JPH02113068A - Electrically conductive thermoplastic resin composition - Google Patents
Electrically conductive thermoplastic resin compositionInfo
- Publication number
- JPH02113068A JPH02113068A JP26410788A JP26410788A JPH02113068A JP H02113068 A JPH02113068 A JP H02113068A JP 26410788 A JP26410788 A JP 26410788A JP 26410788 A JP26410788 A JP 26410788A JP H02113068 A JPH02113068 A JP H02113068A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- conductive material
- electrically conductive
- conductive
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 70
- 239000011342 resin composition Substances 0.000 title claims description 12
- 239000004020 conductor Substances 0.000 claims abstract description 23
- 239000000835 fiber Substances 0.000 claims abstract description 13
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 3
- 239000004917 carbon fiber Substances 0.000 claims abstract description 3
- 239000000919 ceramic Substances 0.000 claims abstract description 3
- 239000000843 powder Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 4
- 238000004898 kneading Methods 0.000 abstract description 3
- 230000001747 exhibiting effect Effects 0.000 abstract description 2
- 229920001169 thermoplastic Polymers 0.000 abstract 2
- 239000004416 thermosoftening plastic Substances 0.000 abstract 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000008188 pellet Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- -1 polypropylene Polymers 0.000 description 7
- 229920006122 polyamide resin Polymers 0.000 description 6
- 229920002292 Nylon 6 Polymers 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 229920005672 polyolefin resin Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- 229920001893 acrylonitrile styrene Polymers 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 101150000971 SUS3 gene Proteins 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、電子・電気機器の筐体等に有効な電磁波シー
ルド性を有する導電性熱可塑性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a conductive thermoplastic resin composition having electromagnetic shielding properties that are effective for use in housings of electronic and electrical equipment, and the like.
［従来の技術とその課ＷＪ］
近年、電子機器、ＯＡ機器等のプラスチック化に伴ない
それらの機器から放出される電磁波が周辺機器の誤動作
等を引き起こし大きな問題となっている。この電磁波障
害を防止する方法として、成形品の表面に塗装、メツキ
、溶射などにより導電性のコーティング層を形成する方
法がある。また、成形品中に導電性材料を配合、分散複
合化させる方法がある。[Prior art and its section WJ] In recent years, as electronic equipment, OA equipment, etc. have become plastic, electromagnetic waves emitted from these equipment have caused malfunctions of peripheral equipment, which has become a major problem. As a method for preventing this electromagnetic interference, there is a method of forming a conductive coating layer on the surface of the molded product by painting, plating, thermal spraying, or the like. There is also a method of blending and dispersing a conductive material into a molded product.
しかし、前者の方法によるものでは、成形品表面の導電
性のコーティング層が剥離・脱落等を起こす危険性があ
り、シールド性も含めた信頼性が十分だとはいえない。However, in the former method, there is a risk that the conductive coating layer on the surface of the molded product may peel off or fall off, and reliability including shielding performance cannot be said to be sufficient.
一方、後者の方法によるものでは、熱可塑性樹脂中に導
電性材料を複合化させる方法として、数多くの導電性材
料とそれらを複合化させる方法が検討されている。例え
ば、特開昭５８−１７６２２０号では金属繊維を熱可塑
性樹脂中に容易に配合混練するため、金属繊維をあらか
じめ熱可塑性樹脂溶液またはエマルジョンで収束するこ
とが示されている。On the other hand, in the latter method, methods of combining a large number of conductive materials with a thermoplastic resin have been studied. For example, JP-A-58-176220 discloses that in order to easily mix and knead metal fibers into a thermoplastic resin, the metal fibers are preliminarily concentrated in a thermoplastic resin solution or emulsion.
