JPH11255904A - Conductive plastic and its production - Google Patents
Conductive plastic and its productionInfo
- Publication number
- JPH11255904A JPH11255904A JP8271198A JP8271198A JPH11255904A JP H11255904 A JPH11255904 A JP H11255904A JP 8271198 A JP8271198 A JP 8271198A JP 8271198 A JP8271198 A JP 8271198A JP H11255904 A JPH11255904 A JP H11255904A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- component
- lead
- free solder
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板及び立体部品
となるフレ−ムに導電回路を形成する等の際に使用され
る導電性プラスチック及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive plastic used for forming a conductive circuit on a substrate and a frame serving as a three-dimensional component, and a method for producing the same.
【０００２】[0002]
【従来の技術】従来から導電性プラスチックとして樹脂
中に金属繊維や金属繊維に低融点金属を混ぜて金属繊維
の接触抵抗を下げて信頼性を向上させた導電性プラスチ
ックは、電磁波シ−ルド等の用途ととして利用されてい
る。しかしこれまでの導電性プラスチックは、体積固有
抵抗が１０↑-↑3Ω・ｃｍ以上と抵抗が大きいため通電
を行った場合に発熱して導電性プラスチックが溶けた
り、抵抗が大きくなるため通電用途には利用できなかっ
た。また温度変化によりプラスチックと金属成分の熱膨
張差があるため高温になると樹脂の膨張に伴い金属の接
触箇所が減少しその結果として導電性が劣化するといっ
た問題も生じる。その他に樹脂中に低融点金属である共
晶ハンダを少量加えたものが知られているが、共晶ハン
ダは鉛を含んでいるためその廃棄物は環境に対して悪影
響を及ぼすという問題があった。また導電性プラスチッ
クの導電性を高めるためには、より多くの金属成分を樹
脂中に混ぜなければならないが金属繊維を多く混入する
と成形性が悪くなり射出ノズルを詰まらせたり、細い形
状に射出成形できなくなる問題がある。2. Description of the Related Art Conventionally, as a conductive plastic, a metal fiber or a low melting point metal mixed with a metal fiber in a resin to reduce the contact resistance of the metal fiber to improve reliability has been known as an electromagnetic shield. It is used as an application. However, conventional conductive plastics have a large volume resistivity of 10 ↑-↑ 3 Ω · cm or more, so they generate heat when energized, causing the conductive plastic to melt or increase the resistance. Was not available. In addition, since there is a difference in thermal expansion between the plastic and the metal component due to a change in temperature, when the temperature becomes high, there is also a problem that the contact points of the metal are reduced due to the expansion of the resin, and as a result, the conductivity is deteriorated. In addition, it is known to add a small amount of eutectic solder, which is a low-melting-point metal, to a resin.However, since eutectic solder contains lead, there is a problem that its waste has a bad effect on the environment. Was. In order to increase the conductivity of conductive plastics, more metal components must be mixed into the resin.However, if too much metal fiber is mixed, the moldability deteriorates and the injection nozzle becomes clogged or injection molding into a narrow shape is performed. There is a problem that can not be done.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記の問題に
鑑みて成されたもので、導電性が極めて高く様々な環境
下においても導電性の低下を起こすことがなく、成形に
支障をきたすような大きな金属粒がない信頼性の高い導
電性プラスチック及びその製造方法を提供することを目
的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has extremely high conductivity, does not cause a decrease in conductivity even in various environments, and hinders molding. It is an object of the present invention to provide a highly reliable conductive plastic having no such large metal particles and a method for manufacturing the same.
