JPH10237315A - Resin composition, resin molded product using the same, and its production - Google Patents
Resin composition, resin molded product using the same, and its productionInfo
- Publication number
- JPH10237315A JPH10237315A JP9041145A JP4114597A JPH10237315A JP H10237315 A JPH10237315 A JP H10237315A JP 9041145 A JP9041145 A JP 9041145A JP 4114597 A JP4114597 A JP 4114597A JP H10237315 A JPH10237315 A JP H10237315A
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- Prior art keywords
- resin
- conductive
- molding
- thermoplastic resin
- conductive material
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、樹脂組成物に関す
るもので、特に、導電部と絶縁部とを有する樹脂成形品
およびその製造方法に係わるものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition, and more particularly to a resin molded product having a conductive portion and an insulating portion and a method for producing the same.
【０００２】[0002]
【従来の技術】従来、この種の導電部を有する樹脂組成
物は、高導電性のプラスチックを得るために導電フィラ
ーとして、銅やステンレス等の金属短繊維を混入してい
る。例えば、この導電フィラーとしてはＰｂ−Ｓｎ系の
半田粉末（例えば、Ｐｂ：７０％、Ｓｎ：３０％のも
の）を樹脂中に混入し導電性をもたせるようにした樹脂
が、プラスチック成形加工学会学会誌（成形加工 ’９
３）の１４３〜１４４頁に開示されており、また特公平
７−４９４９１号公報には、導電性繊維とＰｂ−Ｓｎを
主成分とした低融点金属を併用した導電性樹脂組成物が
開示されている。2. Description of the Related Art Conventionally, a resin composition having a conductive portion of this type has been mixed with a short metal fiber such as copper or stainless steel as a conductive filler in order to obtain a highly conductive plastic. For example, as the conductive filler, a resin in which a Pb-Sn-based solder powder (for example, Pb: 70%, Sn: 30%) is mixed into the resin so as to have conductivity is used. Magazine (Molding '9
3), pages 143 to 144, and Japanese Patent Publication No. 7-49491 discloses a conductive resin composition using a combination of a conductive fiber and a low-melting metal containing Pb-Sn as a main component. ing.
【０００３】一般的に、樹脂に導電部を持たせるには、
例えば、特開昭６３−５０４８２号、特開平１−２０７
９８９号公報に開示されているように、無電解メッキす
ることが容易なプラスチック成形材料（易メッキ性材
料）で、骨格に相当する部分の一次成形体を形成した
後、一次成形体の外面のメッキ不要部分に無電解メッキ
することが困難なプラスチック成形材料（難メッキ性材
料）を注入し、これらを一体として二次成形した後、易
メッキ性材料の露出部にメッキを施す方法が用いられて
いる。Generally, in order to make a resin have a conductive part,
For example, JP-A-63-50482, JP-A-1-207
As disclosed in Japanese Patent No. 989, after forming a primary molded body corresponding to a skeleton with a plastic molding material (easy plating material) which is easily electrolessly plated, an outer surface of the primary molded body is formed. A method is used in which a plastic molding material (difficult to plating), which is difficult to electrolessly plate, is injected into portions that do not require plating, and these are integrally formed and then secondary molded, and then the exposed portions of the easily plating material are plated. ing.
【０００４】このように、メッキにより導電部を形成す
る方法を、図６を参照して説明すると、最初、充填材と
ベース樹脂（例えば、熱可塑性樹脂）を一定の割合で配
合して、配合されたものを混練し、ペレタイズ化してメ
ッキ容易な樹脂ペレット（導電材）を作る。その後、樹
脂の射出成形により骨格となる一次成形体を作り、この
一次成形体にメッキがのりやすくなるように表面の活性
化が行われるようにエッチング触媒処理を一次成形体の
表面に施し、次に、一次成形体に対して二次成形を行
う。その後、メッキ工程で表面が活性化された場所にメ
ッキが形成され導電部を有した樹脂成形品が得られるも
のである。A method of forming a conductive portion by plating will be described with reference to FIG. 6. First, a filler and a base resin (for example, a thermoplastic resin) are blended at a fixed ratio, and the blending is performed. The kneaded material is kneaded and pelletized to form resin pellets (conductive material) that are easily plated. Thereafter, a primary molded body serving as a skeleton is formed by injection molding of a resin, and an etching catalyst treatment is performed on the surface of the primary molded body so that the surface is activated so that plating is easily performed on the primary molded body. Next, secondary molding is performed on the primary molded body. Thereafter, plating is formed at a place where the surface is activated in the plating step, and a resin molded product having a conductive portion is obtained.
【０００５】[0005]
【本発明が解決しようとする課題】しかしながら、導電
性繊維とＳｎ−Ｐｂを主成分とする低融点金属からなる
導電性組成物では、有害である鉛を用いるために環境へ
の影響がよくなく、これに変わるものが近年必要とされ
ている。However, a conductive composition comprising a conductive fiber and a low melting point metal containing Sn-Pb as a main component has a poor effect on the environment due to the use of harmful lead. In recent years, alternatives have been required.