熱可塑性樹脂中に導電性材料を複合する際に、導電性材
料を多量に配合すれば、導電性は向上するものの成形加
工性等は悪化する。一方、導電性材料を少量配合させる
ものでは成形時の繊維の配向等により均一に混合して十
分な導電性を持たせることは容品ではない。また、導電
性材料を少量配合にするために無機充填物を配合する場
合も、成形加工性等が悪化するため、無機充填物を大量
に配合することはできない。When compounding a conductive material into a thermoplastic resin, if a large amount of the conductive material is blended, although the conductivity improves, moldability and the like deteriorate. On the other hand, if a conductive material is mixed in a small amount, it is difficult to ensure sufficient conductivity by uniformly mixing the material by adjusting the orientation of the fibers during molding. Further, even when an inorganic filler is blended in order to blend a small amount of conductive material, it is not possible to blend a large amount of the inorganic filler because moldability and the like deteriorate.
本発明は、かかる点に鑑みてなされたものであり、導電
性材料の配合混線が容易で、しかも少量配合するだけで
十分な導電性を発揮する導電性熱可塑性樹脂組成物を提
供するものである。The present invention has been made in view of these points, and it is an object of the present invention to provide a conductive thermoplastic resin composition that allows easy mixing and mixing of conductive materials and exhibits sufficient conductivity even when only a small amount is blended. be.
［課題を解決するための手段］
本発明は、導電性材料を０．１〜４０容量％含有する第
１熱可塑性樹脂と、導電性材料を含有しない第２熱可塑
性樹脂とからなることを特徴とする導電性熱可塑性樹脂
組成物である。[Means for Solving the Problems] The present invention is characterized in that it consists of a first thermoplastic resin containing 0.1 to 40% by volume of a conductive material and a second thermoplastic resin containing no conductive material. This is a conductive thermoplastic resin composition.
すなわち、本発明は、熱可塑性樹脂の非相溶性に芒目し
、第１図に示す如く海−島構造の海部分（１）にのみ導
電性材料（２）を配合し、海部分（１）での材料どうし
の接触により導電性のメカニズムが疎外されず導電性を
発揮させることにより上記の目的を達成するものである
。That is, the present invention takes into account the incompatibility of thermoplastic resins, and as shown in FIG. ) The above object is achieved by exhibiting conductivity without disturbing the conductive mechanism due to the contact between the materials.
ここで、第１熱可塑性樹脂を構成する熱可塑性樹脂とし
ては、特に制限はなく使用目的等に応じて適宜選定すれ
ばよい。具体的には、例えばポリプロピレン、ポリエチ
レン、エチレン−プロピレン共重合体などのポリオレフ
ィン系樹脂；ポリスチレン、アクリロニトリル−スチレ
ン（ＡＳ）、アクリロニトリル−ブタジェン−スチレン
（ＡＢＳ）などのスチレン系樹脂：ナイロン６、ナイロ
ン６６、ナイロン１２などのポリアミド系樹脂、ポリエ
チレンテレフタレート、ボリブチレンチレフタレートな
どのポリエステル系樹脂、ポリアセタール樹脂；ポリフ
ェニレンオキサイド樹脂；ポリカーボネート樹脂等を挙
げることができる。Here, the thermoplastic resin constituting the first thermoplastic resin is not particularly limited and may be appropriately selected depending on the purpose of use. Specifically, for example, polyolefin resins such as polypropylene, polyethylene, and ethylene-propylene copolymers; styrene resins such as polystyrene, acrylonitrile-styrene (AS), and acrylonitrile-butadiene-styrene (ABS); nylon 6, nylon 66; , polyamide resins such as nylon 12, polyester resins such as polyethylene terephthalate and polybutylene ethylene phthalate, polyacetal resins, polyphenylene oxide resins, and polycarbonate resins.
また、導電性材料としては、一般的に使用される全ての
導電性材料が使用できる。しかし、好ましくは繊維長１
０μ〜５關、アスペクト比１０〜１０００の銅、黄銅、
ニッケル、アルミニウム、ステレンス繊維等の金属繊維
、セラミックス繊維、炭素繊維もしくはその粉末がよい
。Further, as the conductive material, all commonly used conductive materials can be used. However, preferably the fiber length is 1
Copper, brass with an aspect ratio of 0 μ to 5, and an aspect ratio of 10 to 1000.
Metal fibers such as nickel, aluminum, and stainless steel fibers, ceramic fibers, carbon fibers, or powder thereof are preferable.