【０００４】[0004]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明における導電性プラスチックは、熱可塑性
樹脂と、その融点を前記熱可塑性樹脂の熱可塑化する温
度域内に合金成分調整をした鉛フリ−ハンダと、該鉛フ
リ−ハンダを前記熱可塑性樹脂中に細かく分散させるこ
とを補助する分散メディアと、を含む導電性樹脂組成物
から成ることを特徴とし、本発明における導電性プラス
チックの製造方法は、熱可塑性樹脂と、鉛フリ−ハンダ
の分散を補助する分散メディアとを混練して熱可塑性樹
脂中に分散メディアを分散させた混練体を得る工程と、
該混練体に前記熱可塑性樹脂の可塑化温度域で溶融する
鉛フリ−ハンダを投入して再び混練して導電性樹脂組成
物を得る工程と、該導電性樹脂組成物を線状に押出成形
すると共に粒状（ペレット）に切断する工程と、を具備
することを特徴とするものである。Means for Solving the Problems In order to achieve the above-mentioned object, the conductive plastic in the present invention comprises a thermoplastic resin and an alloy component adjusted to have a melting point within a temperature range in which the thermoplastic resin is thermoplasticized. The conductive plastic according to the present invention, comprising: a conductive resin composition comprising: a lead-free solder as described above; and a dispersion medium for assisting fine dispersion of the lead-free solder in the thermoplastic resin. The production method of, thermoplastic resin, a step of kneading a dispersion medium that assists dispersion of lead-free solder to obtain a kneaded body in which the dispersion medium is dispersed in the thermoplastic resin,
Adding a lead-free solder which melts in the plasticizing temperature range of the thermoplastic resin to the kneaded body and kneading it again to obtain a conductive resin composition; and extruding the conductive resin composition into a linear shape. And cutting into granules (pellets).
【０００５】上記のようにして得られる導電性プラスチ
ックの用途の１つとして射出成形の２色成形技術による
立体回路部品の配線への適用がある。この場合フレ−ム
と導電性プラスチックとの密着性も重要視されるが熱膨
張の違い、二次転移点の違い、繰り返しの熱衝撃等によ
って接合界面に隙間、ずれ等を起こさない様にするに
は、フレ−ムと導電性プラスチックの原料に使用する樹
脂を同一にしてサ−マルマッチング性（密着性）を高め
る必要がある。例えばフレ−ムにポリプロピレン（Ｐ
Ｐ）を使用したい場合導電性プラスチックに使用する樹
脂もポリプロピレン（ＰＰ）にする。それには鉛フリ−
ハンダの融点をＰＰが熱可塑化する温度域で合金成分調
整したハンダを用いなければ良質の導電性プラスチック
を製造することができない。（例えばハンダの融点が樹
脂の融点より低い場合、混練中にハンダが先に溶けハン
ダは樹脂中に細かく分散されず大きな金属粒になってし
まう。またハンダの融点が樹脂の融点よりかけ離れて高
いと混練中に樹脂が熱分解してしまう。）[0005] One of the uses of the conductive plastic obtained as described above is to apply to wiring of three-dimensional circuit parts by a two-color molding technique of injection molding. In this case, adhesion between the frame and the conductive plastic is also regarded as important, but it is necessary to prevent a gap or a shift from occurring at the joint interface due to a difference in thermal expansion, a difference in a secondary transition point, a repeated thermal shock, or the like. For this purpose, it is necessary to increase the thermal matching property (adhesion) by using the same resin as the material of the frame and the conductive plastic. For example, in a frame, polypropylene (P
When it is desired to use P), the resin used for the conductive plastic is also polypropylene (PP). It is lead free
Good quality conductive plastics cannot be produced unless solder whose alloy component is adjusted in a temperature range where the melting point of the solder is thermoplasticized by PP is used. (For example, if the melting point of the solder is lower than the melting point of the resin, the solder melts first during kneading, and the solder is not finely dispersed in the resin and becomes large metal particles. In addition, the melting point of the solder is much higher than the melting point of the resin. The resin is thermally decomposed during kneading.)
