JPS6351354B2 - - Google Patents
Info
- Publication number
- JPS6351354B2 JPS6351354B2 JP56120071A JP12007181A JPS6351354B2 JP S6351354 B2 JPS6351354 B2 JP S6351354B2 JP 56120071 A JP56120071 A JP 56120071A JP 12007181 A JP12007181 A JP 12007181A JP S6351354 B2 JPS6351354 B2 JP S6351354B2
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- connection
- metal particles
- sintered
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002923 metal particle Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000002861 polymer material Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229920000620 organic polymer Polymers 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000005245 sintering Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000008018 melting Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000005678 Seebeck effect Effects 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Description
【発明の詳細な説明】
本発明は新規かつ改良された接続端子の電気接
続方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a new and improved electrical connection method for connection terminals.
従来、各種電気、電子装置の設置の接続用引出
端子とフラツトワイヤケーブルの接続、電気、電
子部品のリード端子とプリント回路基板の接続用
引出端子の接続あるいはプリント回路基板間の接
続方法としてはたとえば米国特許第3541222号に
開示されるような接続方法が知られている。上記
接続方法は絶縁性成形体に規則的に貫通分配配置
された展性のある潰れやすい金属球を用いて接続
しようとするものであるが、該成形体より突出す
る部分の変形金属が隣り同志短絡し易く、したが
つて高密度実装に適さないものであり、また、金
属のみの圧着の場合には圧着部分、特に異種金属
間の圧着境界部分は空気中の水分、炭酸ガスの影
響により腐食が促進されやすいものである。これ
を防ぐために本発明者の一部は特開昭53−89968
号に見られるように基板とコネクタの間に生じる
空隙を接着剤で充填したものを検討したが、この
場合接触金属部材間の電食あるいは金属、カーボ
ンの種類によつてはゼーベツク効果、ベルチエ効
果の発生を避けるために金属部材を貴金属で構成
するか、他の金属めつきを施さなければならない
というわずらわしさがあつた。そこで、上記した
米国特許の金属球をハンダ合金とし、これに外部
から熱をかけて押圧して接続しようと試みたが、
しかしこのものもまた、該成形体より突出する部
分の溶融金属が隣り同志短絡してしまいやすく、
高密度実装にはさらに適さないものであることが
判明した。 Conventionally, connection methods have been used to connect lead terminals for installing various electrical and electronic devices and flat wire cables, to connect lead terminals for electrical and electronic components and lead terminals for connecting printed circuit boards, or to connect between printed circuit boards. For example, a connection method as disclosed in US Pat. No. 3,541,222 is known. The above connection method attempts to connect using malleable and easily crushed metal balls that are regularly distributed and distributed through an insulating molded body, but the deformed metal in the part that protrudes from the molded body is adjacent to the same It is easily short-circuited and is therefore not suitable for high-density mounting.In addition, when only metal is crimped, the crimped part, especially the crimped boundary between different metals, is susceptible to corrosion due to the influence of moisture and carbon dioxide in the air. is likely to be promoted. In order to prevent this, some of the inventors of the present invention
We considered filling the gap between the board and the connector with adhesive, as shown in the above issue, but in this case, electrolytic corrosion between the contacting metal members, or depending on the type of metal or carbon, the Seebeck effect or Bertier effect may occur. In order to avoid this problem, the metal members must be made of precious metal or plated with other metals, which is a hassle. Therefore, an attempt was made to connect the above-mentioned metal balls in the US patent by making them into solder alloys and applying heat from the outside to press them.
However, in this case, the molten metal in the parts protruding from the molded body tends to short-circuit with adjacent parts.
It turned out that it was even less suitable for high-density packaging.
