JP3054466B2 - Anisotropic conductive adhesive film and manufacturing method thereof - Google Patents
Anisotropic conductive adhesive film and manufacturing method thereofInfo
- Publication number
- JP3054466B2 JP3054466B2 JP3155591A JP15559191A JP3054466B2 JP 3054466 B2 JP3054466 B2 JP 3054466B2 JP 3155591 A JP3155591 A JP 3155591A JP 15559191 A JP15559191 A JP 15559191A JP 3054466 B2 JP3054466 B2 JP 3054466B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- parts
- adhesive film
- conductive adhesive
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Manufacturing Of Electric Cables (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】 本発明は電気回路間、特には液
晶表示装置（ＬＣＤ）と可撓性回路基板（ＦＰＣ）、プ
リント回路基板（ＰＣＢ）とＦＰＣ等の接続に用いられ
る、異方導電性接着膜とその製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive material used for connection between electric circuits, particularly for connection between a liquid crystal display (LCD) and a flexible circuit board (FPC) and between a printed circuit board (PCB) and an FPC. The present invention relates to an adhesive film and a method for producing the same.
【０００２】[0002]
【従来の技術】近年電子電気機器の軽量薄型短小化に伴
い、その使用範囲は据え置き型のものから携帯用、車載
用等へと広がるにつれ、各電気回路間の接続に高温、高
湿等さまざまな環境下における信頼性が求められるよう
になり、耐熱性に劣る熱可塑性接着膜に代えて熱硬化性
接着膜の異方導電性接着膜が用いられるようになってき
た。しかし、このようなものは、その使い易さの点から
硬化形態を一液型とする必要があり、このため接続時の
低温化、短時間化を図ろうとすると、可使時間が短くな
り、保存が困難であったり、接続後十分な導通接着が得
られない、等の不具合を生じた。2. Description of the Related Art In recent years, as electronic equipment has become lighter, thinner and shorter, its use has expanded from stationary to portable, on-vehicle, and the like. In an environment with high reliability, an anisotropic conductive adhesive film of a thermosetting adhesive film has been used instead of a thermoplastic adhesive film having poor heat resistance. However, in such a case, it is necessary to use a one-pack curing form in view of its ease of use. Therefore, when trying to lower the temperature at the time of connection and shorten the time, the pot life becomes short, Inconveniences such as difficulty in preservation and inability to obtain sufficient conductive adhesion after connection occurred.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、上記した問
題を解決するもので、可使時間を気にすることなく、低
温、短時間で電気的に接続することを可能にした異方導
電性接着膜とその製造方法を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and anisotropic conductive material which can be electrically connected at a low temperature in a short time without worrying about the pot life. An object of the present invention is to provide a conductive adhesive film and a method for producing the same.
【０００４】[0004]
【課題を解決するための手段】上記課題を達成するため
に、一分子中に少なくとも１個の無水有機酸基を含む熱
可塑性樹脂（Ａ）と、一分子中に少なくとも２個のエポ
キシ基を含む樹脂（Ｂ）とからなる絶縁性接着性樹脂バ
インダー１００容量部に対し、水吸着性粉末０．０１〜
５０容量部、粒径３〜１００μｍの導電性粒子０．５〜
３０容量部を含んでなる異方導電性接着膜とする。前記
エポキシ基を含む樹脂が０．５〜２００分子中に１個の
割合で塩素基を含むものであることが好ましい。異方導
電性接着膜の製造方法は、前記熱可塑性樹脂（Ａ）を溶
媒に溶解させた後、前記水吸着性粉末を混合してから、
前記エポキシ基を含む樹脂（Ｂ）と導電性粒子を混合
し、これをセパレータ上あるいは電気回路基板上に膜状
にシーティングした後、乾燥して上記溶媒を除去する。In order to achieve the above object, a thermoplastic resin (A) containing at least one organic anhydride group in one molecule and at least two epoxy groups in one molecule are provided. Water-absorptive powder to 100 parts by volume of an insulating adhesive resin binder composed of
50 volume parts, conductive particles having a particle size of 3 to 100 μm 0.5 to
An anisotropic conductive adhesive film including 30 capacitance parts is used. It is preferable that the resin containing an epoxy group contains a chlorine group at a ratio of one in 0.5 to 200 molecules. The method for producing an anisotropic conductive adhesive film is such that after dissolving the thermoplastic resin (A) in a solvent, mixing the water-absorbing powder,
The resin (B) containing the epoxy group and the conductive particles are mixed, and this is sheeted on a separator or an electric circuit board, and then dried to remove the solvent.
