梶
Takashi Okunosono
隆志 奥ノ薗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP17015297A priority Critical patent/JPH1117047A/en
Publication of JPH1117047A publication Critical patent/JPH1117047A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Landscapes

  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PROBLEM TO BE SOLVED: To smoothly radiate heat generated by electronic components, without remaining on a substrate on which heat-generating electronic components are mounted. SOLUTION: The substrate has metal conductive layers 2 on one main surface of an insulation substrate 1 on which heat-generating electronic components are mounted. The layers 2 are formed like islands on the one main surface of the substrate 1 and an inner conductive layer 3 is formed in the substrate 1 and connected to the conductive layers 2 through heat conductors 4.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は電源用集積回路や混
成集積回路などの発熱性を有する電子部品を搭載するた
めの電子部品搭載用基板に関し、特に放熱対策が施され
た電子部品搭載用基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting substrate for mounting heat-generating electronic components such as a power supply integrated circuit and a hybrid integrated circuit, and more particularly to an electronic component mounting substrate provided with measures for heat dissipation. About.

【０００２】[0002]

【従来技術】従来からセラミックスまたは有機樹脂など
からなる絶縁基板の一主面上に、集積回路や抵抗素子な
どの発熱性を有する電子部品を搭載した電子部品搭載用
基板がある。また、電源用集積回路などの電子部品にお
いては、高集積化に伴って作動するときの発熱量が多く
なりつつある。それらの熱は、その電子部品やその周囲
の電子部品の作動状態に悪影響を及ぼすことから、放熱
する必要があり、いかに効率的に放熱するかが大きな課
題となっている。2. Description of the Related Art Conventionally, there is an electronic component mounting substrate on which an electronic component having heat generation, such as an integrated circuit or a resistance element, is mounted on one main surface of an insulating substrate made of ceramic or organic resin. Also, in electronic components such as power supply integrated circuits, the amount of heat generated when operating with the increase in integration is increasing. Since such heat adversely affects the operation state of the electronic component and the surrounding electronic components, it is necessary to radiate the heat, and how to efficiently radiate the heat has been a major issue.

【０００３】従来から一般的に用いられている電子部品
搭載用基板は、図２に示すように、絶縁基板２１の一主
面上に集積回路や抵抗素子などの電子部品２２を搭載
し、他の主面上に放熱体２３を取付け、電子部品２２が
発する熱を絶縁基板２１内に設けた伝熱体２４を介して
放熱体２３に伝え、この放熱体２３から直接またはその
放熱体２３に接合された放熱フィンを介して大気に放熱
する構造となっている。As shown in FIG. 2, an electronic component mounting substrate generally used in the past has an electronic component 22 such as an integrated circuit or a resistance element mounted on one main surface of an insulating substrate 21. A heat radiator 23 is mounted on the main surface of the device, and heat generated by the electronic component 22 is transmitted to the heat radiator 23 via a heat conductor 24 provided in the insulating substrate 21, and directly from the heat radiator 23 or to the heat radiator 23. It has a structure in which heat is radiated to the atmosphere via the joined radiating fins.

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、電源用
集積回路や抵抗素子などで構成される混成集積回路など
が搭載される電子部品搭載用基板においては、混成集積
回路の近傍において局所的な熱の淀みが発生し、特に自
動車のエンジン、ドライブトレーン、シャーシなどの制
御に用いる場合には、集積回路部の温度が局所的に保証
作動温度以上になることがあった。However, in an electronic component mounting board on which a hybrid integrated circuit including a power supply integrated circuit and a resistance element is mounted, a local heat generation is caused in the vicinity of the hybrid integrated circuit. When stagnation occurs, particularly when used for controlling an engine, a drive train, a chassis, and the like of an automobile, the temperature of the integrated circuit portion sometimes locally exceeds the guaranteed operating temperature.