他方、上記接続方法に類似するものとして、た
とえば実開昭54−114079号、同54−118677号、同
54−128184号に開示されるようなものがあるが、
これらの接続方法に用いられるコネクタはその一
部あるいは全部が熱溶融材料から構成されるため
に、接続端子がたとえばエツチング法により形成
され基板上に固定配置されている場合、その接合
面積によつて基板とコネクタ間にエアブロツクが
生じ易く、電気的接続に関与する面積が限定され
る欠点があり、またコネクタ自体の熱伝導度が小
さいために、コネクタの装着に際してコネクタの
上下方向から加熱が必要であつたり、片側づつ加
熱して接続しなければならず、さらに加熱時にコ
ネクタが変形し易く、短絡事故が発生し易いとい
う種々欠点を有するものであつた。 On the other hand, as a connection method similar to the above, for example, Utility Model Application No. 54-114079, No. 54-118677, and Utility Model Application No. 54-118677
There is something like that disclosed in No. 54-128184,
Since the connectors used in these connection methods are partially or entirely made of heat-melting material, if the connection terminals are formed by etching and fixedly placed on the board, the bonding area will Air blocks tend to occur between the board and the connector, which limits the area involved in electrical connection.Also, because the connector itself has low thermal conductivity, it is necessary to heat the connector from above and below when installing it. It has various drawbacks, such as having to heat one side at a time for connection, and furthermore, the connector is easily deformed when heated, and short circuits are likely to occur.
本発明はかかる従来の接続端子の電気接続方法
における不利、欠点の伴わない新規かつ改良され
た接続方法を提供するものであつて、これは接続
すべく対向配置された、基板上の接続端子およ
び／または部品の接続端子間に、加熱、加圧下に
塑性流動する接着性有機高分子物質中100容量部
に少なくともその表面が加熱により溶融ないし焼
結状態となつて接続端子面に溶着する金属粒子
0.03〜40容量部を分散配合してなるフイルムない
しシート状部材を配置し、これらを加熱加圧して
接着性有機高分子物質を塑性流動させるととも
に、該端子間に介在する該金属粒子を溶融ないし
焼結して接続することを特徴とするものである。 The present invention provides a new and improved connection method that does not have the disadvantages and drawbacks of the conventional connection terminal electrical connection method, and this invention provides a connection terminal on a substrate and a /Or between the connecting terminals of the component, at least 100 parts by volume of an adhesive organic polymer substance that flows plastically under heating and pressure, and at least the surface of the metal particles becomes melted or sintered by heating and welds to the connecting terminal surface.
A film or sheet-like member prepared by dispersing and blending 0.03 to 40 parts by volume is arranged, and these are heated and pressed to plastically flow the adhesive organic polymer material and melt or melt the metal particles interposed between the terminals. It is characterized by being connected by sintering.
以下、添付図面に基づいて本発明を詳細に説明
すると、まず第１図は本発明に用いられるフイル
ムないしシート状部材の基本的形態を例示してな
るものであつて、これは接着性有機高分子物質１
と金属粒子２との混合物をフイルムないしシート
状に成形した後、所定の寸法に切断してなるもの
であり、このようにして得られたフイルムないし
シート状部材３は、たとえば第２図に示すように
接続用端子４ａ，４ｂを備えた回路基板等５ａ，
５ｂに配設し、ついでこの部材を加熱加圧するこ
とによつて第３図に示すような接続構造を得るも
のである。 Below, the present invention will be explained in detail based on the accompanying drawings. First, Figure 1 illustrates the basic form of the film or sheet-like member used in the present invention. molecular substance 1
The film or sheet-like member 3 obtained in this way is formed by forming a mixture of metal particles 2 into a film or sheet and then cutting it into a predetermined size, as shown in FIG. 2, for example. A circuit board etc. 5a equipped with connection terminals 4a and 4b as shown in FIG.
5b, and then heat and pressurize this member to obtain a connection structure as shown in FIG.