【０００６】また、導電部を有する樹脂を作る場合に
は、導電部形成にメッキを施さなければならず、メッキ
工程が余分になり、製造コストが高くなってしまう。When a resin having a conductive portion is formed, plating must be applied to the formation of the conductive portion, which requires an extra plating step and increases the manufacturing cost.
【０００７】そこで、本発明は上記の問題点に鑑みてな
されたものであり、環境への影響が少ない樹脂組成物と
すること、また、その樹脂組成物により導電部と絶縁部
を有した樹脂成形品を作ること、更には、この樹脂組成
物の製造には高いコストとならないことを技術的課題と
する。In view of the above, the present invention has been made in view of the above-mentioned problems, and has been made to provide a resin composition having little effect on the environment, and a resin having a conductive portion and an insulating portion by using the resin composition. It is a technical problem that a molded article is produced, and that the production of the resin composition is not expensive.
【０００８】[0008]
【課題を解決するための手段】上記の課題を解決するた
め講じた第１の技術的手段は、樹脂成形時に成形可能で
あると共に鉛を含まず錫を主成分とした低融点合金を、
熱可塑性樹脂または熱硬化性樹脂に混練して導電性を有
する樹脂とした。The first technical means taken to solve the above-mentioned problem is to provide a low-melting alloy which is moldable at the time of resin molding and contains no lead and contains tin as a main component.
A resin having conductivity was obtained by kneading with a thermoplastic resin or a thermosetting resin.
【０００９】上記の構成により、鉛を含まない低融点合
金を用いることで、環境への影響が少ない樹脂組成物が
形成される。According to the above-described structure, a resin composition having less influence on the environment is formed by using a low-melting alloy containing no lead.
【００１０】好ましくは、低融点合金として、Ｓｎ−Ｃ
ｕ系から成るものを用いれば、配合の割合でこの合金の
融点を低くすることが可能となり、成形時においては溶
融状態を保つことができ、成形し易くなる。[0010] Preferably, as the low melting point alloy, Sn-C
If a u-based alloy is used, it is possible to lower the melting point of this alloy by the proportion of the compound, and to maintain the molten state during molding, thereby facilitating molding.
【００１１】第２の技術的手段によれば、樹脂成形時に
成形可能であると共に、鉛を含まず錫を主成分とした低
融点合金を、熱可塑性樹脂または熱硬化性樹脂に混練し
て導電性を有する樹脂組成物から成る導電部と、熱可塑
性樹脂または熱硬化性樹脂から成る絶縁部とを有した。According to the second technical means, a low-melting alloy which is moldable at the time of molding a resin and which contains tin as a main component and does not contain lead is kneaded with a thermoplastic resin or a thermosetting resin to form a conductive material. It had a conductive part made of a resin composition having a property and an insulating part made of a thermoplastic resin or a thermosetting resin.
【００１２】上記の第２の技術的手段により、一次成形
では導電部を有する一次成形体を作り、二次成形では導
電部を備え絶縁部が作られるので、環境への影響が少な
い状態で導電部と絶縁部をもつ樹脂成形品が得られる。According to the second technical means, a primary molded body having a conductive portion is produced in the primary molding, and an insulating portion is provided in the secondary molding with the conductive portion. A resin molded product having a portion and an insulating portion is obtained.
【００１３】第３の技術的手段によれば、導電性充填材
とベース樹脂とを混練する工程、前記ベース樹脂が熱可
塑性樹脂の場合にはペレタイズ化して導電材を作り、ま
た前記ベース樹脂が熱硬化性樹脂の場合には混練したも
のから導電材を作る工程、一次成形で前記熱可塑性樹脂
または前記熱硬化性樹脂により本体成形品を作る工程、
二次成形で前記本体成形品に前記導電材により導電部を
成形する工程を有するものとした。According to the third technical means, the step of kneading the conductive filler and the base resin is performed. If the base resin is a thermoplastic resin, the conductive resin is pelletized to form a conductive material. In the case of a thermosetting resin, a step of forming a conductive material from the kneaded one, a step of forming a main body molded article by the thermoplastic resin or the thermosetting resin by primary molding,
The method further includes a step of forming a conductive portion from the conductive material on the main body molded article by secondary forming.
【００１４】上記の第３の技術的手段によれば、一次成
形で本体成形品を成形した後に、二次成形で導電部が成
形され、結果、導電部と絶縁部をもった樹脂成形品が得
られるので、メッキ工程がいらないものとなり、製造コ
ストが従来ほど高くならないものとなる。[0014] According to the third technical means, after the main body is molded by the primary molding, the conductive portion is molded by the secondary molding. As a result, the resin molded product having the conductive portion and the insulating portion is formed. As a result, the plating step is not required, and the manufacturing cost is not as high as in the past.
【００１５】第４の技術的手段によれば、導電性充填材
とベース樹脂とを混練する工程、前記ベース樹脂が熱可
塑性樹脂の場合にはペレタイズ化して導電材を作り、ま
た前記ベース樹脂が熱硬化性樹脂の場合には混練したも
のから導電材を作る工程、一次成形で前記導電材により
導電部を作り、二次成形で前記導電部を備えて熱可塑性
樹脂または熱硬化性樹脂により本体成形品を作る工程を
有するものとした。According to the fourth technical means, the step of kneading the conductive filler and the base resin is performed. If the base resin is a thermoplastic resin, it is pelletized to form a conductive material. In the case of a thermosetting resin, a step of forming a conductive material from a kneaded material, forming a conductive portion with the conductive material in a primary molding, and providing the conductive portion in a secondary molding with a main body made of a thermoplastic resin or a thermosetting resin. It had a process of forming a molded article.
