JPH10152791A - High-speed plating device and high-speed plating method - Google Patents
High-speed plating device and high-speed plating methodInfo
- Publication number
- JPH10152791A JPH10152791A JP31030496A JP31030496A JPH10152791A JP H10152791 A JPH10152791 A JP H10152791A JP 31030496 A JP31030496 A JP 31030496A JP 31030496 A JP31030496 A JP 31030496A JP H10152791 A JPH10152791 A JP H10152791A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nozzle
- speed
- speed plating
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims description 11
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910001316 Ag alloy Inorganic materials 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000000243 solution Substances 0.000 abstract description 15
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- -1 silver ions Chemical class 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
- 239000010802 sludge Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は高速めっき装置及び
高速めっき方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-speed plating apparatus and a high-speed plating method.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】噴射式
の高速めっき装置では、溶解性アノードは、一般的に用
いられていなかった。これは通常アノードを取付けるめ
っき槽と、被めっき物（例えばリードフレーム）である
カソードとの間に、めっき液を噴出させるための、ポン
プ及び配管があるため、極間距離が長く、浴の電気抵抗
が大きくなっており、液を被めっき物に噴出させるノズ
ルをアノードとした場合に比べて、大電流を必要とし、
結果として、容量の大きな電源を用いなければならず、
設備的にもランニングコストの面でも不利である。2. Description of the Related Art In a jet type high-speed plating apparatus, a soluble anode has not been generally used. This is because there is a pump and piping for ejecting the plating solution between the plating tank where the anode is usually mounted and the cathode which is the object to be plated (for example, a lead frame). The resistance is large and requires a large current compared to the case where the nozzle that ejects the solution to the plating object is the anode,
As a result, a large capacity power supply must be used,
It is disadvantageous in terms of equipment and running cost.
【０００３】本発明はこのような従来の技術に着目して
なされたものであり、溶解性アノードの使用が可能な高
速めっき装置及び高速めっき方法を提供するものであ
る。The present invention has been made by paying attention to such a conventional technique, and provides a high-speed plating apparatus and a high-speed plating method capable of using a soluble anode.
【０００４】[0004]
【課題を解決するための手段】この発明に係る高速めっ
き装置は、めっき槽内のめっき液をノズルから被めっき
物に対して噴射し、噴射後にノズルの周囲を流下するめ
っき液をめっき槽内へ回収する構造の高速めっき装置に
おいて、前記ノズルの周囲に溶解性アノードを配したも
のである。A high-speed plating apparatus according to the present invention injects a plating solution in a plating tank from a nozzle toward an object to be plated, and applies a plating solution flowing down around the nozzle after the injection to the plating tank. In a high-speed plating apparatus having a structure for recovering water, a soluble anode is arranged around the nozzle.
【０００５】ノズルの周囲に流下するめっき液の液溜ま
り部を設け、該液溜まり部内に溶解性アノードを配して
も良い。液溜まり部の形状はどのような形状でも良く、
例えば、液が溜まりやすい上部開放容器形状にしても良
い。[0005] A liquid pool for a plating solution flowing down around the nozzle may be provided, and a soluble anode may be arranged in the liquid pool. The shape of the liquid reservoir may be any shape,
For example, an upper open container shape in which the liquid is likely to accumulate may be used.
【０００６】また、溶解性アノードから発生するアノー
ドスラッジを処理するための、フィルター構造や、オー
バーフロー構造を付加しても良い。Further, a filter structure or an overflow structure for treating anode sludge generated from the soluble anode may be added.
【０００７】この高速めっき装置では、高速めっきが可
能なめっきであれば、どのような種類のめっきでも行う
ことができるが、特に、アノードスラッジが発生し易い
錫・錫合金めっきや、銀・銀合金めっきへの適用に好適
である。In this high-speed plating apparatus, any type of plating can be performed as long as high-speed plating is possible. In particular, tin / tin alloy plating or silver / silver, in which anode sludge is likely to be generated, can be performed. Suitable for application to alloy plating.
【０００８】[0008]
【発明の実施の形態】この実施形態は、銀の高速めっき
装置及びその方法を示すものである。めっき槽１内には
非シアン系の銀めっき液２が入っている。この非シアン
系の銀めっき液２は、以下のような組成である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS This embodiment shows a high-speed silver plating apparatus and method. A non-cyanide silver plating solution 2 is contained in the plating tank 1. The non-cyanide silver plating solution 2 has the following composition.