これらの導電性材料の配合量は第１熱可塑性樹脂に対し
て０．１〜４０容量％、好ましくは０．５〜３０容量％
である。０．１容量％未満では、導電性が不充分であり
、一方４０容量％を超えると成形性が悪くなる。The content of these conductive materials is 0.1 to 40% by volume, preferably 0.5 to 30% by volume based on the first thermoplastic resin.
It is. If it is less than 0.1% by volume, the conductivity will be insufficient, while if it exceeds 40% by volume, the moldability will be poor.
第２熱可塑性樹脂としては、第１熱可塑性樹脂と所謂海
−島構造を形成させるため、第１熱可塑性樹脂と溶解度
パラメータの差が１〜８のものを用いる。溶解度パラメ
ータが、１未満では、海−島構造を形成できず好ましく
ない。As the second thermoplastic resin, one having a solubility parameter difference of 1 to 8 from the first thermoplastic resin is used in order to form a so-called sea-island structure with the first thermoplastic resin. If the solubility parameter is less than 1, a sea-island structure cannot be formed, which is not preferable.
この第２熱可塑性樹脂としては、第１熱可塑性樹脂と上
述の条件を満たしていれば他に制限はない。従って°、
使用目的等に応じて適・宜選定すればよい。具体的には
、例えば第１熱可塑性樹脂を構成する熱可塑性樹脂と第
２熱可塑性樹脂の組合せとして
ポリアミド系樹脂−ポリオレフィン系樹脂ポリアミド系
樹脂−スチレン系樹脂
ポリアミド系樹脂−ポリエステル系樹脂ポリアミド系樹
脂−ポリカーボネート樹脂ポリアミド系樹脂−ポリアセ
タール樹脂ポリエステル系樹脂−ポリオレフィン系樹脂
ポリエステル系樹脂−スチレン系樹脂
等を挙げることができる。There are no other restrictions on the second thermoplastic resin as long as it satisfies the conditions described above with respect to the first thermoplastic resin. Therefore °,
It may be selected as appropriate depending on the purpose of use, etc. Specifically, for example, as a combination of the thermoplastic resin constituting the first thermoplastic resin and the second thermoplastic resin, polyamide resin - polyolefin resin polyamide resin - styrene resin polyamide resin - polyester resin polyamide resin Examples include - polycarbonate resin, polyamide resin, polyacetal resin, polyester resin, polyolefin resin, polyester resin, and styrene resin.
ここで、両者の配合割合については、使用樹脂等に応じ
て異なる。すなわち、第１熱可塑性樹脂が海部分、第２
熱可塑性樹脂を島部分にするためには
を満たせばよい。Here, the blending ratio of both varies depending on the resin used and the like. That is, the first thermoplastic resin is the sea part, the second thermoplastic resin is the sea part, and the second thermoplastic resin is the sea part.
In order to make the thermoplastic resin into an island part, it is sufficient to satisfy the following conditions.
なお、η９．η８は、第１熱可塑性樹脂、第２熱可塑性
樹脂の成形時の見かけの溶融粘度、ｖＡｔＶ３は、それ
ぞれ第１熱可塑性樹脂、第２熱可塑性樹脂の体積分率で
ある。Note that η9. η8 is the apparent melt viscosity of the first thermoplastic resin and the second thermoplastic resin during molding, and vAtV3 is the volume fraction of the first thermoplastic resin and the second thermoplastic resin, respectively.
両者の配合割合は一義的に決定することは困難であるが
、通常、第１熱可塑性樹脂２０〜９０容量％に対し第２
熱可塑性樹脂８０〜１０容量％の割合である。ここで、
第２熱可塑性樹脂の配合割合が１０容量％未満であると
、導電性材料の節減効果がなく、一方８０容量％を超え
て配合すると、海−島構造を形成せず導電性が不十分と
なる。Although it is difficult to uniquely determine the blending ratio of the two, usually the second thermoplastic resin is 20 to 90% by volume of the first thermoplastic resin.