【００１６】上記の第４の技術的手段によれば、一次成
形において導電部を成形し、導電部を有した本体成形部
が二次成形により成形され、結果、導電部と絶縁部をも
った樹脂成形品が得られるので、メッキ工程がいらない
ものとなり、製造コストが従来ほど高くならないものと
なる。According to the fourth technical means, the conductive portion is formed in the primary forming, and the main body forming portion having the conductive portion is formed by the secondary forming, and as a result, the conductive portion and the insulating portion are provided. Since a resin molded product is obtained, a plating step is not required, and the manufacturing cost is not as high as in the past.
【００１７】この場合、混練時に分散助剤を用いれば、
ペレット化のとき分散が十分に起こりよく混練され、均
一に混じることから樹脂成形品の品質が良くなる。In this case, if a dispersing aid is used during kneading,
In the case of pelletization, dispersion occurs sufficiently, and the mixture is kneaded well and uniformly mixed, so that the quality of the resin molded product is improved.
【００１８】[0018]
【発明の実施形態】以下、本発明の実施形態を図面を参
照して説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１９】最初に、導電材７について、図１を参照し
て説明を行う。導電材７は充填材１とベース樹脂（熱可
塑性樹脂、または熱硬化性樹脂）２から基本的に成り立
っており、充填材１としては樹脂成形時に成形ができ、
錫を主成分とし鉛を含まない低融点合金を用いる。この
低融点合金は、混練時に一緒に加えることで成形のとき
に溶融状態を保つことができ、成形し易いものであれば
限定されない。例えば、Ｓｎ−Ｃｕ系の一例としてＳｎ
−Ｃｕ−Ｎｉ−Ｐから成る合金（福田金属箔粉工業製
Ｓｎ−Ｃｕ−Ｎｉ−Ａｔ・Ｗ−１５０）を使用する。First, the conductive material 7 will be described with reference to FIG. The conductive material 7 basically consists of a filler 1 and a base resin (thermoplastic resin or thermosetting resin) 2, and the filler 1 can be formed at the time of resin molding.
A low melting point alloy containing tin as a main component and not containing lead is used. The low melting point alloy is not limited as long as it can be kept in a molten state during molding by being added together during kneading and can be easily molded. For example, as an example of the Sn—Cu system,
-Cu-Ni-P alloy (Fukuda Metal Foil & Powder Co., Ltd.)
Sn-Cu-Ni-At.W-150) is used.
【００２０】ベース樹脂２の材料としては熱可塑性樹脂
または熱硬化性樹脂が用いられるが、例えばベース樹脂
２に熱可塑性樹脂を用いる場合には、アクリロニトリル
ブタジエンスチレン（ＡＢＳ），ポリブチレンテレフタ
レート（ＰＢＴ）、ポリエチレンテレフタレート（ＰＥ
Ｔ）、ポリフェニレンサルファイド、ポリアミド、液晶
ポリマー、ポリスチレン、ポリエーテルイミド、ポリベ
ンゾイミダゾール、ポリエーテル−エーテルケトン、ポ
リエーテルサルフォン等の樹脂のいずれかまたは複数の
樹脂が用いられる。As the material of the base resin 2, a thermoplastic resin or a thermosetting resin is used. For example, when a thermoplastic resin is used for the base resin 2, acrylonitrile butadiene styrene (ABS), polybutylene terephthalate (PBT) , Polyethylene terephthalate (PE
Any one or a plurality of resins such as T), polyphenylene sulfide, polyamide, liquid crystal polymer, polystyrene, polyetherimide, polybenzimidazole, polyether-etherketone, and polyethersulfone are used.
【００２１】この充填材１の低融点合金とベース樹脂２
に銅やニッケル等の金属粉末の分散助剤３を加えるが、
ベース樹脂２、充填材１、分散助剤３の配合比を４５：
４０：１５にして混合・混練４し、押出成形を行い押出
成形により押出された樹脂をホットカット法等により細
かく切断を行ってペレット状態の導電材７を作る。The low melting point alloy of the filler 1 and the base resin 2
A dispersion aid 3 of a metal powder such as copper or nickel is added to
The mixing ratio of the base resin 2, the filler 1, and the dispersion aid 3 is 45:
The mixture is mixed and kneaded at a ratio of 40:15, extruded, and the extruded resin is finely cut by a hot cut method or the like to produce a conductive material 7 in a pellet state.