本発明に用いられるフイルムないしシート状部
材を構成する加熱、加圧下に塑性流動する接着性
有機高分子材料は、ポリスチロール、ポリ塩化ビ
ニル、ポリ酢酸ビニル、ポリエチレン、ポリプロ
ピレン、ポリアミド、ポリウレタン、ポリエステ
ルなどを主剤としてなる公知のホツトメルト接着
剤、あるいは不飽和ポリエステル、エポキシ樹
脂、クロロプレン、スルフオン化ゴム、シリコー
ンゴム、ウレタンゴム、SBR、NBR、アクリル
酸ゴムなどの熱硬化性樹脂またはゴム、さらには
アスフアルト樹脂、ギルソナイト、グランスピツ
チ、グラハマイトなどから選ばれるが、これはそ
れらの二種または二種以上の共配合、共重合体で
あつてもよい。しかし、このものは接続端子間を
接続するための加熱、加圧時に塑性流動を起し接
着性を示すものでなければならないので、これは
その加圧塑性流動域が60〜250℃の範囲から選ば
れるように調製されるが、これはまた80〜150℃
の範囲の中で熱圧塑性流動し、各種の添加剤、例
えば架橋剤、遅延剤の種類、量を適宜選択するこ
とによりその硬化が数秒ないし数10秒で80％以上
完了するように調整されることが望ましい。な
お、これには必要に応じて各種シラン化合物、有
機チタン化合物などの公知のカツプリング剤、あ
るいは防錆剤などを配合してもよく、これによれ
ばさらに好ましい効果が付与される。 The adhesive organic polymer material that plastically flows under heat and pressure that constitutes the film or sheet member used in the present invention includes polystyrene, polyvinyl chloride, polyvinyl acetate, polyethylene, polypropylene, polyamide, polyurethane, polyester, etc. or thermosetting resins or rubbers such as unsaturated polyester, epoxy resin, chloroprene, sulfonated rubber, silicone rubber, urethane rubber, SBR, NBR, acrylic rubber, or even asphalt resin. , gilsonite, granspitch, grahamite, etc., but it may also be a co-blending or copolymer of two or more of these. However, this material must exhibit adhesive properties by causing plastic flow when heated and pressurized to connect the connecting terminals; It is also prepared at 80-150℃
It can be adjusted to have thermoplastic flow within the range of , and by appropriately selecting the types and amounts of various additives such as crosslinking agents and retarders, curing can be completed by 80% or more in a few seconds to several tens of seconds. It is desirable that Note that, if necessary, known coupling agents such as various silane compounds and organic titanium compounds, or rust preventive agents may be added to the composition, thereby providing even more favorable effects.
他方、本発明に用いられるフイルムないしシー
ト状部材を構成する前記有機高分子物質に配合さ
れる金属粒子は少なくともその表面の融点が70〜
300℃のものから選ぶことがよく、これは例えば
すず、鉛、銀、インジユウム、カドミウム、ビス
マス、アンチモン、亜鉛、銅などから選ばれる２
種または２種以上の半田合金、あるいはアルミニ
ウム合金などとされるが、この金属粒子の前記高
分子物質への配合量は、それが少なすぎると熱圧
時における接続端子間の導通が不充分となり、多
すぎると導通部を囲む絶縁性が不良となるので、
これは前記高分子物質100容量部に対し0.03〜40
容量部、好ましくは0.05〜30容量部、さらには好
ましくは0.07〜25容量部とされる。またこの金属
粒子はそれが上記の高分子物質中にできるだけ均
質に分散されていることが望ましいものであるか
ら、これはその粒径が1.0μｍ以上でしかもその粒
度分布範囲がなるべく小さいものとすることがよ
く、端子巾および端子の配列ピツチに応じて適宜
に、例えば粒径1μｍ以上で325メツシユパス、
250〜350メツシユ、150〜250メツシユのもので、
その最大粒径が2000μｍ以下のものとすることが
よい。 On the other hand, the metal particles blended into the organic polymer material constituting the film or sheet-like member used in the present invention have at least a surface melting point of 70 to 70.
300℃, such as tin, lead, silver, indium, cadmium, bismuth, antimony, zinc, copper, etc.
If the amount of these metal particles added to the polymer material is too small, conduction between the connection terminals during hot pressure will be insufficient. If there is too much, the insulation surrounding the conductive part will be poor.
This is 0.03 to 40 parts per 100 parts by volume of the polymeric substance.