The proportion of thermoplastic resin is 80 to 10% by volume. here,
If the proportion of the second thermoplastic resin is less than 10% by volume, there will be no saving effect on the conductive material, while if it exceeds 80% by volume, a sea-island structure will not be formed and the conductivity will be insufficient. Become.
また、第１熱可塑性樹脂と、第２熱可塑性樹脂の混合は
種々の方法によって行うことができる。Further, the first thermoplastic resin and the second thermoplastic resin can be mixed by various methods.
例えばスクリュー式押出機又はこれと類似の装置等を用
いて溶融混練する方法が適当である。この際、本発明の
効果に阻害しない限り通常の添加剤、例えば酸化防止剤
、熱安定剤、紫外線吸収剤、可塑剤、難燃剤、帯電防止
剤等や無機充填材を配合することができる。For example, a method of melt-kneading using a screw extruder or similar equipment is suitable. At this time, conventional additives such as antioxidants, heat stabilizers, ultraviolet absorbers, plasticizers, flame retardants, antistatic agents, etc., and inorganic fillers can be added as long as they do not interfere with the effects of the present invention.
このようにして得られる導電性熱可塑性樹脂組成物は射
出成形法、押出成形法、プレス成形法等により成形品と
することができる。The conductive thermoplastic resin composition thus obtained can be made into a molded article by injection molding, extrusion molding, press molding, or the like.
［作用コ
本発明に係る導電性熱可塑性樹脂組成物によれば、良好
な成形性を示し、また導電性材料の配合が少量でも均一
に優れた導電性を示す電子機器の筐体等の電磁波シール
ド材料として極めて有用である。[Function] The conductive thermoplastic resin composition according to the present invention exhibits good moldability and exhibits uniformly excellent conductivity even when the conductive material is contained in a small amount. Extremely useful as a shielding material.
［実施例］
以下、本発明の実施例及びこれと比較するために行った
比較例について説明する。[Example] Hereinafter, an example of the present invention and a comparative example conducted for comparison thereto will be described.
実施例１〜４、比較例５
ナイロン６樹脂９８容量％、ステンレス繊維（ＳＵＳ３
０４．直径８μ、長さ５關）２容量９６の組成で配合し
、押出機で溶融混練し第１熱可塑性樹脂ベレツトを製造
した。Examples 1 to 4, Comparative Example 5 Nylon 6 resin 98% by volume, stainless steel fiber (SUS3
04. A first thermoplastic resin beret was produced by blending the mixture into a composition having a diameter of 8 μm and a length of 5 μm and a volume of 96 cm, and melt-kneading the mixture using an extruder.
次に、溶解度パラメータの差が約５のポリプロピレン樹
脂を第２熱可塑性樹脂ペレツトとし、第１熱可塑性樹脂
ベレツトと第２熱可塑性樹脂ペレツトを下記第１表に示
す割合で配合し、よく混合した。次に、これらで射出成
形を行い厚さ３ＩＩ１ｍの成形品を作製した。この成形
品についてシールド効果を測定し、その結果を第１表に
併記した。Next, a polypropylene resin having a solubility parameter difference of about 5 was used as a second thermoplastic resin pellet, and the first thermoplastic resin pellet and the second thermoplastic resin pellet were blended in the proportions shown in Table 1 below, and mixed well. . Next, these were injection molded to produce a molded product with a thickness of 3II1 m. The shielding effect of this molded article was measured, and the results are also listed in Table 1.
第 １ 表
注１．第１熱可塑性樹脂；ナイロン６樹脂９８容量％、
ステンレス繊維２容量％ペレット注２．第２熱可塑性樹
脂；ポリプロピレン樹脂ペレット
注３．シールド効果；アトパンテスト社製、商品名ＴＲ
−１７３０１で俵１定した２ ００ Ｍｌｌｚでの電界
成分シールド効果
第１表より明らかなように実施例１〜４はほぼ同じ値の
良好なシールド効果を示しているのに対し、比較例１は
シールド効果の値が低くなっている。実施例１〜４は海
−島構造を形成したのにに、Ｊし、比較例１は海−島構
造を形成しなかった。Table 1 Note 1. First thermoplastic resin; nylon 6 resin 98% by volume,
Stainless steel fiber 2% by volume pellet Note 2. Second thermoplastic resin; polypropylene resin pellets Note 3. Shielding effect: Manufactured by Atopan Test Co., Ltd., product name: TR
Electric field component shielding effect at 200 Mllz with a bale of -17301.As is clear from Table 1, Examples 1 to 4 show good shielding effects with almost the same values, whereas Comparative Example 1 shows good shielding effects. Shield effect value is low. Although Examples 1 to 4 formed a sea-island structure, Comparative Example 1 did not form a sea-island structure.