【００２２】一方、ベース樹脂２が熱硬化製樹脂（例え
ば、フェノール樹脂、エポキシ樹脂、不飽和ポリエステ
ル樹脂等のいずれかまたは複数の樹脂）の場合には、前
述の導電材７を作るまでの工程が多少異なる。つまり、
ベース樹脂（ここでは、熱硬化性樹脂）２に対し、配合
混練されたもので導電材７を得る点が異なるものであ
る。On the other hand, when the base resin 2 is a thermosetting resin (for example, any one or a plurality of resins such as a phenol resin, an epoxy resin, and an unsaturated polyester resin), the steps up to forming the conductive material 7 described above. Is slightly different. That is,
The difference is that a conductive material 7 is obtained by mixing and kneading the base resin (here, thermosetting resin) 2.
【００２３】このような工程にて得られた導電材７は、
以下に示す一次成形８及び二次成形９を経て導電部と絶
縁部を有する樹脂成形品１０になる。この場合、図１に
示されるように熱可塑性樹脂または熱硬化性樹脂により
絶縁部を先に作り、その後に導電材から導電部を作る場
合と、導電材から導電部を先に作り、その後に熱可塑性
樹脂または熱硬化性樹脂により絶縁部を得る方法の２種
類存在する。The conductive material 7 obtained in such a process is
Through a primary molding 8 and a secondary molding 9 described below, a resin molded product 10 having a conductive portion and an insulating portion is obtained. In this case, as shown in FIG. 1, an insulating portion is first made of a thermoplastic resin or a thermosetting resin, and then a conductive portion is made of a conductive material. There are two types of methods for obtaining an insulating portion using a thermoplastic resin or a thermosetting resin.
【００２４】そこで、導電部を有する樹脂成形品１０の
具体例を、図２〜図４を参照して、車両に用いられてい
るスロットルセンサに適用した第１実施例について詳細
を述べることにする。The first embodiment in which a specific example of the resin molded article 10 having a conductive portion is applied to a throttle sensor used in a vehicle will be described in detail with reference to FIGS. .
【００２５】図２は、樹脂成形品１０のセンサ外観（平
面図）であり、図３は図２のＡ−Ａ断面図である。この
図２および図３に示されるように、センサ１０はコネク
タケース２１とハウジング１１が一体で形成される。こ
のセンサ１０は熱可塑性樹脂（例えば、ＰＢＴ）から成
る樹脂ハウジング１１と、熱可塑性樹脂から射出成形に
より第１導電性樹脂（導電部）１６と一体的に形成され
た基板１３と、基板１３上にスクリーン印刷により銀等
の粉末を焼き付けて形成された抵抗体２０と、抵抗体２
０と摺接するブラシ１８と、ハウジングに嵌合し上部で
ブラシ１８が溶着され一端がこのハウジング内部で支持
されたリターンスプリング１７に付勢されるブラシホル
ダ１２と、金属性のターミナル１４と、ターミナル１４
と一体的に形成された第２導電性樹脂（導電部）１６と
から構成される。FIG. 2 is an external view (plan view) of a sensor of the resin molded product 10, and FIG. 3 is a sectional view taken along line AA of FIG. As shown in FIGS. 2 and 3, the sensor 10 has a connector case 21 and a housing 11 integrally formed. The sensor 10 includes a resin housing 11 made of a thermoplastic resin (for example, PBT), a substrate 13 integrally formed with a first conductive resin (conductive portion) 16 by injection molding from the thermoplastic resin, and A resistor 20 formed by baking a powder of silver or the like by screen printing on the
0, a brush holder 12 which is fitted into the housing, the brush 18 is welded at the upper part, and one end is urged by a return spring 17 supported inside the housing, a metallic terminal 14, and a terminal 14
And a second conductive resin (conductive portion) 16 integrally formed.
【００２６】第１および第２導電性樹脂１５，１６は、
ベース樹脂（ここではＰＢＴを用いるが、ポリエチレン
テレフタレート、ポリフェニレンサルファイド、ポリア
ミド、液晶ポリマー、ポリスチレン、ポリエーテルイミ
ド、ポリベンゾイミダゾール、ポリエーテル−エーテル
ケトン、ポリエーテルサルフォン等の熱可塑性樹脂を変
えて用いることも可）に、充填材１として錫を主成分と
し成形時の成形が可能で環境への影響が少ない低融点合
金と、銅やニッケル等の粉末の分散助剤３を一緒に配合
したものから成る。この場合配合比は、ベース樹脂２が
４５体積パーセント、充填材１の低融点合金が４０体積
パーセント、分散助剤３が１５体積パーセントで配合し
た。The first and second conductive resins 15, 16 are:
Base resin (here, PBT is used, but thermoplastic resin such as polyethylene terephthalate, polyphenylene sulfide, polyamide, liquid crystal polymer, polystyrene, polyetherimide, polybenzimidazole, polyether-etherketone, polyethersulfone, etc. is used. In addition, a low melting point alloy containing tin as a main component as a filler 1 and capable of being formed at the time of forming and having little influence on the environment, and a dispersion aid 3 of powder such as copper or nickel are mixed together. Consists of In this case, the compounding ratio was such that the base resin 2 was 45% by volume, the low melting point alloy of the filler 1 was 40% by volume, and the dispersing aid 3 was 15% by volume.