Parts by volume, preferably 0.05 to 30 parts by volume, more preferably 0.07 to 25 parts by volume. Furthermore, it is desirable that the metal particles be dispersed as homogeneously as possible in the above-mentioned polymeric substance, so the particle size should be 1.0 μm or more and the particle size distribution range should be as small as possible. For example, 325 mesh passes with a particle size of 1 μm or more, depending on the terminal width and terminal arrangement pitch.
250-350 mesh, 150-250 mesh,
It is preferable that the maximum particle size is 2000 μm or less.
つぎに、本発明に用いられるフイルムないしシ
ート状部材を製作するには、上記高分子物質を加
熱溶融するか、または溶剤中に溶解し、これに上
記金属粒子を配合して分散混合させ、ついで各種
成形法に従つてフイルム状あるいはシート状に成
形し、最後に所望の形状に切断加工することによ
つて得ることができる。なお、本発明に用いられ
るフイルムないしシート状部材は塗膜の形態で被
接続部の表面に設けることもできる。 Next, in order to produce the film or sheet-like member used in the present invention, the above-mentioned polymeric substance is heated and melted or dissolved in a solvent, and the above-mentioned metal particles are mixed and dispersed therein. It can be obtained by molding into a film or sheet according to various molding methods, and finally cutting into a desired shape. Incidentally, the film or sheet-like member used in the present invention can also be provided in the form of a coating film on the surface of the connected portion.
上記のようにして得られた第１図に示すような
フイルムないしシート部材３を用いて接続すべく
対向配置された接続端子間を接続するには、たと
えば第２図ａに示すように、このコネクタ３を所
定の回路基板５ａ，５ｂに配設した平行導電路か
らなる接続すべく対向配置された接続端子４ａ，
４ｂ間に密接配置し、ついで加圧下に、該基板の
いずれか一方の背面に熱いこてなどを当接して直
接加熱するか、あるいは高周波加熱、超音波加熱
を施すのである。そうするとまず、接続端子４
ａ，４ｂに接触している個所の熱伝達が急速に行
われるので、第２図ｂに示すようにその部分の接
着性有機高分子物質１の表層が軟化流動して接続
端子４ａ，４ｂがフイルムないしシート部材の表
層部に喰い込み、これと同時に端子４ａ，４ｂの
表面と、これに接触しあるいは近接して存在する
金属粒子２の表面同志が溶融状態あるいは焼結状
態（いわゆる粉末治金でいう固相焼結における凝
着、ネツクの形成、ネツクの成長ないしは、液相
焼結における再配列過程、溶解一析出過程、固相
骨格の形成に類似する状態）になり、さらに加
熱、加圧すると対向する接続端子４ａ，４ｂ間の
距離が縮まることもあいまつてこの状態が促進さ
れ、やがて高分子物質の大部分が軟化すると共
に、対向端子間に存在する金属粒子群が接続端子
と溶融一体化ないしは焼結一体化し、対向端子間
を導通状態とするようになる。この場合、基板５
ａ，５ｂの面方向に隣接する端子４ａ，４ａ間あ
るいは４ｂ，４ｂ間に存在する金属粒子は対向端
子４ａ，４ｂにある金属粒子よりも熱伝導が小さ
く、したがつて端子４ａ，４ｂ間に存在する金属
粒子とくらべて溶融状態ないしは焼結状態となり
にくく、それが絶縁性高分子物質中に分散された
まゝとなり、仮にそれが溶融状態ないしは焼結状
態をひきおこしても溶着する接続端子が存在しな
いので、金属粒子同志の界面現象で絶縁高分子物
質中に分散された状態となつて電気的には絶縁状
態に保持されるものである。 In order to connect the connecting terminals arranged facing each other to be connected using the film or sheet member 3 as shown in FIG. 1 obtained as above, for example, as shown in FIG. Connector 3 is arranged on predetermined circuit boards 5a and 5b, and connecting terminals 4a and 4a, which are arranged opposite to each other for connection, are composed of parallel conductive paths.