【０００５】また、最近では、各種回路基板の小型化が
望まれているが、従来の電子部品搭載用基板において
は、他の主面側のほぼ全域にわたって放熱体２３が取り
付けられるため、絶縁基板２１の両主面に電子部品２２
を搭載することは困難であり、放熱性を損なうことなく
電子部品２２の搭載部を広くするには、絶縁基板２１自
体を大型化せざるを得なかった。ちなみに、絶縁基板２
１の両主面に電子部品２２を搭載する場合、搭載された
電子部品２２が発する熱を効率的に放熱するための具体
的な構造は検討されていないのが現状である。In recent years, it has been desired to reduce the size of various circuit boards. However, in the conventional electronic component mounting board, since the heat radiator 23 is attached over almost the entire area of the other main surface side, the insulating board is not provided. Electronic components 22 on both main surfaces
It is difficult to mount the electronic component 22, and in order to widen the mounting portion of the electronic component 22 without deteriorating the heat dissipation, the insulating substrate 21 itself has to be enlarged. By the way, the insulating substrate 2
In the case where the electronic components 22 are mounted on both main surfaces of the electronic device 1, a specific structure for efficiently dissipating the heat generated by the mounted electronic components 22 has not been studied at present.

【０００６】したがって、本発明の目的は、基板の一主
面上に発熱性を有する電子部品が搭載される電子部品搭
載用基板において、電子部品が発する熱を淀みなく放熱
できる放熱構造を提供することにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a heat radiating structure capable of radiating heat generated by an electronic component without stagnation in an electronic component mounting substrate on which a heat-generating electronic component is mounted on one main surface of the substrate. It is in.

【０００７】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本発明に係る電子部品搭載用基板では、絶縁基板の
一主面上に前記金属導体層を形成し、この金属導体層上
に発熱性を有する電子部品を搭載した電子部品搭載用基
板において、前記絶縁基板の一主面上に島状の金属導体
層を複数形成すると共に、前記絶縁基板内に内部導体層
を形成し、この内部導体層と前記複数の金属導体層とを
伝熱体で接続した。In order to achieve the above object, in the electronic component mounting board according to the present invention, the metal conductor layer is formed on one main surface of an insulating substrate, and the metal conductor layer is formed on the metal conductor layer. In an electronic component mounting substrate on which an electronic component having heat generation is mounted, a plurality of island-shaped metal conductor layers are formed on one main surface of the insulating substrate, and an internal conductor layer is formed in the insulating substrate. The inner conductor layer and the plurality of metal conductor layers were connected by a heat conductor.

【０００８】また、本発明に係る電子部品搭載用基板で
は、前記絶縁基板の他の主面上に第二の金属導体層を設
け、この第二の金属導体層と前記内部導体層とを第二の
伝熱体で接続することが望ましい。In the electronic component mounting board according to the present invention, a second metal conductor layer is provided on the other main surface of the insulating substrate, and the second metal conductor layer and the internal conductor layer are connected to each other. It is desirable to connect with two heat conductors.

【０００９】また、本発明に係る電子部品搭載用基板で
は、前記金属導体層上の電子部品が搭載されない領域に
放熱体を設けることが望ましい。In the electronic component mounting board according to the present invention, it is desirable that a heat radiator is provided in a region on the metal conductor layer where the electronic component is not mounted.

【００１０】さらに、本発明に係る電子部品搭載用基板
では、前記絶縁基板の他の主面上に第二の放熱体を設
け、この第二の放熱体と前記内部導体層とを第三の伝熱
体で接続することが望ましい。Further, in the electronic component mounting board according to the present invention, a second heat radiator is provided on another main surface of the insulating substrate, and the second heat radiator and the internal conductor layer are connected to each other by a third heat radiator. It is desirable to connect with a heat transfer body.

【００１１】[0011]

【作用】本発明者らは、種々検討を重ねた結果、絶縁基
板の一主面上に電子部品を搭載する電子部品搭載用基板
において、電子部品が発する熱を従来のように絶縁基板
の他の主面側から放熱するのとは異なって、つぎの３系
統から放熱する構造を採用することにより、より効率的
な放熱が可能となることを見いだした。As a result of various studies, the present inventors have found that, on an electronic component mounting board on which an electronic component is mounted on one principal surface of an insulating substrate, heat generated by the electronic component is reduced to a value other than that of the conventional insulating substrate. It has been found that, unlike the case of dissipating heat from the main surface side, by adopting a structure for dissipating heat from the following three systems, more efficient heat dissipation can be achieved.