【００２７】このように上記の低融点合金をベース樹脂
２と共に用いることで、体積固有抵抗率は約１０-5Ωｃ
ｍとなり、伝達損失が極めて小さい高導電性の樹脂組成
物である導電材を作ることができ、低融点合金を用い配
合の割合によって、射出成形時には低融点合金が半溶融
状態となり、成形が容易なものとなる。As described above, by using the low melting point alloy together with the base resin 2, the volume resistivity is about 10 −5 Ωc.
m, a conductive material that is a highly conductive resin composition with extremely low transmission loss can be produced. Depending on the proportion of the low melting alloy used, the low melting alloy is in a semi-molten state during injection molding, making molding easier. It becomes something.
【００２８】次に、センサ１０の製造方法について説明
する。製造方法については図示しない成形型および成形
時に樹脂を注入するキャビティ空間（成形型に形成さ
れ、樹脂を注入する空間）にターミナル１４を成形型の
所定位置にセットした状態で、キャビティ空間に溶融し
た第２導電性樹脂１６を射出し、第２導電性樹脂（導電
部）１６およびターミナル１４の成形体を冷却して第２
導電性樹脂を凝固させることにより、ターミナル１４と
第２導電性樹脂１６が一次成形により一体的に成形され
る。このとき、第２導電性樹脂１６に凸部１９を形成し
て、ターミナルの抜けを防止する。そして、一体となっ
たターミナル１４と第２導電性樹脂１６とを図示しない
成形型及びキャビティ空間の定位置にセットした状態
で、キャビティ空間に溶融した熱可塑性樹脂を射出し注
入する。その後、樹脂を冷却して凝固させることによ
り、ターミナル１４と第２導電性樹脂１６とをコネクタ
ケース２１を有するハウジング１１とを二次成形により
一体にする。Next, a method for manufacturing the sensor 10 will be described. As for the manufacturing method, the terminal 14 was set at a predetermined position of the molding die, and was melted in the cavity space in a cavity (a space formed in the molding die and injecting the resin) into which the resin was injected at the time of molding. The second conductive resin 16 is injected, and the molded body of the second conductive resin (conductive portion) 16 and the terminal 14 is cooled to form the second conductive resin 16.
By solidifying the conductive resin, the terminal 14 and the second conductive resin 16 are integrally formed by primary molding. At this time, the protrusion 19 is formed on the second conductive resin 16 to prevent the terminal from coming off. Then, with the integrated terminal 14 and the second conductive resin 16 set at a fixed position in a molding die (not shown) and the cavity space, molten thermoplastic resin is injected and injected into the cavity space. Thereafter, by cooling and solidifying the resin, the terminal 14 and the second conductive resin 16 are integrated with the housing 11 having the connector case 21 by secondary molding.
【００２９】基板１３および第１導電性樹脂（導電部）
１５は、熱可塑性樹脂から射出成形により上記と同じ工
程を経て一体的に成形される。図４に抵抗体２０を形成
する前の状態の基板１３を示す。第１導電性樹脂１５は
バッテリーのプラス端子と導通する導体部１５ａ、バッ
テリーのマイナス端子と導通する導体部１５ｂ、取り付
け時にはスロットル開度の状態信号が入力されその信号
を伝える導体部１５ｃの３ヶ所に形成されており、それ
ぞれが３つのターミナル１４（図３では１つしか図示さ
れていない）と電気的に接続するようになっている。Substrate 13 and first conductive resin (conductive part)
No. 15 is integrally molded from a thermoplastic resin through the same steps as above by injection molding. FIG. 4 shows the substrate 13 before the resistor 20 is formed. The first conductive resin 15 has three portions: a conductor portion 15a that conducts to the plus terminal of the battery, a conductor portion 15b that conducts to the minus terminal of the battery, and a conductor portion 15c to which a throttle opening degree state signal is input and transmitted when attached. , Each of which is electrically connected to three terminals 14 (only one is shown in FIG. 3).
【００３０】この組付け方法を説明すると、ハウジング
１１にリターンスプリング１７を内部に入れ、ブラシホ
ルダ１２をハウジング１１内にセットする。その後、基
板１３をハウジング１１の端部に当接させ、第１導電性
樹脂１５と第２導電性樹脂１６とが当接するような状態
で重ね合せ、超音波による溶着により基板１３とハウジ
ング１１とを接合する。To describe this assembling method, the return spring 17 is put in the housing 11 and the brush holder 12 is set in the housing 11. Thereafter, the substrate 13 is brought into contact with the end of the housing 11, the first conductive resin 15 and the second conductive resin 16 are overlapped in a state where they come into contact with each other, and the substrate 13 and the housing 11 are welded by ultrasonic waves. To join.
【００３１】このような構成にすることで、第１導電性
樹脂１５と第２導電性樹脂１６も超音波溶着により電気
的に接合される。よって、ターミナル１４は、第１導電
性樹脂１５、第２導電性樹脂１６を介して抵抗体２０と
電気的に接続されることになる。With such a configuration, the first conductive resin 15 and the second conductive resin 16 are also electrically joined by ultrasonic welding. Therefore, the terminal 14 is electrically connected to the resistor 20 via the first conductive resin 15 and the second conductive resin 16.