【０００５】[0005]
【発明の実施の形態】本発明者は、異方導電性接着剤の
製造時、保存時、ヒートシール時の各時点における硬化
成分の反応性の違いに着目し、製造時における接着剤成
分中の分子が自由に動くことができる溶液状態において
は全く反応性を示させず、成膜後の分子が固定された状
態で一部反応が可能な状態とし、ヒートシール時の分子
が再び自由を取り戻す加熱溶融状態において、さらに反
応を促進させるようにすれば、可使時間を気にすること
なく、ヒートシール作業の低温化、短時間化が可能にな
ることを見出し、その構成と製造方法について種々検討
した結果、本発明を完成したものである。本発明に用い
られる、一分子中に少なくとも一個の無水有機酸基を含
む熱可塑性樹脂（Ａ）としては、アクリル系、ウレタン
系、スチレン−ブタジエン−スチレン（ＳＢＳ）系、ス
チレン−エチレン−ブチレン−スチレン（ＳＥＢＳ）系
等の合成樹脂中に、無水ジカルボン酸基等の無水有機酸
基を含むものが例示され、これらは無水有機酸基を含む
モノマーを共重合させブロック共重合体としたり、上記
合成樹脂に無水有機酸基を含むオリゴマーあるいはポリ
マーをグラフト重合させる等の方法によって得ることが
できる。また、これらのものは各種ポリマーの変成品と
して一般に市販されており、これを使用することも可能
である。DETAILED DESCRIPTION OF THE INVENTION The present inventor has focused on the difference in the reactivity of a cured component at each point of time during production, storage, and heat sealing of an anisotropic conductive adhesive. In a solution state where the molecules can freely move, it does not show any reactivity at all, and after the film formation, the molecules can be partially reacted in a fixed state, and the molecules at the time of heat sealing become free again. In the heat-melted state to be recovered, if the reaction is further promoted, it has been found that it is possible to lower the temperature of the heat sealing work and shorten the time without worrying about the pot life, and about its configuration and manufacturing method. As a result of various studies, the present invention has been completed. The thermoplastic resin (A) having at least one organic anhydride group in one molecule used in the present invention includes acrylic, urethane, styrene-butadiene-styrene (SBS), styrene-ethylene-butylene- Examples of synthetic resins such as styrene (SEBS) -based resins that include an organic acid anhydride group such as a dicarboxylic acid anhydride group include those copolymerized with a monomer containing an organic acid anhydride group to form a block copolymer, It can be obtained by a method such as graft polymerization of an oligomer or polymer containing an organic anhydride group to a synthetic resin. These are generally commercially available as modified products of various polymers, and these can also be used.