比較例６〜８
実施例１〜４および比較例５に示されるのと同じ配合割
合、及び方法で第１熱可塑性樹脂ベレツトを製造した。Comparative Examples 6-8 First thermoplastic resin belets were manufactured using the same blending ratio and method as shown in Examples 1-4 and Comparative Example 5.
次に、溶解度パラメータの差が１未満のナイロン６・６
樹脂を第２熱可塑性樹脂ペレツトとし、第１熱可塑性樹
脂ベレツトと第２熱可塑性樹脂ペレツトを下記第２表に
示す割合で配合し、実施例１〜４および比較例５と同様
の方法及び条件で成形及びＡｐｌ定を行った。この結果
を第２表に併記した。Next, nylon 6/6 with a difference in solubility parameters of less than 1
The resin was used as second thermoplastic resin pellets, the first thermoplastic resin pellets and the second thermoplastic resin pellets were blended in the proportions shown in Table 2 below, and the method and conditions were the same as in Examples 1 to 4 and Comparative Example 5. Molding and APL determination were performed. The results are also listed in Table 2.
第 表 性を発揮するものである。No. table It is something that shows one's sexuality.
第１図は、本発明に係る導電性熱可塑性樹脂組成物の構
造を示す説明図である。
１・・・海部分、２・・・導電性材料、３・・・島部分
。
注１、第１熱可塑性樹脂；ナイロン６樹脂９８容量％、
ステンレス繊維２容量％ペレット庄２．第２熱可塑性樹
脂；ナイロン６・６樹脂ベレツト
第２表より明らかなように海−島構造を形成しない比較
例６〜８は、第２熱可塑性樹脂の容量％が増すに従って
そのシールド効果の値は減少している。
［発明の効果］FIG. 1 is an explanatory diagram showing the structure of a conductive thermoplastic resin composition according to the present invention. 1... Sea part, 2... Conductive material, 3... Island part. Note 1, first thermoplastic resin; nylon 6 resin 98% by volume,
Stainless steel fiber 2% by volume pellets 2. Second thermoplastic resin: Nylon 6.6 resin beret As is clear from Table 2, in Comparative Examples 6 to 8, which do not form a sea-island structure, as the volume % of the second thermoplastic resin increases, the value of the shielding effect increases. is decreasing. [Effect of the invention]
Claims (5)
可塑性樹脂と、導電性材料を含有しない第２熱可塑性樹
脂とからなることを特徴とする導電性熱可塑性樹脂組成
物。(1) A conductive thermoplastic resin composition comprising a first thermoplastic resin containing 0.1 to 40% by volume of a conductive material and a second thermoplastic resin containing no conductive material.
造を形成し、かつ、第１熱可塑性樹脂が海部分を形成し
ているものである請求項第１項記載の導電性熱可塑性樹
脂組成物。(2) The conductivity according to claim 1, wherein the first thermoplastic resin and the second thermoplastic resin form a sea-island structure, and the first thermoplastic resin forms the sea part. Thermoplastic resin composition.
ラメータの差が、１〜８である請求項第１項記載の導電
性熱可塑性樹脂組成物。(3) The conductive thermoplastic resin composition according to claim 1, wherein the difference in solubility parameters between the first thermoplastic resin and the second thermoplastic resin is 1 to 8.
合率が、１０〜８０容量％である請求項第１項記載の導
電性熱可塑性樹脂組成物。(4) The conductive thermoplastic resin composition according to claim 1, wherein the mixing ratio of the second thermoplastic resin to the first thermoplastic resin is 10 to 80% by volume.