4b, and then under pressure, either one of the back surfaces of the substrates is directly heated by contacting a hot iron or the like with it, or high-frequency heating or ultrasonic heating is applied. Then, first, connect terminal 4
As heat transfer occurs rapidly at the points in contact with the terminals a and 4b, the surface layer of the adhesive organic polymer material 1 in those areas softens and flows, causing the connecting terminals 4a and 4b to It bites into the surface layer of the film or sheet member, and at the same time, the surfaces of the terminals 4a, 4b and the surfaces of the metal particles 2 that are in contact with or in close proximity to each other are in a molten or sintered state (so-called powder metallurgy). (cohesion, formation of nets, and growth of nets in solid phase sintering, or a state similar to the rearrangement process, dissolution-precipitation process, and formation of solid phase skeleton in liquid phase sintering), and further heating and processing. When the pressure is applied, the distance between the opposing connection terminals 4a and 4b is reduced, which promotes this state, and eventually most of the polymer material softens, and the group of metal particles present between the opposing terminals melts with the connection terminal. They are integrated or sintered to form a conductive state between opposing terminals. In this case, the substrate 5
The metal particles existing between the terminals 4a and 4a or between the terminals 4b and 4b that are adjacent to each other in the plane direction of a and 5b have a lower thermal conductivity than the metal particles located at the opposing terminals 4a and 4b. Compared to existing metal particles, they are less likely to become molten or sintered, and remain dispersed in the insulating polymer material, and even if they become molten or sintered, there are connection terminals that will be welded. Therefore, due to the interfacial phenomenon between the metal particles, they become dispersed in the insulating polymer material and are maintained in an electrically insulated state.
本発明において、上記金属粒子の溶融点ないし
焼結点と高分子物質の軟化流動点との間の関係に
ついては、前者の温度より後者の温度が極めて低
く、たとえばその温度差が50℃以上の場合には高
分子物質層が完全な流導状態になりすぎて、接着
強度が充分得られない上に、かつ溶融状ないし焼
結状金属が一方に沈降しやすくなり接続不良が生
ずるおそれがあるので、これはその温度差を30℃
以下、好ましくは20℃以下とするのがよい。他方
前者の温度の方が100℃以上も高すぎる場合には
高分子物質の表層が軟化流動しても溶融状ないし
焼結状金属粒子がこれを貫通し得ない場合があ
り、しかも一般に高分子物質は金属粒子より硬度
が低く熱伝導性が小さいので、これはその温度差
を100℃以下、好ましくは60℃以下とするのが好
ましい。なお、この加熱加圧条件は金属材料の溶
融点ないし焼結点、高分子物質の軟化流動点に関
する温度特性に応じて選定すべきである。 In the present invention, regarding the relationship between the melting point or sintering point of the metal particles and the softening pour point of the polymer material, the latter temperature is extremely lower than the former temperature, for example, the temperature difference is 50°C or more. In some cases, the polymeric material layer becomes too completely flow-conducting, making it impossible to obtain sufficient adhesive strength, and the molten or sintered metal tends to settle to one side, which may result in poor connection. So this means that the temperature difference is 30℃
The temperature below is preferably 20°C or lower. On the other hand, if the former temperature is 100°C or higher, even if the surface layer of the polymer material softens and flows, molten or sintered metal particles may not be able to penetrate it; Since the material has a lower hardness and a lower thermal conductivity than the metal particles, it is preferred that the temperature difference be less than 100°C, preferably less than 60°C. The heating and pressing conditions should be selected depending on the temperature characteristics regarding the melting point or sintering point of the metal material and the softening pour point of the polymeric material.
つぎに、上記のように対向接点端子間が溶融状
金属あるいは焼結状金属粒子を介して溶融接合す
ると、溶融状金属粒子ないし焼結状金属粒子が保
有する熱は該端子に流れて急速に冷却ないし放冷
状態となり、溶融状金属粒子ないし焼結状金属粒
子は固化して該端子間に溶着状態ないし焼結状態
が得られるようになる。 Next, when the opposing contact terminals are fused together via the molten metal or sintered metal particles as described above, the heat held by the molten metal particles or sintered metal particles flows to the terminals and rapidly The terminals are cooled or left to cool, and the molten metal particles or sintered metal particles are solidified to form a welded or sintered state between the terminals.