【０００６】また、一分子中に少なくとも２個のエポキ
シ基を含む樹脂（Ｂ）としては、一般に公知のものが使
用でき、室温で液状であっても固形状であってもよく、
２官能性のものとしてはビスフェノールＡジグリシジル
エーテル、ビスフェノールＦジグリシジルエーテル、ビ
スフェノールＳジグリシジルエーテル、レゾルシノール
ジグリシジルエーテル、ヘキサヒドロビスフェノールＡ
ジグリシジルエーテル、フタル酸ジグリシジルエステル
等が、多官能性のものとしてはトリグリシジルイソシア
ヌレート、テトラグリシジルジアミノジフェニルメタ
ン、テトラグリシジルメタキシレンジアミン、クレゾー
ルノボラックポリグリシジルエーテル等が例示される。
これらの樹脂の末端には塩素基を含むことがあるが、こ
こから発生する塩素イオンは腐食性であり、特に本発明
は電気、電子回路の接続に用いるものであるから塩素イ
オン受体として酸化マグネシウム、酸化亜鉛等の金属酸
化物を添加することが有効である。しかしながらこの末
端塩素は、本発明による酸無水物との硬化反応を促進す
る作用があるため、ヒートシール時間の短縮に効果があ
り、このため樹脂（Ｂ）の０．５〜２００分子中に１個
の割合で塩素基を含むものとすることがよい。また、ア
クリル系、ウレタン系、スチレン−エチレン−ブチレン
−スチレン系等の合成樹脂をエポキシ変成したものも使
用することができる。As the resin (B) containing at least two epoxy groups in one molecule, generally known resins can be used, which may be liquid or solid at room temperature.
Bifunctional compounds include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, resorcinol diglycidyl ether, and hexahydrobisphenol A.
Examples of diglycidyl ether and diglycidyl phthalate include polyglyceryl triglycidyl isocyanurate, tetraglycidyl diaminodiphenylmethane, tetraglycidyl metaxylene diamine, and cresol novolac polyglycidyl ether.
The terminals of these resins may contain chlorine groups. Chlorine ions generated from these terminals are corrosive, and in particular, the present invention is used for connection of electric and electronic circuits, and thus oxidizes as chlorine ion acceptors. It is effective to add a metal oxide such as magnesium or zinc oxide. However, the terminal chlorine has an effect of accelerating the curing reaction with the acid anhydride according to the present invention, and is effective in shortening the heat sealing time. It is preferable to contain a chlorine group in a ratio of the number. Further, an epoxy-modified synthetic resin such as an acryl-based, urethane-based, or styrene-ethylene-butylene-styrene-based resin can also be used.
【０００７】上記熱可塑性樹脂（Ａ）とエポキシ基を含
む樹脂（Ｂ）との配合比に関しては、無水有機酸基を含
む熱可塑性樹脂（Ａ）が多いと、接続したとき高剥離強
度を与えると共に、低温（特に０℃以下）での耐環境特
性に優れる反面、耐熱性に劣り、接着剤（絶縁性接着性
樹脂バインダー）の硬化反応に高温長時間を要するとい
う不利があり、またエポキシ基を含む樹脂（Ｂ）が多い
と、接着剤の硬化反応が速やかで耐熱性に優れるが、熱
衝撃に弱く、剥離強度が小さくなるため、熱可塑性樹脂
（Ａ）１００重量部に対してエポキシ基を含む樹脂
（Ｂ）を１０〜１０００重量部、好ましくは３０〜３０
０重量部とすることが好ましい。Regarding the mixing ratio of the thermoplastic resin (A) and the resin (B) containing an epoxy group, if the amount of the thermoplastic resin (A) containing an organic anhydride group is large, a high peel strength can be obtained when connected. At the same time, it has excellent environmental resistance characteristics at low temperatures (especially 0 ° C. or lower), but is inferior in heat resistance, and disadvantageously requires a high temperature and a long time for a curing reaction of an adhesive (insulating adhesive resin binder). When the resin (B) containing a large amount of the resin (A) has a large amount, the curing reaction of the adhesive is rapid and the heat resistance is excellent, but it is weak to thermal shock and the peel strength is small. 10 to 1000 parts by weight, preferably 30 to 30 parts by weight of the resin (B) containing
It is preferably 0 parts by weight.