【０００６】[0006]
【発明の実施の形態】（実施例１）熱可塑性樹脂である
ＡＢＳ樹脂（東レ製）４０体積％に、分散メディアとし
ての銅粉末（福田金属箔粉工業：ＦＣＣ−１１５）１５
体積％を軽く混合させた後に加圧式混練機（モリヤマ
製）に投入し、５分間回転数２０〜５０ｒｐｍで混練し
て樹脂が熱可塑化する状態で銅粉末を樹脂中に分散させ
混練体を得た。次にこの混練体に鉛フリ−ハンダ（福田
金属箔工業：Ｓｎ−Ｃｕ−Ｎｉ−ＡＴ−１５０）４５体
積％を投入し、１０分間回転数２０〜５０ｒｐｍで混練
することにより、樹脂が熱可塑化し鉛フリ−ハンダが半
溶融状態となって樹脂中に分散された。(Example 1) Copper powder (Fukuda Metal Foil & Powder Industry: FCC-115) 15 as a dispersion medium in 40% by volume of ABS resin (made by Toray) as a thermoplastic resin
After lightly mixing the volume%, the mixture is put into a pressure kneader (manufactured by Moriyama Co., Ltd.), and kneaded at a rotation speed of 20 to 50 rpm for 5 minutes to disperse copper powder in the resin in a state where the resin is thermoplasticized. Obtained. Next, 45 volume% of lead-free solder (Fukuda Metal Foil Industry: Sn-Cu-Ni-AT-150) is charged into the kneaded body, and kneaded at a rotation speed of 20 to 50 rpm for 10 minutes, so that the resin becomes thermoplastic. The lead-free solder became semi-molten and was dispersed in the resin.
【０００７】この結果熱可塑性樹脂と、その融点を熱可
塑性樹脂の可塑化する温度域内に合金成分調整をした鉛
フリ−ハンダと、該鉛フリ−ハンダを前記熱可塑性樹脂
中に細かく分散させることを補助する分散メディアと、
を含む導電性樹脂組成物が得られた。得られた導電性樹
脂組成物は押出成形により線状に押出成形し、切断して
射出成形に適した粒状（ペレット）とした。このペレッ
トの断面を光学顕微鏡で観察したところ樹脂中に鉛フリ
−ハンダが５μｍの大きさで均一に分散し、半溶融され
たハンダが全体に亘って鉛フリ−ハンダを連続結合させ
た状態になっていた。また、このペレットを使用して射
出成形品を作成し、体積固有抵抗を測定したところ１０
↑-↑5Ω・ｃｍオ−ダ−を示すものであった。As a result, a thermoplastic resin, a lead-free solder whose melting point is adjusted to an alloy component within a temperature range in which the thermoplastic resin is plasticized, and fine dispersion of the lead-free solder in the thermoplastic resin. Distributed media to assist
The conductive resin composition containing was obtained. The obtained conductive resin composition was extruded into a linear shape by extrusion molding, and cut into granules (pellets) suitable for injection molding. Observation of the cross section of the pellet with an optical microscope showed that lead-free solder was uniformly dispersed in the resin to a size of 5 μm, and the semi-molten solder was continuously bonded with lead-free solder throughout. Had become. In addition, an injection molded product was prepared using the pellets, and the volume resistivity was measured.
The order of ↑-↑ 5Ω · cm was shown.
【０００８】（実施例２）熱可塑性樹脂であるＰＢＴ樹
脂（東レ製）４０体積％に、分散メディアとしての銅粉
末（福田金属箔粉工業：ＦＣＣ−１１５）１５体積％を
軽く混合させた後に加圧式混練機（モリヤマ製）に投入
し、５分間回転数２０〜５０ｒｐｍで混練して樹脂が熱
可塑化する状態で銅粉末を樹脂中に分散させ混練体を得
た。次にこの混練体に鉛フリ−ハンダ（福田金属箔工
業：Ｓｎ−Ｃｕ−Ｎｉ−ＡＴ−１５０）４５体積％を投
入し、１０分間回転数２０〜５０ｒｐｍで混練すること
により、樹脂が熱可塑化し鉛フリ−ハンダが半溶融状態
となって樹脂中に分散された。(Example 2) After 40% by volume of a PBT resin (manufactured by Toray) as a thermoplastic resin, 15% by volume of copper powder (Fukuda Metal Foil & Powder Industry: FCC-115) as a dispersing medium is lightly mixed. The mixture was put into a pressure kneading machine (manufactured by Moriyama Co., Ltd.), and kneaded at a rotation speed of 20 to 50 rpm for 5 minutes to disperse the copper powder in the resin in a state where the resin was thermoplasticized to obtain a kneaded body. Next, 45 volume% of lead-free solder (Fukuda Metal Foil Industry: Sn-Cu-Ni-AT-150) is charged into the kneaded body, and kneaded at a rotation speed of 20 to 50 rpm for 10 minutes, so that the resin becomes thermoplastic. The lead-free solder became semi-molten and was dispersed in the resin.