【００１２】まず、絶縁基板の一主面上に金属導体層を
形成して、この金属導体層上に発熱性を有する電子部品
を搭載する。この場合、電子部品が発する熱はこの金属
導体層自体から放熱される。次に、絶縁基板内に内部導
体層を設け、この内部導体層と電子部品が搭載された金
属導体層を伝熱体で接続し、電子部品が発する熱を金属
導体層と内部導体層を介して、絶縁基板の全体に均一に
伝熱して絶縁基板の裏面や端面から放熱する。３番目と
して、電子部品が発する熱を金属導体層から伝熱体と内
部導体層を介して他の金属導体層に伝熱して、この他の
金属導体層から放熱する。この場合、金属導体層上に放
熱体が設けられていれば、放熱効果をより一層高めるこ
とができる。First, a metal conductor layer is formed on one main surface of an insulating substrate, and an electronic component having heat generation is mounted on the metal conductor layer. In this case, the heat generated by the electronic component is radiated from the metal conductor layer itself. Next, an internal conductor layer is provided in the insulating substrate, and the internal conductor layer and the metal conductor layer on which the electronic component is mounted are connected by a heat conductor, and heat generated by the electronic component is transmitted through the metal conductor layer and the internal conductor layer. Thus, the heat is uniformly transmitted to the entire insulating substrate and is radiated from the back surface or the end surface of the insulating substrate. Third, heat generated by the electronic component is transferred from the metal conductor layer to the other metal conductor layer via the heat conductor and the internal conductor layer, and is radiated from the other metal conductor layer. In this case, if the heat radiator is provided on the metal conductor layer, the heat radiation effect can be further enhanced.

【００１３】電子部品搭載用基板においては、基板の両
主面から各種伝熱部材を介して放熱させるのが一般的で
ある。しかしながら、層数が増えて電子部品搭載用基板
が厚くなると、基板側面の面積も無視できないほどにな
る。そこで、本発明では、絶縁基板内に内部導体層を設
けて効率的な放熱が実現できるようにした。In a substrate for mounting electronic components, heat is generally radiated from both main surfaces of the substrate through various heat transfer members. However, as the number of layers increases and the thickness of the electronic component mounting substrate increases, the area of the side surface of the substrate also cannot be ignored. Therefore, in the present invention, an internal conductor layer is provided in an insulating substrate so that efficient heat radiation can be realized.

【００１４】[0014]

【発明の実施の形態】以下、本発明を図１に基づいて詳
細に説明する。図１は本発明に係る電子部品搭載用基板
の一実施形態を示す断面図であり、１は絶縁基板、２は
金属導体層、３は内部導体層、４は伝熱体、５は電子部
品、６は第二の金属導体層、７は第二の伝熱体、８は放
熱体である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to FIG. FIG. 1 is a sectional view showing an embodiment of an electronic component mounting board according to the present invention, wherein 1 is an insulating substrate, 2 is a metal conductor layer, 3 is an internal conductor layer, 4 is a heat conductor, and 5 is an electronic component. , 6 is a second metal conductor layer, 7 is a second heat conductor, and 8 is a radiator.

【００１５】絶縁基板１は、エポキシ樹脂などの有機樹
脂や、Ａｌ2 Ｏ3 、Ｓｉ3 Ｎ4 、ＡｌＮなどの絶縁性セ
ラミック焼結体、あるいはガラスセラミックなどから構
成される。自動車用回路基板のように過酷な使用条件下
での耐久性を考慮した場合、絶縁基板１をセラミック焼
結体で形成するのが望ましい。The insulating substrate 1 is made of an organic resin such as an epoxy resin, an insulating ceramic sintered body such as Al 2 O 3 , Si 3 N 4 or AlN, or a glass ceramic. In consideration of durability under severe use conditions such as a circuit board for an automobile, it is desirable that the insulating substrate 1 be formed of a ceramic sintered body.