素繊維或いはこれらの粉末のいずれかで構成されている
ものである請求項第１項記載の導電性熱可塑性樹脂組成
物。(5) The conductive thermoplastic resin composition according to claim 1, wherein the conductive material is composed of metal fibers, ceramic fibers, carbon fibers, or powders thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26410788A JPH02113068A (en) | 1988-10-21 | 1988-10-21 | Electrically conductive thermoplastic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26410788A JPH02113068A (en) | 1988-10-21 | 1988-10-21 | Electrically conductive thermoplastic resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113068A true JPH02113068A (en) | 1990-04-25 |
Family
ID=17398603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26410788A Pending JPH02113068A (en) | 1988-10-21 | 1988-10-21 | Electrically conductive thermoplastic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113068A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002292804A (en) * | 2001-03-30 | 2002-10-09 | Daicel Chem Ind Ltd | Conductive sheet |
| US7674402B2 (en) * | 2003-12-05 | 2010-03-09 | Showa Denko K.K. | Electroconductive resin composition and molded product thereof |
| JP2010138398A (en) * | 2010-01-05 | 2010-06-24 | Mitsubishi Engineering Plastics Corp | Electromagnetic wave-inhibiting resin composition and molded article |
| JP2010209306A (en) * | 2009-02-16 | 2010-09-24 | Mitsubishi Chemicals Corp | Conductive polyamide resin composition, method for producing conductive polyamide resin composition, injection molded article and extrusion molded article |
| US20110013939A1 (en) * | 2009-07-16 | 2011-01-20 | Fuji Xerox Co., Ltd. | Conductive member, charging device, process cartridge, and image forming device |
| JP2011162754A (en) * | 2010-02-15 | 2011-08-25 | Inoac Gijutsu Kenkyusho:Kk | Composite material and process for producing the same |
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|---|---|---|---|---|
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| JPS6072935A (en) * | 1983-09-30 | 1985-04-25 | Sekisui Chem Co Ltd | Electroconductive plastic composition |
| JPS6189258A (en) * | 1984-10-08 | 1986-05-07 | Mitsubishi Petrochem Co Ltd | Production of electrically conductive resin composition |
| JPS624749A (en) * | 1985-07-02 | 1987-01-10 | Asahi Chem Ind Co Ltd | Blend type electrically conductive composite material |
| JPS63207855A (en) * | 1987-02-24 | 1988-08-29 | Inoue Mtp Co Ltd | Conductive polymer alloy and production thereof |
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| JPS5247843A (en) * | 1975-10-15 | 1977-04-16 | Asahi Chem Ind Co Ltd | Conductive resin compositions |
| JPS6072935A (en) * | 1983-09-30 | 1985-04-25 | Sekisui Chem Co Ltd | Electroconductive plastic composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002292804A (en) * | 2001-03-30 | 2002-10-09 | Daicel Chem Ind Ltd | Conductive sheet |
| US7674402B2 (en) * | 2003-12-05 | 2010-03-09 | Showa Denko K.K. | Electroconductive resin composition and molded product thereof |
| JP2010209306A (en) * | 2009-02-16 | 2010-09-24 | Mitsubishi Chemicals Corp | Conductive polyamide resin composition, method for producing conductive polyamide resin composition, injection molded article and extrusion molded article |
| US20110013939A1 (en) * | 2009-07-16 | 2011-01-20 | Fuji Xerox Co., Ltd. | Conductive member, charging device, process cartridge, and image forming device |
| US8275293B2 (en) * | 2009-07-16 | 2012-09-25 | Fuji Xerox Co., Ltd. | Conductive member, charging device, process cartridge, and image forming device |
| JP2010138398A (en) * | 2010-01-05 | 2010-06-24 | Mitsubishi Engineering Plastics Corp | Electromagnetic wave-inhibiting resin composition and molded article |
| JP2011162754A (en) * | 2010-02-15 | 2011-08-25 | Inoac Gijutsu Kenkyusho:Kk | Composite material and process for producing the same |
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