JPH10209786A - Crystal-vibrating piece and machining method for crystal-vibrating piece - Google Patents
Crystal-vibrating piece and machining method for crystal-vibrating pieceInfo
- Publication number
- JPH10209786A JPH10209786A JP2578797A JP2578797A JPH10209786A JP H10209786 A JPH10209786 A JP H10209786A JP 2578797 A JP2578797 A JP 2578797A JP 2578797 A JP2578797 A JP 2578797A JP H10209786 A JPH10209786 A JP H10209786A
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- block
- vibrating piece
- main surfaces
- vibrating pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は水晶振動片及び水晶
振動片の加工方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal resonator element and a method for processing the crystal resonator element.
【０００２】[0002]
【従来の技術】水晶振動子の高周波化と小型化により水
晶振動片の設計が難しくなってきている。高周波の水晶
振動子としては一般にＡＴカット水晶が使用されてい
る。小型化をするためにＺ軸方向を短くした矩形状に加
工されるが、水晶振動片が小型になると所望の主振動で
ある厚み滑り振動以外に多くのスプリアスが発生するた
め、これを抑える為の技術が開発されてきている。ま
た、水晶振動片が小型になると低いドライブ条件での励
振が悪化したり、水晶振動片の支持部からの振動漏れに
よりＣＩ値が高くなる等、水晶振動片の電気特性が悪化
する。これらについても対応技術が開発されてきてい
る。2. Description of the Related Art The design of a crystal resonator element has become more difficult due to the higher frequency and smaller size of the crystal resonator. Generally, an AT-cut crystal is used as a high-frequency crystal resonator. In order to reduce the size, it is processed into a rectangular shape with the Z-axis direction shortened. However, if the crystal vibrating piece becomes small, many spurs are generated in addition to the desired main vibration, that is, the thickness sliding vibration. Technology has been developed. In addition, when the quartz-crystal vibrating piece is small, the electrical characteristics of the quartz-crystal vibrating piece are deteriorated, for example, the excitation under a low drive condition is deteriorated, and the CI value is increased due to vibration leakage from the supporting portion of the quartz-crystal vibrating piece. For these, corresponding technologies have been developed.
【０００３】図１は特開昭６２−２１９７０８号公報に
開示されている水晶振動片の平面図である。矩形状の振
動部と減衰部とを一体に成形したＡＴカット水晶振動片
の減衰部に傾斜を設けてエネルギーを振動部に閉じ込め
て電気特性を向上する技術が開示されている。本発明に
関する矩形状ＡＴカット水晶振動片とは長さと巾方向が
異なるがエネルギー閉じ込めによる特性向上の思想は同
じである。(従来技術第１例)FIG. 1 is a plan view of a quartz-crystal vibrating piece disclosed in Japanese Patent Application Laid-Open No. 62-219708. A technique is disclosed in which an AT-cut quartz-crystal vibrating reed in which a rectangular vibrating portion and a damping portion are integrally formed is provided with a slope in the damping portion to confine energy in the vibrating portion and improve electrical characteristics. Although the length and width directions are different from those of the rectangular AT-cut quartz-crystal vibrating piece according to the present invention, the idea of improving the characteristics by confining energy is the same. (First example of prior art)
【０００４】特開平８−１２５４８６号公報には角板状
の厚み滑り振動子のスプリアス振動を抑制する為に、厚
み滑り振動方向と平行な側面の粗さを０．３〜２０μｍ
にする技術が開示されている。側面が平滑面であるとス
プリアスが発生し易いため側面の表面を粗くするという
ものである。（従来技術第２例）Japanese Patent Application Laid-Open No. 8-125486 discloses that in order to suppress spurious vibration of a thickness-sliding vibrator in the form of a square plate, the roughness of a side surface parallel to the thickness-shear vibration direction is set to 0.3 to 20 μm.