【００１６】絶縁基板１の一主面上には、金属導体層２
が島状に複数形成されている。この金属導体層２は、例
えば銅、銀、金、アルミニウム、あるいはこれらを含む
合金のような高熱伝導性の金属材料によって形成するこ
とが望ましい。この金属導体層２は、高熱伝導性の金属
材料を厚膜手法で印刷塗布した後に絶縁基板１に焼き付
けることによって形成されたり、めっきや蒸着などの薄
膜手法によって形成されたり、金属薄板を貼り付けるこ
とによって形成される。また、絶縁基板１をセラミック
焼結体などで形成する場合において、このセラミック焼
結体の焼成と同時に焼き付ける場合は、上記のような高
熱伝導性の金属材料に代えて、ＷやＭｏなどの高融点金
属材料を用いる。なお、絶縁基板１を８００〜１０００
℃程度の低温焼成が可能なガラスセラミックスなどで形
成する場合は、この絶縁基板１の焼成と同時に焼き付け
る場合でも、この金属導体層２を銅、金、アルミニウム
などのような高熱伝導性の金属材料で形成することがで
きる。この金属導体層２は５〜１００μｍ程度の厚みに
形成される。A metal conductor layer 2 is provided on one main surface of the insulating substrate 1.
Are formed in an island shape. This metal conductor layer 2 is desirably formed of a metal material having high thermal conductivity such as copper, silver, gold, aluminum, or an alloy containing these. The metal conductor layer 2 is formed by printing and applying a metal material having a high thermal conductivity by a thick film method and then baking it on the insulating substrate 1, by a thin film method such as plating or vapor deposition, or by attaching a thin metal plate. Formed by In the case where the insulating substrate 1 is formed of a ceramic sintered body or the like, if the ceramic sintered body is baked at the same time as firing, instead of the above-described metal material having high thermal conductivity, a metal such as W or Mo may be used. Use a melting point metal material. In addition, the insulating substrate 1 is 800 to 1000
When formed of glass ceramics or the like that can be fired at a low temperature of about ° C., even when the insulating substrate 1 is baked at the same time as firing, the metal conductor layer 2 is made of a metal material having high thermal conductivity such as copper, gold, or aluminum. Can be formed. This metal conductor layer 2 is formed to a thickness of about 5 to 100 μm.

【００１７】前記絶縁基板１内には、この絶縁基板１の
広い領域にわたって内部導体層３が形成されている。こ
の内部導体層３は、銅、銀、金、アルミニウム、あるい
はこれらを含む合金などの高熱伝導性の金属材料によっ
て形成することが望ましいが、絶縁基板１をセラミック
焼結体などで形成する場合において、このセラミック体
の焼成と同時に焼き付ける場合は、上記のような高熱伝
導性の金属材料に代えて、ＷやＭｏなどの高融点金属材
料を用いる。内部導体層３をセラミック体の焼成と同時
に焼き付ける場合、例えばセラミックグリーンシートに
ＷやＭｏなどの高融点金属ペーストを塗布して、さらに
このような金属ペーストを塗布しないセラミックグリー
ンシートを重ね合わせて焼成することにより形成され
る。この内部導体層３も５〜１００μｍ程度の厚みに形
成される。この内部導体層３の膜厚が５μｍ以下の場
合、熱伝導性が悪くなり、１００μｍ以上になるとセラ
ミックグリーンシートと同時焼成しにくくなる。この内
部導体層３は、基板１の周囲に１ｍｍ程度の余白ができ
るように形成され、例えば基板１の面積が７割以上、望
ましくは８割以上にわたって形成される。絶縁基板１の
一主面上に形成された金属導体層２と絶縁基板２内に形
成された内部導体層３は伝熱体４で熱的に接続される。
この伝熱体４は例えば未焼成のグリーンシートにマイク
ロドリルなどで孔をあけて、その孔のなかに金属ペース
トを充填して複数のグリーンシートを積層した後に、こ
のグリーンシートと同時に焼成することにより形成する
ことができる。この伝熱体４も絶縁基板１がセラミック
焼結体で形成される場合には、ＷやＭｏなどの高融点金
属材料で形成する必要があるが、絶縁基板１をガラスセ
ラミックスで形成する場合は、銅、金、アルミニウムな
どで形成することができる。この伝熱体４は、例えばそ
の直径が０．１〜０．３ｍｍ程度、望ましくは０．１５
ｍｍ以上の円柱体で構成される。この伝熱体４は内部導
体層３に均一に伝熱するために、一つの金属導体層２に
ついて複数設けることが望ましい。In the insulating substrate 1, an internal conductor layer 3 is formed over a wide area of the insulating substrate 1. The inner conductor layer 3 is desirably formed of a metal material having high thermal conductivity such as copper, silver, gold, aluminum, or an alloy containing these. However, when the insulating substrate 1 is formed of a ceramic sintered body or the like, When the ceramic body is baked at the same time as firing, a high melting point metal material such as W or Mo is used instead of the above-described high thermal conductivity metal material. When the internal conductor layer 3 is baked simultaneously with the firing of the ceramic body, for example, a high melting point metal paste such as W or Mo is applied to the ceramic green sheet, and further the ceramic green sheets not coated with such a metal paste are stacked and fired. It is formed by doing. This internal conductor layer 3 is also formed to a thickness of about 5 to 100 μm. When the thickness of the internal conductor layer 3 is 5 μm or less, the thermal conductivity becomes poor, and when it is 100 μm or more, it becomes difficult to simultaneously fire the ceramic green sheet. The internal conductor layer 3 is formed so as to leave a margin of about 1 mm around the substrate 1, and for example, the area of the substrate 1 is formed to be 70% or more, preferably 80% or more. The metal conductor layer 2 formed on one main surface of the insulating substrate 1 and the internal conductor layer 3 formed in the insulating substrate 2 are thermally connected by the heat conductor 4.
The heat transfer body 4 is formed by, for example, making a hole in an unfired green sheet with a micro drill, filling a metal paste in the hole, laminating a plurality of green sheets, and firing the green sheet at the same time. Can be formed. When the insulating substrate 1 is formed of a ceramic sintered body, the heat transfer member 4 also needs to be formed of a high melting point metal material such as W or Mo. However, when the insulating substrate 1 is formed of a glass ceramic, , Copper, gold, aluminum and the like. The heat transfer body 4 has a diameter of, for example, about 0.1 to 0.3 mm, preferably 0.15 to 0.35 mm.
It is composed of a cylindrical body of mm or more. It is desirable that a plurality of the heat conductors 4 be provided for one metal conductor layer 2 in order to uniformly transfer heat to the internal conductor layer 3.