【００３２】次に、図５を参照して導電部を有する樹脂
成形品をドアロック装置のアクチュエータ３０に適用し
た第２実施例について簡単に説明する。Next, a second embodiment in which a resin molded product having a conductive portion is applied to an actuator 30 of a door lock device will be briefly described with reference to FIG.
【００３３】このアクチュエータ３０は内部に作動機構
を有し、ターミナル３１に入力される信号により内部に
配設されるモータ３３を動作させる。これにより、モー
タ３３の回転軸に設けられたウォーム３４を回転させ、
ウォーム３４に噛合するウォームホイール３５を正逆転
させ作動部３６を動作させることにより、図示しないド
アロックをロックまたはアンロックさせるものである。The actuator 30 has an operation mechanism inside, and operates a motor 33 disposed inside according to a signal inputted to the terminal 31. Thereby, the worm 34 provided on the rotation shaft of the motor 33 is rotated,
The door lock (not shown) is locked or unlocked by operating the operating portion 36 by rotating the worm wheel 35 meshing with the worm 34 forward and reverse.
【００３４】ここに用いられるハウジング（絶縁部）３
７と、ターミナル３１と、導電部３２が一体で成形され
て樹脂成形品となっている。Housing (insulating part) 3 used here
The terminal 7, the terminal 31, and the conductive portion 32 are integrally molded to form a resin molded product.
【００３５】この樹脂成形品の製法について説明する
と、図示しない成形型に最初、ターミナル３１を定位置
にセットし、上記と同じ方法でターミナル３１と一体で
導電部３２を成形する。ターミナル３１をセットした状
態でベース樹脂（ＰＢＴ）に、充填材として錫を主成分
とし成形時の成形が可能で環境への影響が少ないＳｎ−
Ｃｕ系の低融点合金（Ｓｎ−Ｃｕ−Ｎｉ−Ｐ合金）と、
銅やニッケル等の粉末の分散助剤を、配合して混練し導
電材３２を成形する。The method of manufacturing the resin molded article will be described. First, the terminal 31 is set at a fixed position in a molding die (not shown), and the conductive portion 32 is formed integrally with the terminal 31 by the same method as described above. With the terminal 31 set, the base resin (PBT) contains tin as a main component as a filler and can be molded at the time of molding and has a small influence on the environment.
A Cu-based low melting point alloy (Sn-Cu-Ni-P alloy);
A conductive material 32 is formed by mixing and kneading a powdery dispersing agent such as copper or nickel.
【００３６】次に、成形型のキャビティ空間に導電部３
２と一体となったターミナル１４を定位置にセットした
状態で、キャビティ空間に溶融した熱可塑性樹脂を射出
し、冷却して樹脂を凝固させることにより、ターミナル
１４と熱可塑性樹脂が一体的に成形されることで、導電
部を有する樹脂成形品１０が得られるものである。Next, the conductive portion 3 is placed in the cavity space of the mold.
In a state where the terminal 14 integrated with 2 is set at a fixed position, the molten thermoplastic resin is injected into the cavity space, and the resin is solidified by cooling, so that the terminal 14 and the thermoplastic resin are integrally formed. As a result, a resin molded product 10 having a conductive portion is obtained.
【００３７】尚、ここではベース樹脂が熱可塑性樹脂を
用いた場合を主に説明したが、熱硬化性樹脂を用いる場
合には、成形型に樹脂を注入するとき加熱することによ
り導電部を成形することが可能である。Although the case where the base resin is a thermoplastic resin has been mainly described here, when the thermosetting resin is used, the conductive portion is formed by heating when the resin is injected into the mold. It is possible to
【００３８】また、導電部の形状が２次元的な形状の場
合には一次成形および二次成形時に導電部と絶縁部のど
ちらを先に成形してもよいが、３次元的な形状の場合に
は、一次成形時に導電部を成形し二次成形時に絶縁部を
成形することが望ましい。When the conductive portion has a two-dimensional shape, either the conductive portion or the insulating portion may be formed first during the primary molding and the secondary molding. In this case, it is desirable to form a conductive part at the time of primary molding and to form an insulating part at the time of secondary molding.
【００３９】[0039]
【効果】本発明によれば、樹脂成形時に成形可能である
と共に鉛を含まず錫を主成分とした低融点合金を、熱可
塑性樹脂または熱硬化性樹脂に混練して導電性を有する
樹脂としたことにより、鉛を含まない低融点合金を用い
ることで、環境への影響が少ない樹脂組成物が形成され
る。According to the present invention, a low-melting point alloy which is moldable at the time of resin molding and contains tin as a main component without containing lead is kneaded with a thermoplastic resin or a thermosetting resin to form a resin having conductivity. As a result, by using a low-melting-point alloy containing no lead, a resin composition having less influence on the environment is formed.
【００４０】この場合、低融点合金として、Ｓｎ−Ｃｕ
系から成るものを用いれば、配合の割合でこの合金の融
点を低くすることが可能となり、成形時においては溶融
状態を保つことができ、成形し易くなる。In this case, Sn-Cu is used as the low melting point alloy.
If a material composed of a system is used, it is possible to lower the melting point of the alloy by the mixing ratio, and it is possible to maintain a molten state at the time of molding and to facilitate molding.