つづいて、その加熱を解除すると、高分子物質
が上記溶着状部分ないし焼結状部分のまわりで固
化し、溶着状部分ないし焼結状部分を気密封止す
るようになるが、同時にこの固化した高分子物質
は基板５ａ，５ｂとの間にあつてこれらを相互に
接着一体化することになる。 Subsequently, when the heating is released, the polymer material solidifies around the welded part or sintered part and hermetically seals the welded part or sintered part, but at the same time, this solidified part The polymeric substance is located between the substrates 5a and 5b and bonds them together.
第３図はこのようにして得られた接続構造を例
示してなるものである。 FIG. 3 shows an example of the connection structure obtained in this manner.
したがつて、本発明により対向配置された接続
端子間を接続するときには、対向配置された接続
端子間に金属材料が溶着状態ないし焼結状態とな
つて端子に溶着してその電気的接続が確実に達成
されるばかりでなく、この溶着状部分ないし焼結
状部分の周囲は高分子材料で完全に気密シールさ
れるので、腐食、電食のおそれが全くなく、また
高湿度雰囲気下での使用にも結露に基づく短絡の
おそれはなく、そのうえ高分子物質の存在下に接
続端子を配設した基板間が相互に接着一体化され
るので、その接続の信頼性は飛躍的に向上される
のである。 Therefore, when connecting connecting terminals arranged oppositely according to the present invention, the metal material is in a welded or sintered state between the connecting terminals arranged oppositely and welded to the terminals, thereby ensuring the electrical connection. Not only is this welded or sintered part completely hermetically sealed with polymer material, there is no risk of corrosion or electrical corrosion, and it can be used in high humidity environments. However, there is no risk of short circuits due to condensation, and since the boards on which the connection terminals are placed are bonded together in the presence of a polymeric substance, the reliability of the connection is dramatically improved. be.
以上説明した通り、本発明は金属粒子の溶着な
いし焼結による電気的接続と、接着剤による接着
一体化を同時に達成できるものであるから、その
接続の信頼性はこの種従来の接着型コネクタより
はるかにすぐれたものとされるのであり、したが
つてその実用的価値はきわめて大きい。 As explained above, the present invention can simultaneously achieve electrical connection by welding or sintering metal particles and adhesive integration by adhesive, so the reliability of the connection is higher than that of conventional adhesive type connectors. It is considered to be far superior, and therefore its practical value is extremely great.
第１図は本発明に用いられるフイルムないしシ
ート状部材の代表的実施例を示す一部切欠断面で
示した斜視図、第２図は２枚の基板に設けた対向
接続端子間にフイルムないしシート状部材を配置
した状態の断面図、第３図は本発明により得られ
た接続構造の断面図である。
１……接着性有機高分子物質、２……金属粒
子、３……フイルムないしシート状部材、４……
接続端子、５……回路基板。
FIG. 1 is a partially cutaway perspective view showing a typical example of a film or sheet-like member used in the present invention, and FIG. FIG. 3 is a cross-sectional view of the connection structure obtained by the present invention. 1...Adhesive organic polymer substance, 2...Metal particles, 3...Film or sheet-like member, 4...
Connection terminal, 5... circuit board.