【００１８】前記金属導体層２上には、発熱性を有する
電子部品５が搭載される。このような発熱性を有する電
子部品５には、例えばパワートランジスタ、パワーＩＣ
素子、パワー抵抗素子などがある。On the metal conductor layer 2, an electronic component 5 having a heat generating property is mounted. For example, a power transistor, a power IC,
Element, power resistance element, and the like.

【００１９】かかる構造によれば、発熱性を有する電子
部品５が発する熱は、金属導体層２に伝熱され、この金
属導体層２から放熱されると同時に、さらに伝熱体層４
を介して内部導体層３に伝熱される。これにより、電子
部品５が発する熱は局所的に淀むことなく、絶縁基板１
の全体に伝熱され、絶縁基板１内で均熱化される。ま
た、内部導体層３に伝熱された熱は、他の伝熱体４を通
って他の金属導体層２に伝熱され、この他の金属導体層
２からも放熱される。According to this structure, the heat generated by the heat-generating electronic component 5 is transferred to the metal conductor layer 2 and is radiated from the metal conductor layer 2 and, at the same time, is further increased.
The heat is transferred to the internal conductor layer 3 via. As a result, the heat generated by the electronic component 5 does not stagnate locally,
Is transferred to the entire surface of the insulating substrate 1 and is soaked in the insulating substrate 1. Further, the heat transmitted to the internal conductor layer 3 is transmitted to the other metal conductor layer 2 through another heat conductor 4 and is also radiated from the other metal conductor layer 2.

【００２０】金属導体層２、内部導体層３および伝熱体
４は伝熱のためだけではなく、電子部品搭載用基板にお
ける配線の一部として機能させてもよい。例えば内部導
体層３は、ラジオノイズ低減効果をもつ電気的グランド
層として機能させることもできる。The metal conductor layer 2, the internal conductor layer 3, and the heat transfer member 4 may function not only for heat transfer but also as a part of wiring on an electronic component mounting board. For example, the inner conductor layer 3 can function as an electric ground layer having a radio noise reduction effect.

【００２１】また、絶縁基板１の一主面上には、搭載さ
れた電子部品５と電気回路を構成すべく電気的に接続さ
れた配線（不図示）が形成され、また絶縁基板１の内部
には内部導体層３の他に、一主面上に搭載された電子部
品５や一主面上に形成された配線層と接続された内部配
線層（不図示）を具備する場合もある。On one main surface of the insulating substrate 1, wiring (not shown) electrically connected to the mounted electronic components 5 to form an electric circuit is formed. In some cases, in addition to the internal conductor layer 3, an electronic component 5 mounted on one main surface or an internal wiring layer (not shown) connected to a wiring layer formed on one main surface may be provided.