Is disclosed. If the side surface is a smooth surface, spurious is likely to occur, so that the surface of the side surface is roughened. (Second example of prior art)
【０００５】特開平４−８７４０８号公報には水晶振動
子及びその加工方法が開示されている。長方形(矩形状)
の水晶ブランクの長手方向の両端部を両側から斜めに削
除して研磨剤と共に回転する円筒容器に収納して研磨し
主面に励振電極を形成する水晶振動子であり、その加工
方法として、１．短冊状の水晶ウェハーの主面を接着し
て積み重ねる第１の工程と、２．このウェハーを上記主
面に直角に所定幅に切断する第２の工程と、３．この水
晶ウェハーの主面の両端部を両側から斜めに切除する第
３の工程と、４．上記第１の工程で接着した水晶ウェハ
ーを個々に分離してブランクを得る第４の工程と、５．
上記ブランクを研磨剤とともに円筒容器に収納して該円
筒容器を回転駆動して研磨する第５の工程と、６．この
ブランクの主面に励振電極を形成する第６の工程からな
る方法が開示されている。(従来技術第３例)[0005] Japanese Patent Application Laid-Open No. 4-87408 discloses a crystal resonator and a processing method thereof. Rectangular (rectangular)
A crystal resonator in which both ends in the longitudinal direction of the crystal blank are obliquely removed from both sides and housed in a cylindrical container that rotates together with an abrasive and polished to form an excitation electrode on the main surface. . 1. a first step of bonding and stacking the main surfaces of the strip-shaped quartz wafers; 2. a second step of cutting the wafer into a predetermined width perpendicular to the main surface; 3. a third step of obliquely cutting both ends of the main surface of the quartz wafer from both sides; 4. a fourth step of individually separating the quartz wafers bonded in the first step to obtain a blank;
5. a fifth step of accommodating the blank together with an abrasive in a cylindrical container and rotating and driving the cylindrical container to perform polishing; A method comprising a sixth step of forming an excitation electrode on the main surface of the blank is disclosed. (Third example of conventional technology)
【０００６】[0006]
【発明が解決しようとする課題】従来技術第１例では
「水晶振動子の加工は機械加工でもよいが、フォトリソ
グラフィー法によるエッチング加工で行うと寸法精度が
良く製造が容易となる。」とあり、機械加工については
具体的に記載されていない。従来技術第２例では切断加
工時に研磨剤の砥粒を適宜選択することで側面を粗くす
るかサンドブラスト法で粗くする記載があるが、切断時
に粗い砥粒を使用すると切断面にクラックの多い深い加
工層ができる欠点を有し、サンドブラストで側面を荒ら
すのは均一に加工するのが難しい。The first example of the prior art states that "the processing of the quartz oscillator may be mechanical, but if it is performed by etching using photolithography, the dimensional accuracy is good and the manufacture is easy". However, there is no specific description of machining. In the second example of the related art, there is a description that the side surface is roughened by appropriately selecting the abrasive grains of the abrasive during the cutting process or the sandblasting method is used. However, when the coarse abrasive grains are used at the time of cutting, the cut surface has many cracks. There is a drawback that a processing layer is formed, and it is difficult to uniformly process the side surface by sandblasting.
【０００７】従来技術第３例には機械加工の方法として
６工程よりなる方法が開示されている。(第６工程は電
極形成であり、ブランクの加工ではないが)大きなウェ
ハーの主面を接着して所定幅に切断する。両端部を両側
から斜めに切除する。個々のブランクに分離する。ブラ
ンクを研磨剤とともに円筒容器に収納して円筒容器を回
転駆動して研磨する。(以下パイピングと言う)The third example of the prior art discloses a six-step method as a machining method. (The sixth step is electrode formation, not blank processing.) The main surface of a large wafer is bonded and cut to a predetermined width. Both ends are cut diagonally from both sides. Separate into individual blanks. The blank is housed in a cylindrical container together with the abrasive, and the cylindrical container is rotated and polished. (Hereinafter called piping)
【０００８】第３工程の主面の両端部を両側から斜めに
切除するのはダイヤモンドホイール等を用いるがチッピ
ングが出易い。また、第５工程で、個々のブランクにし
てからパイピングをすると主面が研磨剤で削られ荒れて
しまう。パイピングは研磨剤の粗さにより研磨速度が変
化する。粒子の粗い研磨剤を使用すると研磨速度は速く
なるが、主面が荒れてしまう。研磨剤の粒子を細かくす
ると研磨速度が遅くなり、その分主面の荒れる程度は少
なくなる。しかし、研磨剤の粒子を更に細かくすると研
磨できなくなる。研磨できる限度の粒子を使用しても、
主面を加工するときのラップ仕上げやポリシング仕上げ
の面状態とは比較にならないほど荒れてしまう。主面が
荒れると低いドライブ条件での励振が悪化したり、ＣＩ
値が高くなる等、水晶振動片の電気特性が悪化する。In the third step, both ends of the main surface are cut obliquely from both sides using a diamond wheel or the like, but chipping is likely to occur. In addition, in the fifth step, when piping is performed after forming individual blanks, the main surface is shaved by the abrasive and becomes rough. In the piping, the polishing rate changes depending on the roughness of the abrasive. The use of a coarse-grained abrasive increases the polishing rate, but roughens the main surface. When the abrasive particles are made finer, the polishing rate becomes slower, and the degree of roughening of the main surface is reduced accordingly. However, if the abrasive particles are made finer, polishing becomes impossible. Even if you use particles that can be polished,
The surface condition of the lap finish or polishing finish when machining the main surface becomes incomparably rough. If the main surface becomes rough, the excitation under low drive conditions will deteriorate,
The electrical characteristics of the quartz-crystal vibrating piece are deteriorated, for example, the value becomes high.