【００４１】また、樹脂成形時に成形可能であると共
に、鉛を含まず錫を主成分とした低融点合金を、熱可塑
性樹脂または熱硬化性樹脂に混練して導電性を有する樹
脂組成物から成る導電部と、熱可塑性樹脂または熱硬化
性樹脂から成る絶縁部とを有したことにより、一次成形
では導電部を有する一次成形体を作り、二次成形では導
電部を備え絶縁部が作られるので、環境への影響が少な
い状態で導電部と絶縁部をもつ樹脂成形品ができる。Also, a low melting point alloy containing tin as a main component and containing no lead, which is moldable at the time of resin molding, is kneaded with a thermoplastic resin or a thermosetting resin, and is made of a conductive resin composition. By having a conductive portion and an insulating portion made of a thermoplastic resin or a thermosetting resin, a primary molding having a conductive portion is made in the primary molding, and an insulating portion is made with the conductive portion in the secondary molding. As a result, a resin molded product having a conductive portion and an insulating portion can be formed with little influence on the environment.
【００４２】更に、導電性充填材とベース樹脂とを混練
する工程、前記ベース樹脂が熱可塑性樹脂の場合にはペ
レタイズ化して導電材を作り、また前記ベース樹脂が熱
硬化性樹脂の場合には混練したものから導電材を作る工
程、一次成形で前記熱可塑性樹脂または前記熱硬化性樹
脂により本体成形品を作る工程、二次成形で前記本体成
形品に前記導電材により導電部を成形する工程を有する
ものとしたことにより、一次成形で本体成形品を成形し
た後に、二次成形で導電部が成形され、結果、導電部と
絶縁部をもった樹脂成形品が得られるので、メッキ工程
がいらないものとなり、製造コストが従来ほど高くなら
ないものとなる。Further, a step of kneading the conductive filler and the base resin, and if the base resin is a thermoplastic resin, it is pelletized to form a conductive material. If the base resin is a thermosetting resin, A step of forming a conductive material from the kneaded material, a step of forming a main body molded article from the thermoplastic resin or the thermosetting resin by primary molding, and a step of forming a conductive portion from the conductive material to the main body molded article by secondary molding By forming the main body molded product by primary molding, the conductive portion is molded by secondary molding, and as a result, a resin molded product having a conductive portion and an insulating portion is obtained. It is unnecessary, and the manufacturing cost is not as high as in the past.
【００４３】その上、導電性充填材とベース樹脂とを混
練する工程、前記ベース樹脂が熱可塑性樹脂の場合には
ペレタイズ化して導電材を作り、また前記ベース樹脂が
熱硬化性樹脂の場合には混練したものから導電材を作る
工程、一次成形で前記導電材により導電部を作り、二次
成形で前記導電部を備えて熱可塑性樹脂または熱硬化性
樹脂により本体成形品を作る工程を有するものとしたこ
とにより、一次成形において導電部を成形し、導電部を
有した本体成形部が二次成形により成形され、結果、導
電部と絶縁部をもった樹脂成形品が得られるので、メッ
キ工程がいらないものとなり、製造コストが従来ほど高
くならないものとなる。In addition, a step of kneading the conductive filler and the base resin, a step of pelletizing to form a conductive material when the base resin is a thermoplastic resin, and a step of kneading when the base resin is a thermosetting resin. Has a process of forming a conductive material from the kneaded material, a process of forming a conductive portion from the conductive material by primary molding, and a process of forming a main body molded product from a thermoplastic resin or a thermosetting resin with the conductive portion by secondary molding. By forming the conductive part in the primary molding, the main body molded part having the conductive part is molded by the secondary molding, and as a result, a resin molded product having the conductive part and the insulating part is obtained, so that the plating is performed. The process is not required, and the manufacturing cost is not as high as in the past.
【００４４】この場合、混練時に分散助剤を用いれば、
ペレット化のとき分散が十分に起こりよく混練され、均
一に混じることから樹脂成形品の品質が良くなる。In this case, if a dispersing aid is used during kneading,
In the case of pelletization, dispersion occurs sufficiently, and the mixture is kneaded well and uniformly mixed, so that the quality of the resin molded product is improved.
【図１】 本発明の一実施形態における製造工程を示す
図である。FIG. 1 is a diagram showing a manufacturing process according to an embodiment of the present invention.
【図２】 本発明をスロットルセンサに適用した場合の
平面図である。FIG. 2 is a plan view when the present invention is applied to a throttle sensor.
【図３】 図２に示すＡ−Ａ断面図である。FIG. 3 is a sectional view taken along the line AA shown in FIG. 2;
【図４】 図１に示す抵抗体を設ける前の基板を示す平
面図である。FIG. 4 is a plan view showing a substrate before the resistor shown in FIG. 1 is provided.
【図５】 本発明のをドアロックのアクチュエータに適
用した場合の平面図である。FIG. 5 is a plan view when the present invention is applied to a door lock actuator.
【図６】 従来の製造工程を示す図である。FIG. 6 is a diagram showing a conventional manufacturing process.