【０００８】水吸着性粉末としては、シリカゲル粉末、
ゼオライト粉末、活性炭粉末等が例示されるが、異方導
電性に悪影響を及ぼさないようにするため絶縁性のもの
とするのがよく、活性炭はあまり好ましくない。水吸着
性粉末は、製造時に樹脂、溶剤等の成分中あるいは空気
中の水分を吸収することによって、水分による無水有機
酸基の開環を防ぐとともに、ヒートシール時には水分を
放出し、無水有機酸基を開環させ、エポキシ基との反応
を開始、促進させるものである。このため、熱可塑性樹
脂（Ａ）とエポキシ基を含む樹脂（Ｂ）からなる絶縁性
接着性樹脂バインダー１００容量部に対し、水吸着性粉
末は０．０１容量部以上、好ましくは０．５容量部以上
とするのがよい。しかしながら、この水吸着性粉末は接
着性をもたないので、入れ過ぎると接着性を損なうおそ
れがあるため、５０容量部以下、好ましくは３０容量部
以下とするのがよい。また、粉末の粒径は小さければ小
さいほど吸収速度が増すが、すぐに失効し、また、大き
いと十分な吸収速度、放出速度が得られないため、０．
１μｍ以上１０μｍ以下とすることが好ましい。[0008] As the water-adsorbing powder, silica gel powder,
Zeolite powder, activated carbon powder and the like are exemplified, but it is preferable to use an insulative one so as not to adversely affect the anisotropic conductivity, and activated carbon is less preferred. The water-adsorbing powder absorbs moisture in components such as resins and solvents or in the air during production, thereby preventing the ring-opening of the anhydrous organic acid group due to moisture and releasing water during heat sealing to release the organic acid anhydride. The ring is opened to initiate and promote the reaction with the epoxy group. For this reason, with respect to 100 parts by volume of the insulating adhesive resin binder composed of the thermoplastic resin (A) and the resin (B) containing an epoxy group, the water-adsorptive powder is 0.01 part by volume or more, preferably 0.5 part by volume. Parts or more. However, since this water-adsorbing powder does not have adhesiveness, if it is added too much, the adhesiveness may be impaired. Therefore, the content is preferably 50 parts by volume or less, preferably 30 parts by volume or less. Also, the smaller the particle size of the powder, the higher the absorption rate increases, but the powder expires immediately, and if the powder size is large, sufficient absorption and release rates cannot be obtained.
It is preferable that the thickness be 1 μm or more and 10 μm or less.
【０００９】本発明に用いられる接着剤中には、潜在性
硬化剤、反応抑制剤、粘着付与剤、各種カップリング
剤、老化防止剤、金属不活性剤、補強用充填剤等の添加
剤が適宜添加されてもよく、硬化反応を促進するうえで
マイクロカプセル化されたアミン系化合物の添加は特に
有効である。The adhesive used in the present invention contains additives such as a latent curing agent, a reaction inhibitor, a tackifier, various coupling agents, an antioxidant, a metal deactivator, and a reinforcing filler. It may be added as appropriate, and the addition of a microencapsulated amine compound is particularly effective in promoting the curing reaction.
【００１０】本発明に用いられる導電性粒子としては従
来のものが使用でき、金、銀、銅、ニッケル、パラジウ
ム、ステンレス、しんちゅう、半田等の金属、合金粒
子、タングステン−カーバイト、シリカカーバイト等の
セラミック粒子、カーボン粒子、表面を金属被覆したプ
ラスチック粒子等が例示される。導電性粒子の配合量は
少なすぎると導通点の密度が小さくなり、導通不良を発
生しやすく、多すぎると絶縁不良を起こしやすいので、
絶縁性接着性樹脂バインダー１００容量部に対し、０．
５〜３０容量部、好ましくは１〜１０容量部とすること
がよい。粒子径は小さ過ぎるとヒートシール時に高温高
圧を要し、また導通抵抗も不安定となり、大き過ぎると
導電ライン間で短絡を生じやすくなり、特に低ピッチラ
インの接続で不利となるので、３〜１００μｍ、好まし
くは１０〜４０μｍとすることが望ましい。As the conductive particles used in the present invention, conventional ones can be used, such as metals such as gold, silver, copper, nickel, palladium, stainless steel, brass, solder, alloy particles, tungsten carbide, and silica carbide. Examples thereof include ceramic particles such as cutting tools, carbon particles, and plastic particles having a metal-coated surface. If the compounding amount of the conductive particles is too small, the density of conduction points becomes small, and conduction failure is easily caused.If it is too large, insulation failure is easily caused.