Claims (1)
子および／または部品の接続端子間に、加熱、加
圧下に塑性流動する接着性有機高分子物質100容
量部中に少なくともその表面が加熱により溶融な
いし焼結状態となつて接続端子面に溶着する金属
粒子0.03〜40容量部を分散配合してなるフイルム
ないしシート状部材を配置し、これらを加熱加圧
して接着性有機高分子物質を塑性流動させるとと
もに、該端子間に介在する該金属粒子を溶融ない
し焼結して接続することを特徴とする接続端子の
電気接続方法。1. Between the connection terminals on the substrate and/or the connection terminals of the components, which are arranged facing each other for connection, 100 parts by volume of an adhesive organic polymeric substance that plastically flows under heat and pressure is filled with at least its surface melted by heating. A film or sheet-like member made by dispersing and blending 0.03 to 40 parts by volume of metal particles that becomes sintered or sintered and welded to the connection terminal surface is placed, and these are heated and pressed to plastically flow the adhesive organic polymer material. A method for electrically connecting connection terminals, characterized in that the metal particles interposed between the terminals are melted or sintered to connect the terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12007181A JPS5823174A (en) | 1981-07-31 | 1981-07-31 | Connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12007181A JPS5823174A (en) | 1981-07-31 | 1981-07-31 | Connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5823174A JPS5823174A (en) | 1983-02-10 |
| JPS6351354B2 true JPS6351354B2 (en) | 1988-10-13 |
Family
ID=14777171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12007181A Granted JPS5823174A (en) | 1981-07-31 | 1981-07-31 | Connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5823174A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012087520A1 (en) | 2010-12-20 | 2012-06-28 | Irm Llc | Compositions and methods for modulating farnesoid x receptors |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130004A (en) * | 1983-12-15 | 1985-07-11 | 日立化成工業株式会社 | Transparent conductive anisotropic adhesive sheet |
| JPS60133677A (en) * | 1983-12-21 | 1985-07-16 | 株式会社精工舎 | Heat fusion-bonding connection cable |
| JPS60170177A (en) * | 1984-02-13 | 1985-09-03 | 日本黒鉛工業株式会社 | Conductive anisotropic heat seal connector member |
| JPS6155809A (en) * | 1984-08-27 | 1986-03-20 | 日立化成工業株式会社 | Conductive adhesive film wind |
| JPS6164085A (en) * | 1984-09-04 | 1986-04-02 | ダイソー株式会社 | Electric member |
| JPS6177278A (en) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | Connection member for circuit |
| JPS6177279A (en) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | Connection member for circuit |
| JPS61168573U (en) * | 1985-04-09 | 1986-10-18 | ||
| JPS61168574U (en) * | 1985-04-09 | 1986-10-18 | ||
| JPS61269873A (en) * | 1985-05-23 | 1986-11-29 | 信越ポリマ−株式会社 | Connector |
| US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
| US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
| US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
| US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
| JP4684439B2 (en) * | 2001-03-06 | 2011-05-18 | 富士通株式会社 | Conductive particles, conductive composition, and method for manufacturing electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3541222A (en) * | 1969-01-13 | 1970-11-17 | Bunker Ramo | Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making |
| JPS5121192A (en) * | 1974-08-14 | 1976-02-20 | Seikosha Kk | DODENSEISETSU CHAKUSHIITO |
| JPS51114439A (en) * | 1975-04-02 | 1976-10-08 | Seiko Epson Corp | An adhesive having anisotropic electroconductivity |
| JPS5259889A (en) * | 1975-11-13 | 1977-05-17 | Seiko Epson Corp | Sticking conductivity anisotropy |
| JPS5652885A (en) * | 1979-10-03 | 1981-05-12 | Shinetsu Polymer Co | Pressure nipping type connector |
-
1981
- 1981-07-31 JP JP12007181A patent/JPS5823174A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3541222A (en) * | 1969-01-13 | 1970-11-17 | Bunker Ramo | Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making |
| JPS5121192A (en) * | 1974-08-14 | 1976-02-20 | Seikosha Kk | DODENSEISETSU CHAKUSHIITO |
| JPS51114439A (en) * | 1975-04-02 | 1976-10-08 | Seiko Epson Corp | An adhesive having anisotropic electroconductivity |
| JPS5259889A (en) * | 1975-11-13 | 1977-05-17 | Seiko Epson Corp | Sticking conductivity anisotropy |
| JPS5652885A (en) * | 1979-10-03 | 1981-05-12 | Shinetsu Polymer Co | Pressure nipping type connector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012087520A1 (en) | 2010-12-20 | 2012-06-28 | Irm Llc | Compositions and methods for modulating farnesoid x receptors |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5823174A (en) | 1983-02-10 |
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