【０００９】[0009]
【課題を解決するための手段】振動主面をラップ加工又
はポリシング加工し側面をパイピング加工した水晶振動
片とする。その加工方法は、少なくとも、振動主面をラ
ップ仕上げ又はポリシング仕上げする工程と、複数個の
水晶振動片を振動主面を重ねあわせて接着してブロック
化する工程と、ブロック化した水晶振動片と研磨剤をパ
イプに収納し、パイプを回転して水晶振動片の側面を加
工して４角の面取りをする工程と、接着剤を除去して個
々の水晶振動片にする工程を含む水晶振動片の加工方法
とする。Means for Solving the Problems A quartz vibrating reed in which the main vibration surface is lapped or polished and the side surface is processed by piping. The processing method is, at least, a step of lapping or polishing the main vibration surface, a step of laminating a plurality of crystal vibrating pieces by bonding the main vibration faces together to form a block, A crystal vibrating piece including a step of storing an abrasive in a pipe, rotating the pipe and processing the side surface of the crystal vibrating piece to form a square chamfer, and a step of removing an adhesive to form individual quartz vibrating pieces. Processing method.
【００１０】[0010]
【発明の実施の形態】図２は本発明の加工方法を説明す
る為の工程図である。工程Ａは主面を所定の面状態に仕
上げた多数の水晶振動片１の主面を接着して直方体にブ
ロック化する工程である。ブロック化した両側にはダミ
ーであるガラス２が接着されている。ブロック化した両
端部の水晶振動片の主面を荒らさない為のものである。
接着剤はパイピング中に水晶振動片が剥がれることな
く、加工後容易に剥離できるものが良い。例えばパラフ
ィンが使用される。FIG. 2 is a process chart for explaining a processing method of the present invention. Step A is a step of bonding the main surfaces of a large number of crystal vibrating reeds 1 whose main surfaces have been finished to a predetermined surface state to form a rectangular parallelepiped block. Dummy glass 2 is adhered to both sides of the block. The purpose is not to roughen the main surfaces of the crystal vibrating reeds at both ends which are made into blocks.
The adhesive is preferably one which can be easily peeled off after processing without peeling off the quartz vibrating piece during piping. For example, paraffin is used.
【００１１】工程Ｂはブロック化した水晶振動片１を研
磨剤(図示せず)と共に円筒パイプ３の中に入れて、円筒
パイプを回転することでブロック化した直方体の４つの
角を円筒パイプの内面形状に倣うように削り落とす工程
である。パイプ３の径は加工する水晶振動片１の仕上が
り形状により選定するが、単に形状合わせだけなので困
難はない。研磨剤の粒径は研磨面の所望粗さと研磨剤の
硬度やパイピングの加工条件により適宜選択すればよ
い。In step B, the blocked quartz vibrating reed 1 is put into a cylindrical pipe 3 together with an abrasive (not shown), and the four corners of the blocked rectangular parallelepiped are rotated by rotating the cylindrical pipe. This is the step of shaving off the shape of the inner surface. The diameter of the pipe 3 is selected according to the finished shape of the quartz vibrating piece 1 to be processed. The particle size of the abrasive may be appropriately selected depending on the desired roughness of the polished surface, the hardness of the abrasive, and the processing conditions for piping.
【００１２】Ｃ工程はパイピング後のブロックを個々の
水晶振動片に戻す工程であるが、図ではパイピング上が
りのブロックの形状を示している。ブロックの４角は円
筒パイプの内面に倣って削り落とされている。熱処理に
よりパラフィンを落とすと容易に個々の水晶振動片に分
離できる。Step C is a step in which the blocks after piping are returned to the individual crystal vibrating pieces. In the drawing, the shape of the block after piping is shown. The four corners of the block are cut off following the inner surface of the cylindrical pipe. When paraffin is dropped by heat treatment, it can be easily separated into individual crystal vibrating pieces.
【００１３】図３は完成した水晶振動片の平面図であ
る。水晶振動片の４角は円筒パイプの内径Ｒに加工され
ている。主面はラップ仕上又はポリシング仕上のままで
あることは言うまでもない。水晶振動片の側面はほぼパ
イピングの研磨状態に仕上がるが、厳密に言うと４角の
曲線部は完全なパイピング仕上になりその外の直線部は
不完全なパイピング仕上となるがスプリアスを抑制する
目的は達成できる。FIG. 3 is a plan view of the completed quartz resonator blank. The four corners of the quartz vibrating piece are machined into the inner diameter R of the cylindrical pipe. It goes without saying that the main surface remains wrapped or polished. The sides of the crystal vibrating piece are almost finished in a polished state of piping. Strictly speaking, the curved part of the square has perfect piping finish and the other straight part has incomplete piping finish, but the purpose is to suppress spurious. Can be achieved.