With respect to 100 parts by volume of the insulating adhesive resin binder, 0.
The volume may be 5 to 30 parts by volume, preferably 1 to 10 parts by volume. If the particle size is too small, high temperature and high pressure are required during heat sealing, and the conduction resistance is also unstable.If the particle size is too large, short circuits are likely to occur between the conductive lines, which is disadvantageous especially in connection with low pitch lines. It is desirable that the thickness be 100 μm, preferably 10 to 40 μm.
【００１１】本発明の製造方法に用いられるセパレータ
としては、従来のものが使用でき、ポリテトラフルオロ
エチレン（ＰＴＦＥ）等のフッ素樹脂フィルム、あるい
は、表面にシリコーン樹脂等により離型処理した紙、高
分子フィルム等が例示されるが、離型剤の移行による接
着性の低下を避けるため、ＰＴＦＥフィルムとするのが
よい。As the separator used in the production method of the present invention, a conventional separator can be used, and a fluororesin film such as polytetrafluoroethylene (PTFE) or a paper whose surface has been subjected to a release treatment with a silicone resin or the like can be used. Although a molecular film and the like are exemplified, it is preferable to use a PTFE film in order to avoid a decrease in adhesion due to migration of the release agent.
【００１２】本発明の異方導電性接着膜を製造するに
は、まず上記熱可塑性樹脂（Ａ）、エポキシ基を含む樹
脂（Ｂ）、水吸着性粉末および導電性粒子を溶媒にて溶
解混合するが、樹脂成分の溶液状態での硬化反応を開始
させないために、水吸着性粉末は、少なくともエポキシ
基を含む樹脂を混合する前に、熱可塑性樹脂溶液に投入
するのが好ましい。また、熱可塑性樹脂（Ａ）とエポキ
シ基を含む樹脂（Ｂ）とを混合するにあたり、エポキシ
基を含む樹脂が液状の場合には直接あるいは溶媒に溶解
して、固形状の場合には溶媒に溶解して、エポキシ基を
含む樹脂（Ｂ）にも水吸着性粉末を加えた後、熱可塑性
樹脂溶液（Ａ）に混合するようにすれば、硬化反応の制
御に対してさらに効果的である。In order to produce the anisotropic conductive adhesive film of the present invention, first, the thermoplastic resin (A), the resin (B) containing an epoxy group, the water-adsorbing powder and the conductive particles are dissolved and mixed in a solvent. However, in order to prevent the curing reaction in the solution state of the resin component from being started, it is preferable that the water-adsorptive powder is added to the thermoplastic resin solution before mixing the resin containing at least the epoxy group. In addition, when mixing the thermoplastic resin (A) and the resin (B) containing an epoxy group, the resin containing an epoxy group is dissolved directly in a liquid or dissolved in a solvent when the resin is a liquid, and is mixed with the solvent when the resin is a solid. It is more effective to control the curing reaction by dissolving and adding the water-absorbing powder to the epoxy group-containing resin (B) and then mixing it with the thermoplastic resin solution (A). .
【００１３】この混合物をセパレーター上あるいは電気
回路基板上に膜状にシーティングする方法としては、ロ
ールコータ、ナイフコータ等を用いる方法、スクリーン
印刷、グラビア印刷等の印刷による方法、スプレーによ
る方法等が例示される。シーティング後溶媒を除去する
方法としては、樹脂成分（Ａ）、（Ｂ）に硬化反応を開
始させないため、なるべく低い温度、具体的には７０℃
以下とすることが望ましく、このため、加熱によらな
い、送風乾燥、真空乾燥等の方法が好ましい。Examples of a method of sheeting the mixture on a separator or an electric circuit board in a film form include a method using a roll coater, a knife coater or the like, a printing method such as screen printing, gravure printing, a spraying method and the like. You. As a method for removing the solvent after the sheeting, a temperature as low as possible, specifically 70 ° C., is used to prevent the resin components (A) and (B) from starting a curing reaction.