【０００９】 ５，５−ジメチルヒダントイン ２５０ｇ／リットル 水酸化カリウム １００ｇ／リットル 硝酸銀 ９４．５ｇ／リットル 浴温 ６０℃5,5-Dimethylhydantoin 250 g / liter Potassium hydroxide 100 g / liter Silver nitrate 94.5 g / liter Bath temperature 60 ° C.
【００１０】めっき槽１の上部にはスパージャ３が配さ
れている。スパージャ３の内部にはノズル４が上向きに
設けられている。ノズル４の周囲には上部開放型の液溜
まり部５が形成されている。この液溜まり部５の内部に
板状で銀製の溶解性アノード６が配されている。溶解性
アノード６にはスパージャ３の外部へ突出したリード部
７が接触して配置されており、該リード部７にプラスの
電気が負荷される。A sparger 3 is provided above the plating tank 1. A nozzle 4 is provided inside the sparger 3 so as to face upward. An upper open type liquid reservoir 5 is formed around the nozzle 4. A plate-shaped soluble anode 6 made of silver is arranged inside the liquid reservoir 5. A lead portion 7 protruding outside the sparger 3 is disposed in contact with the soluble anode 6, and positive electricity is applied to the lead portion 7.
【００１１】ノズル４の下端部は曲折してスパージャ３
の外部へ突出しており、該下端部にめっき液２が送液管
８を介してポンプ９より送られる。めっき槽１の内部は
スパージャ３の真下の第１槽１０と、その横の第２槽１
１とを区切る仕切壁１２が設けられており、第１槽１０
から第２槽１１へのオーバーフロー構造を構成してい
る。The lower end of the nozzle 4 is bent and the sparger 3 is bent.
The plating solution 2 is sent from the pump 9 to the lower end portion of the plating solution 2 through the liquid sending pipe 8. The inside of the plating tank 1 includes a first tank 10 directly below the sparger 3 and a second tank 1 next to the sparger 3.
1 is provided, and a first tank 10 is provided.
From the first tank 11 to the second tank 11.
【００１２】また、めっき槽１の底部において、第１槽
１０から第２槽１１へ、別の送液管１３を介してポンプ
１４によりめっき液２が送れる。また、送液管１３の途
中にフィルター１５を設けて、フィルター構造を構成し
ている。At the bottom of the plating tank 1, the plating liquid 2 can be sent from the first tank 10 to the second tank 11 by a pump 14 via another liquid feed pipe 13. Further, a filter 15 is provided in the middle of the liquid sending pipe 13 to constitute a filter structure.
【００１３】次に、この実施形態の作用を説明する。め
っき液２は第２槽１１からノズル４へ送られ、ノズル４
の上端にセットされたＩＣリードフレーム（被めっき
物）１６に対してめっきを行う。めっき後のめっき液２
はノズル４の周囲を通って第１槽１０内に流下するが、
ノズル４の周囲に液溜まり部５が形成されているため、
めっき液２はこの液溜まり部５内にいったん入った後
に、下方の第１槽１０内へ落ちる。液溜まり部５内には
溶解性アノード６が配されているため、カソードである
ＩＣリードフレーム１６に対して必要な電位を負荷しな
がら、めっき液２中に銀イオンを供給することができ
る。Next, the operation of this embodiment will be described. The plating solution 2 is sent from the second tank 11 to the nozzle 4,
Is plated on the IC lead frame (plated object) 16 set at the upper end of the substrate. Plating solution 2 after plating
Flows down into the first tank 10 through the periphery of the nozzle 4,
Since the liquid reservoir 5 is formed around the nozzle 4,
The plating solution 2 once enters the pool 5 and then falls into the lower first tank 10. Since the dissolvable anode 6 is disposed in the liquid reservoir 5, silver ions can be supplied into the plating solution 2 while applying a necessary potential to the IC lead frame 16 as a cathode.
【００１４】また、溶解性アノード６からはアノードス
ラッジが発生するが、第１槽１０から第２槽１１へオー
バーフローされることにより、第２槽１１への移動が規
制される。更に、第１槽１０と第２槽１１の間にはフィ
ルター１５が設けられているため、このフィルター１５
によっても濾過されて除去される。Further, anode sludge is generated from the soluble anode 6. However, the anode sludge overflows from the first tank 10 to the second tank 11, whereby the movement to the second tank 11 is restricted. Further, since a filter 15 is provided between the first tank 10 and the second tank 11,
Is also filtered off.