【００２２】本発明に係る電子部品搭載用基板では、絶
縁基板１の他の主面上に第二の金属導体層６を設け、こ
の第二の金属導体層６と内部導体層３を第二の伝熱体７
で接続することが望ましい。このように構成すると、絶
縁基板１の他の主面上にも電子部品を搭載することがで
きて高密度化が可能になると共に、絶縁基板１内に内部
導体層３を形成したことによって、絶縁基板１の両主面
上に電子部品を搭載した場合でも、効率よく放熱でき
る。In the electronic component mounting board according to the present invention, the second metal conductor layer 6 is provided on the other main surface of the insulating substrate 1, and the second metal conductor layer 6 and the internal conductor layer 3 Heat transfer body 7
It is desirable to connect with. With this configuration, the electronic components can be mounted on the other main surface of the insulating substrate 1 and the density can be increased. In addition, by forming the internal conductor layer 3 in the insulating substrate 1, Even when electronic components are mounted on both main surfaces of the insulating substrate 1, heat can be efficiently dissipated.

【００２３】また、本発明に係る電子部品搭載用基板で
は、金属導体層２上の電子部品５が搭載されない領域に
放熱体８を設けることが望ましい。この放熱体８は例え
ばアルミニウムポストなどで構成される。このように、
金属導体層２上の電子部品５が搭載されない領域に放熱
体８を設けると、絶縁基板１における一主面側からの放
熱効果をより高めることができると共に、絶縁基板１の
両主面上に電子部品５を搭載した場合でも、効率よく放
熱できる。In the electronic component mounting board according to the present invention, it is desirable to provide the heat radiator 8 in a region on the metal conductor layer 2 where the electronic component 5 is not mounted. The radiator 8 is made of, for example, an aluminum post. in this way,
When the heat radiator 8 is provided on the metal conductor layer 2 in a region where the electronic component 5 is not mounted, the heat radiation effect from the one main surface side of the insulating substrate 1 can be further improved, and both the main surfaces of the insulating substrate 1 are provided. Even when the electronic component 5 is mounted, heat can be efficiently dissipated.

【００２４】さらに、絶縁基板１の他の主面上に電子部
品を搭載しない場合は、この絶縁基板１の他の主面上
に、第二の放熱体（不図示）を設け、この第二の放熱体
と内部導体層３とを第三の伝熱体（不図示）で熱的に接
続することが望ましい。この第二の放熱体も例えばアル
ミニウムポストなどで構成される。このように絶縁基板
１の他の主面上に第二の放熱体を設け、この第二の放熱
体と内部導体層とを第三の伝熱体で熱的に接続すると、
絶縁基板１の主面上に搭載した電子部品５が発する熱を
絶縁基板１の他の主面側にも伝熱することができ、絶縁
基板１全体の均熱化をより一層促進することができると
共に、他の主面側からも放熱できる。Further, when electronic components are not mounted on the other main surface of the insulating substrate 1, a second heat radiator (not shown) is provided on the other main surface of the insulating substrate 1, and It is desirable to thermally connect the heat radiator and the internal conductor layer 3 with a third heat conductor (not shown). This second heat radiator is also made of, for example, an aluminum post. When the second radiator is provided on the other main surface of the insulating substrate 1 and the second radiator and the internal conductor layer are thermally connected by the third heat conductor,
The heat generated by the electronic component 5 mounted on the main surface of the insulating substrate 1 can be transferred to the other main surface of the insulating substrate 1, and the uniformity of the entire insulating substrate 1 can be further promoted. As well as heat can be radiated from the other main surface side.

【００２５】[0025]

【実施例】アルミナからなる６層のグリーンシートを準
備し、第１層目と第２層目の間、および第５層目と第６
層目の間の電気信号用スルーホールと干渉する領域を除
くほぼ全面に内部導体層３となるタングステンペースト
を２０μｍの厚みに印刷塗布した。また、マイクロドリ
ルによって直径０．２ｍｍのビアホールを３６個均等に
開けた３．５ｍｍ四方の領域をその中心間距離が８ｍｍ
となるように離して二箇所設け、その中に伝熱体４とな
るタングステンペーストを充填した。これらのグリーン
シートを位置合わせして積層した後、１７００℃の非酸
化性雰囲気で焼成して内部導体層３と伝熱体４を形成
し、全体の厚みが１．５ｍｍの基板１を作成した。EXAMPLE A six-layer green sheet made of alumina was prepared. The green sheet was prepared between the first and second layers and between the fifth and sixth layers.
Tungsten paste to be the internal conductor layer 3 was applied by printing to a thickness of 20 μm on almost the entire surface except for the region interfering with the through holes for electric signals between the layers. A 3.5 mm square area in which 36 via holes having a diameter of 0.2 mm were evenly opened by a micro drill was formed so that the center-to-center distance was 8 mm.
And two places spaced apart from each other, and filled with a tungsten paste to be the heat conductor 4. After aligning and stacking these green sheets, they were fired in a non-oxidizing atmosphere at 1700 ° C. to form the internal conductor layer 3 and the heat conductor 4, thereby forming the substrate 1 having a total thickness of 1.5 mm. .