It is desirable to set the following. For this reason, methods such as air drying and vacuum drying that do not rely on heating are preferable.
【００１４】[0014]
【作用】上記したように、本発明の異方導電性接着膜
は、熱可塑性樹脂（Ａ）中の無水有機酸基が開環するこ
とにより、樹脂（Ｂ）中のエポキシ基との反応が開始、
促進されるのであるが、水吸着性粉末の存在により、溶
液状態での反応を制御し、膜状態である程度の無水有機
酸は開環するが、固形状態では分子の運動の自由度が小
さいため反応はほとんど起こらず、ヒートシール時に加
熱されることによって、樹脂（Ａ）、（Ｂ）が溶融状態
になるとともに水吸着性粉末が水分を放出し、反応が開
始促進される。このため、熱硬化型でありながら可使時
間を短くすることがなく、かつ、低温、短時間での接続
が可能となる。As described above, the anisotropic conductive adhesive film of the present invention reacts with the epoxy group in the resin (B) by opening the anhydride organic acid group in the thermoplastic resin (A). start,
Although it is promoted, the presence of the water-adsorbing powder controls the reaction in the solution state, and some organic anhydrides are opened in the film state, but the degree of freedom of molecular movement is small in the solid state. The reaction hardly occurs, and the resin (A) or (B) is brought into a molten state by being heated at the time of heat sealing, and the water-adsorbing powder releases moisture, thereby promoting the start of the reaction. For this reason, the connection can be made at a low temperature and in a short time without shortening the pot life while being a thermosetting type.
【００１５】[0015]
【実施例】熱可塑性樹脂（Ａ）としての無水マレイン酸
変性ＳＥＢＳ樹脂１００重量部に対し、トルエン３００
重量部を加えて溶解した後、吸着有効直径３Å、平均粒
径１．５μｍのゼオライト粉末（密度２．２ｇ／ｃ
ｍ3）を２０重量部加え、２時間攪拌した。液状エポキ
シ樹脂であり１０分子に一個の割合で末端に塩素基を含
むビスフェノールＡジグリシジルエーテル［樹脂
（Ｂ）］５０重量部に対し、上記のゼオライト粉末１０
重量部および酸化マグネシウム粉末（密度３．６５ｇ／
ｃｍ3）２重量部を加え、２時間攪拌したものを、上記
ＳＥＢＳ樹脂、トルエン、ゼオライト粉末の混合物に全
量投入混合した。これに表面を金メッキした平均粒径１
０μｍのニッケル粒子（密度８．８５ｇ／ｃｍ3）を上
記樹脂混合物（絶縁性接着性樹脂バインダー）１００容
量部に対して５容量部加え分散させた。つぎにこれを８
０μｍ厚さのＰＴＦＥフィルム上にナイフコーターにて
コーティングし、送風乾燥して膜厚２５μｍの本発明の
異方導電性接着膜を得た。膜製造後２３℃、６５％ＲＨ
保存１日、３ケ月について、０．２ｍｍピッチＦＰＣと
ＩＴＯガラス基板（３０Ω／□）をヒートシール条件１
４０℃、２．９４ＭＰａ（３０ｋｇ／ｃｍ2 ）、１０秒
にて接続し、ＦＰＣの隣接電極間の抵抗値を測定した。
１日放置後で平均値２．０Ω、最大値２．２Ωであった
のに対し、３か月放置後でも平均値２．０Ω、最大値
２．２Ωで変化はなかった。また、これら接続したもの
を１００℃雰囲気中に２４０時間放置後測定したとこ
ろ、どちらも平均値２．１Ω、最大値２．３Ωで、ほと
んど変化はなかった。EXAMPLE 100 parts by weight of a maleic anhydride-modified SEBS resin as a thermoplastic resin (A) was added to 300 parts of toluene.