【００１５】[0015]
【実施例】前記のめっき装置を用いた場合と、また溶解
性アノード６を取り外して、比較例としてのアノード１
７（図１参照）をめっき槽１中に吊り下げた装置の場合
における電流密度と電圧との関係を調べてみた。めっき
はそれぞれ１ｃｍ2 のスポットに対して行った。EXAMPLES The case where the plating apparatus described above was used, and the dissolvable anode 6 was removed, and the anode 1 was used as a comparative example.
7 (see FIG. 1) was examined for the relationship between current density and voltage in the case of an apparatus suspended in the plating tank 1. Plating was performed on spots of 1 cm 2 each.
【００１６】[0016]
【表１】 [Table 1]
【００１７】結果は上記表１に示す如く、溶解性アノー
ド６を使用した実施例の方が、吊り下げアノード１７を
使用した比較例よりも、電圧が少なくて済み、設備的に
もランニングコスト的にも有利であることが判明した。As shown in the above Table 1, the voltage of the embodiment using the dissolvable anode 6 was lower than that of the comparative example using the suspended anode 17, and the facility and the running cost were lower. Has also proven advantageous.
【００１８】[0018]
【発明の効果】この発明によれば、アノードをめっき槽
中に配する場合に比べて、電圧が少なくて済み、設備的
にもランニングコストの面でも有利である。According to the present invention, the voltage can be reduced as compared with the case where the anode is disposed in the plating tank, which is advantageous in terms of equipment and running cost.
【図１】この発明の実施形態に係る高速めっき装置を示
す概略側面図。FIG. 1 is a schematic side view showing a high-speed plating apparatus according to an embodiment of the present invention.
【図２】スパージャを示す平面図。FIG. 2 is a plan view showing a sparger.
【図３】スパージャを示す一部破断の斜視図。FIG. 3 is a partially broken perspective view showing a sparger.
１ めっき槽 ２ めっき液 ４ ノズル ５ 液溜まり部 ６ 溶解性アノード １６ ＩＣリードフレーム（被めっき物） DESCRIPTION OF SYMBOLS 1 Plating tank 2 Plating solution 4 Nozzle 5 Liquid reservoir 6 Soluble anode 16 IC lead frame (substrate to be plated)
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成９年１１月２１日[Submission date] November 21, 1997
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項２[Correction target item name] Claim 2
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
Claims (8)
っき物に対して噴射し、噴射後にノズルの周囲を流下す
るめっき液をめっき槽内へ回収する構造の高速めっき装
置において、 前記ノズルの周囲に溶解性アノードを配したことを特徴
とする高速めっき装置。1. A high-speed plating apparatus having a structure in which a plating solution in a plating tank is sprayed from a nozzle onto a workpiece to be plated, and a plating solution flowing around the nozzle after the spraying is recovered into the plating tank. A high-speed plating apparatus comprising a dissolving anode disposed around the periphery.
まり部を設け、該液溜まり部内に溶解性アノードを配し
た2. A reservoir for a plating solution flowing down around a nozzle is provided, and a soluble anode is disposed in the reservoir.
る請求項２記載の高速めっき装置。3. The high-speed plating apparatus according to claim 2, wherein the liquid reservoir has an open-top container shape.
〜３のいずれか１項に記載の高速めっき装置。4. The method according to claim 1, wherein a filter structure is added.
4. The high-speed plating apparatus according to any one of items 3 to 3.
項１〜４のいずれか１項に記載の高速めっき装置。5. The high-speed plating apparatus according to claim 1, further comprising an overflow structure.
速めっき装置を用いて、銀又は銀合金めっきを行う高速
めっき方法。6. A high-speed plating method for performing silver or silver alloy plating using the high-speed plating apparatus according to claim 1.
記載の高速めっき方法。7. A non-cyan plating solution is used.
The high-speed plating method described.
速めっき装置を用いて、錫又は錫合金めっきを行う高速
めっき方法。8. A high-speed plating method for performing tin or tin alloy plating using the high-speed plating apparatus according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31030496A JPH10152791A (en) | 1996-11-21 | 1996-11-21 | High-speed plating device and high-speed plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31030496A JPH10152791A (en) | 1996-11-21 | 1996-11-21 | High-speed plating device and high-speed plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10152791A true JPH10152791A (en) | 1998-06-09 |
Family
ID=18003617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31030496A Pending JPH10152791A (en) | 1996-11-21 | 1996-11-21 | High-speed plating device and high-speed plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10152791A (en) |
-
1996
- 1996-11-21 JP JP31030496A patent/JPH10152791A/en active Pending
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