１ 充填材 ２ ベース樹脂 ３ 分散助剤 ７ 導電材 １０ 樹脂成形品 DESCRIPTION OF SYMBOLS 1 Filler 2 Base resin 3 Dispersing aid 7 Conductive material 10 Resin molding
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小 浜 忠 彦 愛知県刈谷市朝日町２丁目１番地 アイシ ン精機株式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tadahiko Kohama 2-1-1 Asahi-cho, Kariya-shi, Aichi, Japan Aisin Seiki Co., Ltd.
Claims (6)
含まず錫を主成分とした低融点合金を、熱可塑性樹脂ま
たは熱硬化性樹脂に混練して導電性を有する樹脂とした
ことを特徴とする樹脂組成物。1. A low-melting alloy which is moldable at the time of resin molding and contains lead and does not contain lead as a main component is kneaded with a thermoplastic resin or a thermosetting resin to obtain a conductive resin. A resin composition.
ことを特徴とする請求項１に記載の樹脂組成物。2. The resin composition according to claim 1, wherein the low melting point alloy is made of Sn—Cu.
を含まず錫を主成分とした低融点合金を、熱可塑性樹脂
または熱硬化性樹脂に混練して導電性を有する樹脂組成
物から成る導電部と、熱可塑性樹脂または熱硬化性樹脂
から成る絶縁部とを有したことを特徴とする樹脂成形
品。3. A resin composition which is moldable at the time of resin molding and has a conductive property by kneading a low melting point alloy containing tin as a main component and not containing lead into a thermoplastic resin or a thermosetting resin. A resin molded article having a conductive portion and an insulating portion made of a thermoplastic resin or a thermosetting resin.
工程、前記ベース樹脂が熱可塑性樹脂の場合にはペレタ
イズ化して導電材を作り、また前記ベース樹脂が熱硬化
性樹脂の場合には混練したものから導電材を作る工程、
一次成形で前記熱可塑性樹脂または前記熱硬化性樹脂に
より本体成形品を作る工程、二次成形で前記本体成形品
に前記導電材により導電部を成形する工程を有すること
を特徴とする樹脂成形品の製造方法。4. A step of kneading a conductive filler and a base resin, wherein when the base resin is a thermoplastic resin, it is pelletized to form a conductive material, and when the base resin is a thermosetting resin, A process of making conductive material from kneaded material,
A resin molded article, comprising: a step of forming a main body molded article from the thermoplastic resin or the thermosetting resin by primary molding; and a step of molding a conductive portion from the conductive material to the main body molded article by secondary molding. Manufacturing method.
工程、前記ベース樹脂が熱可塑性樹脂の場合にはペレタ
イズ化して導電材を作り、また前記ベース樹脂が熱硬化
性樹脂の場合には混練したものから導電材を作る工程、
一次成形で前記導電材により導電部を作り、二次成形で
前記導電部を備えて熱可塑性樹脂または熱硬化性樹脂に
より本体成形品を作る工程を有することを特徴とする樹
脂成形品の製造方法。5. A step of kneading a conductive filler and a base resin, wherein when the base resin is a thermoplastic resin, it is pelletized to form a conductive material, and when the base resin is a thermosetting resin, A process of making conductive material from kneaded material,
A method for producing a resin molded product, comprising a step of forming a conductive part from the conductive material in primary molding and a step of forming a main body molded article from a thermoplastic resin or a thermosetting resin with the conductive part in secondary molding. .
とする請求項４または請求項５に記載の樹脂組成物の製
造方法。6. The method for producing a resin composition according to claim 4, wherein a dispersion aid is used during kneading.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04114597A JP3557831B2 (en) | 1997-02-25 | 1997-02-25 | Resin composition, resin molded article using the same, and method for producing the same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04114597A JP3557831B2 (en) | 1997-02-25 | 1997-02-25 | Resin composition, resin molded article using the same, and method for producing the same |
| DE19835613A DE19835613C2 (en) | 1997-01-13 | 1998-08-06 | Electrically conductive resin composition and its use for the production of molded resin parts |
| US09/131,337 US6096245A (en) | 1997-01-13 | 1998-08-07 | Resin compositions, resin moldings and their methods of production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10237315A true JPH10237315A (en) | 1998-09-08 |
| JP3557831B2 JP3557831B2 (en) | 2004-08-25 |
Family
ID=27218575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04114597A Expired - Lifetime JP3557831B2 (en) | 1997-02-25 | 1997-02-25 | Resin composition, resin molded article using the same, and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3557831B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7056414B2 (en) | 1999-10-07 | 2006-06-06 | Aisin Seiki Kabushiki Kaisha | Connecting method for metal material and electric conductive plastic material and product thereby |
| JP2012237672A (en) * | 2011-05-12 | 2012-12-06 | T & D:Kk | Measuring apparatus |
-
1997
- 1997-02-25 JP JP04114597A patent/JP3557831B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7056414B2 (en) | 1999-10-07 | 2006-06-06 | Aisin Seiki Kabushiki Kaisha | Connecting method for metal material and electric conductive plastic material and product thereby |
| JP2012237672A (en) * | 2011-05-12 | 2012-12-06 | T & D:Kk | Measuring apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3557831B2 (en) | 2004-08-25 |
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