【００１４】[0014]
【発明の効果】角を落とす加工がブロックででき、パイ
プに入れて回転させておくだけなので生産性が向上し
た。According to the present invention, the angle can be reduced by using a block, and since it is simply put in a pipe and rotated, the productivity is improved.
【００１５】角を落とす加工をパイピングにしたのでチ
ッピングが少なく、加工のばらつきも少なくなった。Since the processing for cutting off the corners is performed by piping, the chipping is reduced and the variation in the processing is reduced.
【００１６】主面を荒らすことがないので水晶振動子の
電気特性を悪化させることがなくなった。Since the main surface is not roughened, the electric characteristics of the crystal unit are not deteriorated.
【００１７】側面角部が連続した曲線になることとパイ
ピングにより粗面になるのでスプリアスが発生し難くな
り、また、主振動のエネルギーを中央部に閉じ込める効
果があった。Since the side corners are formed into a continuous curve and roughened by piping, spurious is less likely to occur, and the energy of the main vibration is confined to the center.
【図１】従来技術による水晶振動片の平面図FIG. 1 is a plan view of a crystal resonator element according to a conventional technique.
【図２】本発明の加工方法を説明する為の工程図FIG. 2 is a process chart for explaining the processing method of the present invention.
【図３】本発明による水晶振動片の平面図FIG. 3 is a plan view of a crystal resonator element according to the present invention.
１ 水晶振動片 ２ ダミーガラス ３ 円筒パイプ 1 Crystal vibrating piece 2 Dummy glass 3 Cylindrical pipe
Claims (3)
工し側面をパイピング加工したことを特徴とする水晶振
動片。1. A quartz vibrating reed in which a main vibration surface is lapped or polished and a side surface is subjected to piping processing.
動片であることを特徴とする請求項１記載の水晶振動
片。2. The quartz vibrating piece according to claim 1, wherein the quartz vibrating piece is a quartz vibrating piece that performs thickness-shear vibration.
はポリシング仕上げする工程と、複数個の水晶振動片を
振動主面を重ねあわせて接着してブロック化する工程
と、ブロック化した水晶振動片と研磨剤をパイプに収納
し、パイプを回転して水晶振動片の側面を加工して４角
の面取りをする工程と、接着剤を除去して個々の水晶振
動片にする工程を含むことを特徴とする水晶振動片の加
工方法。3. At least a step of lapping or polishing the main vibration surface, a step of laminating a plurality of crystal vibrating pieces by bonding the main vibration faces together to form a block, and a step of forming a block of the crystal vibrating piece. The method includes the steps of storing an abrasive in a pipe, rotating the pipe and processing the side surfaces of the quartz vibrating piece to form a square chamfer, and removing the adhesive to form individual quartz vibrating pieces. The processing method of the crystal vibrating piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2578797A JPH10209786A (en) | 1997-01-23 | 1997-01-23 | Crystal-vibrating piece and machining method for crystal-vibrating piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2578797A JPH10209786A (en) | 1997-01-23 | 1997-01-23 | Crystal-vibrating piece and machining method for crystal-vibrating piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10209786A true JPH10209786A (en) | 1998-08-07 |
Family
ID=12175551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2578797A Pending JPH10209786A (en) | 1997-01-23 | 1997-01-23 | Crystal-vibrating piece and machining method for crystal-vibrating piece |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10209786A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005286992A (en) * | 2004-03-02 | 2005-10-13 | Seiko Epson Corp | Piezoelectric oscillating piece, piezoelectric vibrator, and piezoelectric oscillator |
| CN107695849A (en) * | 2017-11-14 | 2018-02-16 | 深圳市铭宇泰科技有限公司 | A kind of crystal oscillator processes test integrated equipment |
| US9960751B2 (en) | 2015-10-20 | 2018-05-01 | Seiko Epson Corporation | Piezoelectric vibrator, electronic apparatus, and vehicle |
-
1997
- 1997-01-23 JP JP2578797A patent/JPH10209786A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005286992A (en) * | 2004-03-02 | 2005-10-13 | Seiko Epson Corp | Piezoelectric oscillating piece, piezoelectric vibrator, and piezoelectric oscillator |
| US9960751B2 (en) | 2015-10-20 | 2018-05-01 | Seiko Epson Corporation | Piezoelectric vibrator, electronic apparatus, and vehicle |
| CN107695849A (en) * | 2017-11-14 | 2018-02-16 | 深圳市铭宇泰科技有限公司 | A kind of crystal oscillator processes test integrated equipment |
| CN107695849B (en) * | 2017-11-14 | 2023-10-13 | 深圳市铭宇泰科技有限公司 | Crystal oscillator processing test integration equipment |
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