【００２６】その後、基板１の一主面側の伝熱体４の一
つの領域上に銅ペーストを塗布して９００℃で焼き付け
て厚さ１０μｍで４ｍｍ角の島状の金属導体層２を形成
した。そして、その金属導体層２の表面にアルミニウム
ポストを搭載すると共に、他の伝熱体４の領域上には金
めっきを施して電源ＩＣを半田付けした。また、同時に
電源ＩＣと電気回路を構成すべく電気的に接続された配
線に金めっきを施した後、抵抗素子を両主面に半田付け
して電子部品搭載用基板を作成した。そして、アルミニ
ウム合金および有機樹脂からなる筐体と電子部品搭載用
基板をシリコン樹脂で接着した。Thereafter, a copper paste is applied onto one region of the heat transfer body 4 on one main surface side of the substrate 1 and baked at 900 ° C. to form a 10 μm thick 4 mm square island-shaped metal conductor layer 2. did. Then, an aluminum post was mounted on the surface of the metal conductor layer 2, and gold plating was performed on the other heat transfer member 4 region to solder the power supply IC. At the same time, the wiring electrically connected to the power supply IC to form an electric circuit was plated with gold, and then the resistance elements were soldered to both main surfaces to prepare an electronic component mounting board. Then, a housing made of an aluminum alloy and an organic resin and an electronic component mounting substrate were bonded with a silicon resin.

【００２７】このように作成した基板１上の電源ＩＣを
雰囲気温度１０５℃中で作動させて、電源ＩＣそのもの
の温度を熱電対で測定した結果、アルミニウムポストを
実装した銅厚膜２および内部導体層３を形成しない場合
に比較して、４℃の温度低下が確認され、本発明構造に
よる効果が確認された。The power supply IC thus formed on the substrate 1 was operated at an ambient temperature of 105 ° C., and the temperature of the power supply IC itself was measured with a thermocouple. As a result, the copper thick film 2 having the aluminum post mounted thereon and the internal conductor were measured. Compared to the case where the layer 3 was not formed, a temperature decrease of 4 ° C. was confirmed, and the effect of the structure of the present invention was confirmed.

【００２８】なお、上記構造のうち、絶縁基板１内に内
部導体層３のみを形成しない場合には伝熱体４を設けて
も１℃以下の冷却効果しかなく、内部導体層３および伝
熱体４が不可欠であることも確認された。In the above structure, when only the internal conductor layer 3 is not formed in the insulating substrate 1, even if the heat conductor 4 is provided, only a cooling effect of 1 ° C. or less is obtained. It was also confirmed that body 4 was essential.

【００２９】[0029]

【発明の効果】以上のとおり、本発明に係る電子部品搭
載用基板によれば、絶縁基板の一主面上に金属導体層を
島状に複数形成すると共に、この絶縁基板内に内部導体
層を形成し、この内部導体層と上記複数の金属導体層を
伝熱体で接続したことから、混成集積回路などの発熱性
の電子部品を搭載した場合においても、基板内で局所的
に熱が淀むことがなく、基板全体を均熱化することがで
き、効率的に放熱することができる。その結果、基板を
大型化させることなく効率的に放熱できると共に、電子
部品搭載用基板の信頼性を高めることができる。As described above, according to the electronic component mounting board of the present invention, a plurality of metal conductor layers are formed in an island shape on one main surface of the insulating substrate, and the inner conductor layer is formed in the insulating substrate. Is formed, and since the internal conductor layer and the plurality of metal conductor layers are connected by a heat conductor, even when a heat-generating electronic component such as a hybrid integrated circuit is mounted, heat is locally generated within the substrate. The entire substrate can be soaked without stagnation, and heat can be efficiently radiated. As a result, heat can be efficiently dissipated without increasing the size of the substrate, and the reliability of the electronic component mounting substrate can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明に係る電子部品搭載用基板の一実施形態
を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing an embodiment of an electronic component mounting board according to the present invention.