【０００９】その結果前記実施例１と同様の導電性樹脂
組成物が得られ、その導電性樹脂組成物を押出成形によ
り線状に押出成形し、切断して射出成形に適した粒状
（ペレット）とした。このペレットは、実施例１の場合
と同様に樹脂中に鉛フリ−ハンダが５μｍの大きさで均
一に分散し、半溶融されたハンダが全体に亘って鉛フリ
−ハンダを連続結合させた状態になっていた。また、こ
のペレットを使用して射出成形品を作成し、体積固有抵
抗を測定した結果も１０↑-↑5Ω・ｃｍオ−ダ−を示す
ものであった。As a result, the same conductive resin composition as in Example 1 was obtained. The conductive resin composition was extruded into a linear shape by extrusion, cut and cut into granules (pellets) suitable for injection molding. And In this pellet, as in the case of Example 1, the lead-free solder was uniformly dispersed in the resin to a size of 5 μm, and the semi-molten solder continuously joined the lead-free solder throughout. Had become. An injection-molded article was prepared using the pellets, and the result of measurement of the volume resistivity thereof was also on the order of 10 °-↑ 5Ω · cm.
【００１０】なお上記実施例１、２においては、分散メ
ディアとしてぬれ性の最も優れた銅粉末を用いたが銅の
他にグラファイト、メッキしたグラファイト、鉄、タン
グステン、タングステンカ−ボン、セラミック、導電セ
ラミック（窒化アルミ）、などぬれ性が良い粉末であれ
ば使用可能である。さらに上記実施例１、２において
は、鉛フリ−ハンダとして錫基合金（Ｓｎ−Ｃｕ−Ｎ
ｉ）を使用したが錫単体を使用してもよい。また前記混
練体を得る工程、導電性樹脂組成物を得る工程、及び導
電性樹脂組成物を線状に押出成形すると共に粒状（ペレ
ット）に切断する工程と、が連続して成されるようにし
てもよい。In Examples 1 and 2, copper powder having the best wettability was used as a dispersion medium. In addition to copper, graphite, plated graphite, iron, tungsten, tungsten carbon, ceramic, and conductive Any powder having good wettability, such as ceramic (aluminum nitride), can be used. Further, in Examples 1 and 2, a tin-based alloy (Sn-Cu-N) was used as lead-free solder.
Although i) was used, tin alone may be used. Further, the step of obtaining the kneaded body, the step of obtaining the conductive resin composition, and the step of extruding the conductive resin composition into a linear shape and cutting it into granules (pellets) are performed continuously. You may.
【００１１】[0011]
【発明の効果】本発明は上記の説明から明らかなよう
に、鉛フリ−ハンダが樹脂中に細かく均一に分散される
と共に半溶融されたハンダにより分散された鉛フリ−ハ
ンダが全体に亘って連続結合されて、高い導電性が得ら
れると共に様々な環境下においても導電性の低下を起こ
すことがなく、成形に支障をきたすような大きな金属粒
のない信頼性の高い導電性プラスチックを得ることがで
きるという効果がある。As is apparent from the above description, the present invention has a structure in which lead-free solder is finely and uniformly dispersed in a resin, and lead-free solder dispersed by semi-molten solder is entirely formed. To obtain a highly reliable conductive plastic that is continuously bonded, has high conductivity, does not cause a decrease in conductivity even in various environments, and does not have large metal particles that hinder molding. There is an effect that can be.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０１Ｂ 1/22 Ｈ０１Ｂ 1/22 Ｚ // Ｈ０５Ｋ 3/10 Ｈ０５Ｋ 3/10 Ｅ (72)発明者 中川 威雄 神奈川県川崎市中原区市ノ坪223−４−416 (72)発明者 野口 裕之 千葉県千葉市稲毛区弥生町１−170−２− 306──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification symbol FI H01B1 / 22 H01B1 / 22Z // H05K 3/10 H05K 3/10 E (72) Inventor Takeo Nakagawa Nakahara, Kawasaki City, Kanagawa Prefecture 223-4-416, Nobotsu-ku, Ward (72) Inventor Hiroyuki Noguchi 1-170-2-306, Yayoi-cho, Inage-ku, Chiba-shi, Chiba
Claims (3)
性樹脂の熱可塑化する温度域内に合金成分調整をした鉛
フリ−ハンダと、該鉛フリ−ハンダを前記熱可塑性樹脂
中に細かく分散させることを補助する分散メディアと、
を含む導電性樹脂組成物から成ることを特徴とする導電