After adding and dissolving parts by weight, zeolite powder having an effective adsorption diameter of 3 mm and an average particle size of 1.5 μm (density 2.2 g / c
m 3 ) was added and stirred for 2 hours. The above-mentioned zeolite powder 10 is added to 50 parts by weight of bisphenol A diglycidyl ether [resin (B)] which is a liquid epoxy resin and contains a chlorine group at one terminal per 10 molecules.
Parts by weight and magnesium oxide powder (density 3.65 g /
cm 3 ) 2 parts by weight were added, and the mixture was stirred for 2 hours, and the whole was charged and mixed with the above mixture of SEBS resin, toluene and zeolite powder. The average particle size is 1
Five parts by volume of 0 μm nickel particles (density: 8.85 g / cm 3 ) were dispersed in 100 parts by volume of the above resin mixture (insulating adhesive resin binder). Next, this is 8
A 0 μm-thick PTFE film was coated with a knife coater and blown dry to obtain a 25 μm-thick anisotropic conductive adhesive film of the present invention. 23 ° C, 65% RH after film production
Heat sealing condition of 0.2mm pitch FPC and ITO glass substrate (30Ω / □) for 1 day and 3 months of storage
Connection was performed at 40 ° C. and 2.94 MPa (30 kg / cm 2 ) for 10 seconds, and the resistance value between adjacent electrodes of the FPC was measured.
The average value was 2.0Ω and the maximum value was 2.2Ω after being left for 1 day, whereas the average value was 2.0Ω and the maximum value was 2.2Ω even after being left for 3 months. Further, when these connected ones were left in an atmosphere of 100 ° C. for 240 hours and measured, the average value was 2.1 Ω and the maximum value was 2.3 Ω, and there was almost no change.
【００１６】[0016]
【発明の効果】以上より明らかなように、本発明の異方
導電性接着膜、製造方法を用いれば、比較的短時間低温
で信頼性の高いヒートシール接続が可能で、しかも可使
時間が長く、保存に特別な考慮を必要としないため、作
業効率が向上しコストダウンにつながるとともに自動車
内、屋外等過酷な条件下で使用される製品にも適用が可
能となる。As is evident from the above, the use of the anisotropic conductive adhesive film and the manufacturing method of the present invention makes it possible to perform a reliable heat seal connection at a low temperature for a relatively short period of time, and furthermore, the usable time is long. Since it is long and does not require special consideration for storage, work efficiency is improved and cost is reduced, and it can be applied to products used under severe conditions such as in an automobile or outdoors.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01B 1/20 C09J 163/00 H01B 5/16 H01B 13/00 503 H05K 3/32 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) H01B 1/20 C09J 163/00 H01B 5/16 H01B 13/00 503 H05K 3/32
Claims (3)
を含む熱可塑性樹脂（Ａ）と、一分子中に少なくとも２
個のエポキシ基を含む樹脂（Ｂ）とからなる絶縁性接着
性樹脂バインダー１００容量部に対し、水吸着性粉末
０．０１〜５０容量部、粒径３〜１００μｍの導電性粒
子０．５〜３０容量部を含んでなることを特徴とする異
方導電性接着膜。1. A thermoplastic resins (A) comprising at least one anhydrous organic acid group in one molecule, at least 2 in one molecule
Number of relative Tree fat (B) from become insulating adhesive resin binder 100 parts by volume containing epoxy groups, water absorptive powder 0.01-50 parts by volume of the particle size 3~100μm conductive particles 0.5 different <br/> anisotropically conductive adhesive film you characterized by comprising 30 parts by volume.
０分子中に１個の割合で塩素基を含むものであることを
特徴とする請求項１に記載の異方導電性接着膜。 2. The method according to claim 1, wherein the resin containing an epoxy group is 0.5 to 20.