【図２】従来の電子部品搭載用基板の放熱構造を説明す
るための断面図である。FIG. 2 is a cross-sectional view illustrating a heat dissipation structure of a conventional electronic component mounting board.

【符号の説明】[Explanation of symbols]

１………絶縁基板、２………金属導体層、３………内部
導体層、４………伝熱体、５………電子部品、６………
第二の金属導体層、７………第二の伝熱体、８………放
熱体1 ... insulating substrate, 2 ... metal conductor layer, 3 ... inner conductor layer, 4 ... heat conductor, 5 ... electronic components, 6 ...
Second metal conductor layer, 7... Second heat conductor, 8.

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 絶縁基板の一主面上に金属導体層を形成
し、この金属導体層上に発熱性を有する電子部品を搭載
した電子部品搭載用基板において、前記絶縁基板の一主
面上に前記金属導体層を島状に複数形成すると共に、前
記絶縁基板内に内部導体層を形成し、この内部導体層と
前記金属導体層とを伝熱体で接続したことを特徴とする
電子部品搭載用基板。1. An electronic component mounting board comprising: a metal conductor layer formed on one main surface of an insulating substrate; and an electronic component having a heat generating property mounted on the metal conductor layer. An electronic component, wherein a plurality of the metal conductor layers are formed in an island shape, an internal conductor layer is formed in the insulating substrate, and the internal conductor layer and the metal conductor layer are connected by a heat conductor. Mounting substrate. 【請求項２】 前記絶縁基板の他の主面上に第二の金属
導体層を設け、この第二の金属導体層と前記内部導体層
とを第二の伝熱体で接続したことを特徴とする請求項１
に記載の電子部品搭載用基板。2. A second metal conductor layer is provided on another main surface of the insulating substrate, and the second metal conductor layer and the internal conductor layer are connected by a second heat conductor. Claim 1
Electronic component mounting substrate according to 1. 【請求項３】 前記金属導体層上の電子部品が搭載され
ない領域に放熱体を設けたことを特徴とする請求項１に
記載の電子部品搭載用基板。3. The electronic component mounting board according to claim 1, wherein a heat radiator is provided in a region on the metal conductor layer where the electronic component is not mounted. 【請求項４】 前記絶縁基板の他の主面上に第二の放熱
体を設け、この第二の放熱体と前記内部導体層とを第三
の伝熱体で接続したことを特徴とする請求項１に記載の
電子部品搭載用基板。4. A second heat radiator is provided on another main surface of the insulating substrate, and the second heat radiator and the internal conductor layer are connected by a third heat conductor. The electronic component mounting board according to claim 1.
JP17015297A 1997-06-26 1997-06-26 Substrate for mounting electronic component Pending JPH1117047A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17015297A JPH1117047A (en) 1997-06-26 1997-06-26 Substrate for mounting electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17015297A JPH1117047A (en) 1997-06-26 1997-06-26 Substrate for mounting electronic component

Publications (1)

Publication Number Publication Date
JPH1117047A true JPH1117047A (en) 1999-01-22

Family

ID=15899654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17015297A Pending JPH1117047A (en) 1997-06-26 1997-06-26 Substrate for mounting electronic component

Country Status (1)

Country Link
JP (1) JPH1117047A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005274553A (en) * 2004-02-24 2005-10-06 Kyocera Corp Wiring board and manufacturing method therefor
JP2012503865A (en) * 2008-09-28 2012-02-09 張義▲輝▼ AC drive type light emitting diode module
JP2014175613A (en) * 2013-03-12 2014-09-22 Shindengen Electric Mfg Co Ltd Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005274553A (en) * 2004-02-24 2005-10-06 Kyocera Corp Wiring board and manufacturing method therefor
JP4693381B2 (en) * 2004-02-24 2011-06-01 京セラ株式会社 Wiring board and manufacturing method thereof
JP2012503865A (en) * 2008-09-28 2012-02-09 張義▲輝▼ AC drive type light emitting diode module
JP2014175613A (en) * 2013-03-12 2014-09-22 Shindengen Electric Mfg Co Ltd Semiconductor device

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