性プラスチック。1. A thermoplastic resin, a lead-free solder whose melting point is adjusted to an alloy component within a temperature range in which the thermoplastic resin is plasticized, and the lead-free solder is finely dispersed in the thermoplastic resin. Distributed media to assist in
A conductive plastic comprising a conductive resin composition containing:
を補助する分散メディアとを混練して熱可塑性樹脂中に
分散メディアを分散させた混練体を得る工程と、該混練
体に前記熱可塑性樹脂の可塑化温度域で溶融する鉛フリ
−ハンダを投入して再び混練して導電性樹脂組成物を得
る工程と、該導電性樹脂組成物を線状に押出成形すると
共に粒状（ペレット）に切断する工程と、を具備するこ
とを特徴とする導電性プラスチックの製造方法。2. A step of kneading a thermoplastic resin and a dispersion medium for assisting dispersion of lead-free solder to obtain a kneaded body in which the dispersion medium is dispersed in the thermoplastic resin; A step of introducing lead-free solder that melts in the plasticizing temperature range of the plastic resin and kneading it again to obtain a conductive resin composition, extruding the conductive resin composition into a linear shape, and forming a granule (pellet). And a method for producing a conductive plastic.
物を得る工程、及び該導電性樹脂組成物を線状に押出成
形すると共に粒状（ペレット）に切断する工程と、が連
続して成されることを特徴とする請求項４記載の導電性
プラスチックの製造方法。3. A step of obtaining the kneaded body, a step of obtaining a conductive resin composition, and a step of extruding the conductive resin composition into a linear shape and cutting it into granules (pellets) continuously. The method for producing a conductive plastic according to claim 4, wherein the method is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8271198A JPH11255904A (en) | 1998-03-13 | 1998-03-13 | Conductive plastic and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8271198A JPH11255904A (en) | 1998-03-13 | 1998-03-13 | Conductive plastic and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11255904A true JPH11255904A (en) | 1999-09-21 |
Family
ID=13782002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8271198A Pending JPH11255904A (en) | 1998-03-13 | 1998-03-13 | Conductive plastic and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11255904A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6995205B2 (en) | 2001-09-27 | 2006-02-07 | Nippon Kagaku Yakin Co., Ltd. | Resin composition with high thermal conductivity and method of producing the same |
| KR100784902B1 (en) | 2004-12-30 | 2007-12-11 | 주식회사 동부하이텍 | Manufacturing method of plastic conductive particles |
| KR100792664B1 (en) * | 2007-06-01 | 2008-01-09 | 주식회사 동부하이텍 | Plastic conductive particles |
| JP2008537916A (en) * | 2005-04-13 | 2008-10-02 | クール オプションズ，インコーポレーテッド | In-mold metallized polymer component and method for producing the same |
-
1998
- 1998-03-13 JP JP8271198A patent/JPH11255904A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6995205B2 (en) | 2001-09-27 | 2006-02-07 | Nippon Kagaku Yakin Co., Ltd. | Resin composition with high thermal conductivity and method of producing the same |
| KR100784902B1 (en) | 2004-12-30 | 2007-12-11 | 주식회사 동부하이텍 | Manufacturing method of plastic conductive particles |
| JP2008537916A (en) * | 2005-04-13 | 2008-10-02 | クール オプションズ，インコーポレーテッド | In-mold metallized polymer component and method for producing the same |
| KR100792664B1 (en) * | 2007-06-01 | 2008-01-09 | 주식회사 동부하이텍 | Plastic conductive particles |
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