That one molecule contains a chlorine group in one molecule
The anisotropic conductive adhesive film according to claim 1, wherein:
た後、前記水吸着性粉末を混合してから、前記エポキシ
基を含む樹脂（Ｂ）と導電性粒子を混合し、これをセパ
レータ上あるいは電気回路基板上に膜状にシーティング
した後、乾燥して上記溶媒を除去することを特徴とする
請求項１または請求項２に記載の異方導電性接着膜の製
造方法。 Wherein after said thermoplastic resin (A) is dissolved in a solvent, or a mixture of said water absorptive powder et al, the epoxy
The resin (B) and conductive particles combined mixed containing group, after which a seating in a film shape onto or electric circuit board separator, you and removing the solvent and drying
The method for producing an anisotropic conductive adhesive film according to claim 1 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3155591A JP3054466B2 (en) | 1991-05-30 | 1991-05-30 | Anisotropic conductive adhesive film and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3155591A JP3054466B2 (en) | 1991-05-30 | 1991-05-30 | Anisotropic conductive adhesive film and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04355004A JPH04355004A (en) | 1992-12-09 |
| JP3054466B2 true JP3054466B2 (en) | 2000-06-19 |
Family
ID=15609382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3155591A Expired - Fee Related JP3054466B2 (en) | 1991-05-30 | 1991-05-30 | Anisotropic conductive adhesive film and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3054466B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08218050A (en) * | 1995-02-09 | 1996-08-27 | Mitsui Toatsu Chem Inc | Epoxy-based adhesive composition |
| JP2011102404A (en) * | 2011-02-17 | 2011-05-26 | Sony Chemical & Information Device Corp | Anisotropic conductive film |
| CN103732708A (en) * | 2011-08-10 | 2014-04-16 | 住友电气工业株式会社 | Conductive adhesive tape winding unit |
| KR102464438B1 (en) * | 2020-12-10 | 2022-11-07 | 포항공과대학교 산학협력단 | Stretchable anisotropic conductive film, method of manufacturing the same, interface interconnection material comprising the same and elements comprising the same |
-
1991
- 1991-05-30 JP JP3155591A patent/JP3054466B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04355004A (en) | 1992-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20080070680A (en) | Anisotropic conductive adhesive compositions | |
| JPS6140316A (en) | Directly solderable electroconductive composition | |
| JPH10168412A (en) | Anisotropically conductive adhesive | |
| JPH10298526A (en) | Composition for connecting circuit and film using the same | |
| JPH09291268A (en) | Adhesive composition and connecting member comprising the same composition | |
| JP3054466B2 (en) | Anisotropic conductive adhesive film and manufacturing method thereof | |
| JPH06295617A (en) | Anithotropic conductive adhesive compound | |
| JP3418492B2 (en) | Anisotropic conductive film | |
| JP4539813B2 (en) | Insulation coated conductive particles | |
| JPH05339556A (en) | Adhesive composition | |
| JPH11209714A (en) | Anisotropically electroconductive adhesive | |
| JPH07173448A (en) | Anisotropically conductive film | |
| JP3904097B2 (en) | Anisotropic conductive connection member | |
| JP2680412B2 (en) | Anisotropic conductive film | |
| JPH10273635A (en) | Connecting member for circuit and production of circuit board | |
| JP2007018760A (en) | Anisotropic conduction film for glass base plate connection | |
| JP2894093B2 (en) | Adhesive composition and laminated film | |
| JP2003147306A (en) | Conductive adhesive | |
| JPH0521094A (en) | Anisotropic electric conductive adhesive agent | |
| JPH11106731A (en) | Composition for circuit connection and film made therefrom | |
| JP3358574B2 (en) | Anisotropic conductive adhesive | |
| JPH01121385A (en) | Adhesive film for bonding electronic part | |
| JP4112024B2 (en) | Circuit connection member | |
| JP2680430B2 (en) | Anisotropic conductive film | |
| JPH0552873B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |