CN114525574A - Plating solution circulating device and plating solution filtering method - Google Patents
Plating solution circulating device and plating solution filtering method Download PDFInfo
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- CN114525574A CN114525574A CN202011321205.1A CN202011321205A CN114525574A CN 114525574 A CN114525574 A CN 114525574A CN 202011321205 A CN202011321205 A CN 202011321205A CN 114525574 A CN114525574 A CN 114525574A
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- 238000001914 filtration Methods 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000007747 plating Methods 0.000 title claims description 235
- 239000007788 liquid Substances 0.000 claims abstract description 167
- 238000009713 electroplating Methods 0.000 claims abstract description 82
- 238000003860 storage Methods 0.000 claims abstract description 69
- 230000007704 transition Effects 0.000 claims description 64
- 238000010926 purge Methods 0.000 claims description 60
- 238000001514 detection method Methods 0.000 claims description 13
- 239000000243 solution Substances 0.000 description 202
- 230000008569 process Effects 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 238000000746 purification Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 230000001376 precipitating effect Effects 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- 239000007787 solid Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating solution circulating device and an electroplating solution filtering method, wherein the electroplating solution circulating device comprises a liquid storage device, a working groove, at least one first filtering device and at least one second filtering device, wherein the liquid storage device is provided with a liquid storage space, a liquid storage outlet and a liquid storage inlet which are communicated with the liquid storage space, the working groove is provided with a working space, a liquid inlet and a liquid outlet which are communicated with the working space, the first filtering device is communicated with the liquid storage outlet of the liquid storage device and the liquid inlet of the working groove, the second filtering device is communicated with the liquid storage inlet of the liquid storage device and the liquid outlet of the working groove, the electroplating solution is filtered at least twice by the first filtering device and the second filtering device, thereby ensuring the purity of the electroplating solution.
Description
Technical Field
The invention relates to the field of electroplating, in particular to an electroplating solution circulating device and an electroplating solution filtering method.
Background
Electroplating refers to the electrolytic reaction in a metal salt solution under the action of direct current, so that a metal layer or an alloy layer is deposited on the surface of an electric conductor such as a metal. For example, in the specific electroplating process, taking the example of forming a copper layer on the surface of the key by using an electroplating process, a metal copper plate is electrically connected to the anode of a power supply, and an electrically conductive iron key is electrically connected to the cathode of the power supply, wherein the metal copper plate and the key are immersed in an electroplating solution (e.g., a copper sulfate solution), under the action of direct current, the cations and the anions in the electroplating solution are regularly moved, the key at the cathode gradually deposits a layer of metal copper, and the metal copper plate at the anode is continuously dissolved to supplement copper ions consumed in the electroplating solution. In this manner, the metallic copper connected to the anode is gradually transferred to the surface of the iron key.
The glossiness of the surface of the key is improved by electroplating, and the attractiveness of the key is improved. The common tap, door handle, ornaments and the like in daily life are formed, and a copper plating layer, a nickel plating layer and the like are formed on the surfaces of the tap and the door handle through electroplating by utilizing an electroplating process, or a gold plating layer and a silver plating layer are formed on the surfaces of the ornaments by utilizing the electroplating process, so that the product is attractive, and the value of the product is improved. In addition, the electroplating improves the corrosion resistance of the key, the iron key is easy to oxidize and rust after being exposed in the air for a long time, the use of a user is seriously influenced, and after a zinc coating and a nickel coating are formed by utilizing the electroplating process, the key with the coating can better resist corrosion, so that the service life of the product is prolonged. In addition, the electroplating can also repair damaged parts and form coatings with special performance, such as a reflective silver coating, a conductive silver coating, an anti-reflection black nickel coating and the like. In a word, the electroplating process greatly improves the functionality, the decoration and the protection of products, and the electroplating process plays an important role in daily life and industrial production of people.
In the electroplating process, the purity of the electroplating solution directly affects the electroplating effect and the quality of the plating layer formed on the surface of the workpiece. If solid particles suspended in the plating solution are attached to the surface of the plating layer formed on the surface of the workpiece, problems such as reduced flatness of the plating layer, loss of gloss of the plating layer, and slow light emission may occur, or pinholes, pits, and the like may occur in the plating layer, thereby reducing the corrosion resistance of the plating layer. In addition, in the long-time electroplating process, a lot of impurities are inevitably precipitated in the electroplating solution, and if the concentration of the impurities exceeds the standard, the workpieces are reworked and even scrapped. Therefore, the purity of the plating solution directly affects the performance of the plating and the proper operation of the plating process.
Disclosure of Invention
An object of the present invention is to provide a plating solution circulating apparatus and a plating solution filtering method, wherein the plating solution circulating apparatus filters a plating solution at least twice during the process of circulating the plating solution to ensure the purity of the plating solution.
Another object of the present invention is to provide a plating solution circulating apparatus and a plating solution filtering method, wherein the plating solution circulating apparatus does not affect the normal operation of the plating process during the process of filtering the plating solution, thereby ensuring the efficiency of the plating process.
Another object of the present invention is to provide an electroplating solution circulating apparatus and an electroplating solution filtering method, wherein the electroplating solution circulating apparatus includes a working tank, a plating metal and a workpiece respectively connected to an anode and a cathode of a power supply are placed in the electroplating solution in the working tank, and a plating layer is formed on the surface of the workpiece after a chemical reaction, wherein the electroplating solution in the working tank is always maintained at a standard level, so as to improve the uniformity of the plating layer.
Another objective of the present invention is to provide an electroplating solution circulating apparatus and an electroplating solution filtering method, wherein the electroplating circulating apparatus includes at least two filtering devices, one of the filtering devices filters the electroplating solution before entering a working space of the working tank, and the other filtering device filters the electroplating solution flowing out of the working space of the working tank, so as to improve the purity of the electroplating solution by at least two filtering processes, thereby ensuring the quality of the plating layer.
Another object of the present invention is to provide a plating solution circulating apparatus and a plating solution filtering method, wherein the working tank of the plating solution circulating apparatus has an overflow port, wherein the overflow port is communicated with the working space, wherein the overflow port is located at an upper portion of the working tank, the overflow port defines the standard level of the plating solution in the working tank, and the plating solution exceeding the standard level flows out from the overflow port, so as to ensure that the plating solution in the working tank can be always maintained at the standard level.
It is another object of the present invention to provide a plating solution circulating apparatus and a plating solution filtering method, wherein the plating solution circulating apparatus includes a transition tank, wherein a solution accommodating space of the transition tank is communicated with the overflow port, the plating solution exceeding the standard level in the working space enters the transition tank from the overflow port, and the plating solution is secondarily filtered in the accommodating space of the transition tank.
Another objective of the present invention is to provide an electroplating solution circulating apparatus and an electroplating solution filtering method, wherein the electroplating solution circulating apparatus further includes a reservoir, an inlet and an outlet of the liquid outlet apparatus are respectively connected to the two filtering devices, and the electroplating solution entering the working space of the working tank from the reservoir and the electroplating solution flowing into the reservoir from the working space are both filtered, which is beneficial to ensure the purity of the electroplating solution contained in the reservoir.
Another object of the present invention is to provide a plating solution circulating apparatus and a plating solution filtering method, wherein the plating solution circulating apparatus further includes a purifying device, wherein the purifying device is connected to the reservoir device, wherein the purifying device purifies the plating solution contained in the reservoir device, further ensuring the purity of the plating solution contained in the reservoir device.
Another object of the present invention is to provide an electroplating solution circulating apparatus and an electroplating solution filtering method, wherein the electroplating solution contained in the reservoir apparatus is continuously pumped into the working space of the working tank, the electroplating solution in the working space flows into the reservoir apparatus, and the electroplating solution in the working tank is in a flowing state, so as to accelerate the movement speed of ions in the electroplating solution in the working tank, thereby reducing the concentration gradient of the electroplating solution in the working tank, further reducing the polarization of the electroplating solution, and accelerating the current efficiency and the electroplating efficiency.
According to one aspect of the present invention, there is provided a plating solution circulating apparatus adapted to deliver a plating solution, the plating solution circulating apparatus comprising:
the liquid storage device is provided with a liquid storage space, a liquid storage outlet and a liquid storage inlet which are communicated with the liquid storage space;
the working groove is provided with a working space, and a liquid inlet and a liquid outlet which are communicated with the working space;
at least one first filtering device, wherein the first filtering device is arranged between the liquid storage device and the working tank, and the first filtering device is communicated with the liquid storage outlet of the liquid storage device and the liquid inlet of the working tank; and
at least one second filtering device, wherein the second filtering device is arranged between the liquid storage device and the working tank, and the second filtering device is communicated with the liquid storage inlet of the liquid storage device and the liquid outlet of the working tank.
According to one embodiment of the invention, the working tank has an overflow, wherein the overflow is connected to the working space of the working tank, by means of which a standard liquid level is defined.
According to one embodiment of the present invention, the plating solution circulating means further includes a transition tank, wherein the transition tank has a liquid containing space, a transition inlet and a transition outlet, wherein the transition inlet and the transition outlet are communicated with the liquid containing space, and the overflow port of the working tank is communicated with the overflow port of the transition tank.
According to an embodiment of the present invention, the plating liquid circulating apparatus further comprises a liquid level detecting device, wherein the liquid level detecting device is provided in the liquid containing space of the transition tank, and the liquid level detecting device is communicably connected to the second filtering device.
According to one embodiment of the present invention, the plating solution circulating apparatus further includes a purge device, wherein the reservoir device has a purge outlet and a purge inlet, wherein the purge outlet and the purge inlet are communicated with the reservoir space of the reservoir device, and wherein the purge device is communicated with the purge outlet and the purge inlet of the reservoir device.
According to an embodiment of the present invention, the purge outlet is provided at an upper portion of the purge device, and the purge device draws out the plating liquid in the reservoir space of the reservoir device from below to above.
According to an embodiment of the invention, the purge outlet is arranged at the bottom of the purge device.
According to one embodiment of the invention, the purge inlet is arranged at the upper or bottom of the purge device.
According to one embodiment of the invention, the first filter device, the second filter device and the purification device are implemented as a filter.
According to one embodiment of the invention, the level detection means is implemented as a level gauge or a sensor.
According to another aspect of the present invention, there is provided a plating solution filtering method comprising the steps of:
(a) filtering an electroplating solution flowing into a working space of a working tank from a liquid storage device by using at least one first filtering device; and
(b) and filtering the electroplating solution flowing from the working space to a liquid storage space of the liquid storage device by at least one second filtering device.
According to one embodiment of the invention, in step (b), the plating solution in the working space of the working tank is maintained at a standard level.
According to an embodiment of the present invention, in the above method, the plating solution in the working space overflows from an overflow port of the working tank to a solution holding space of a transition tank after reaching the overflow port.
According to an embodiment of the present invention, in the above method, a liquid level detecting device detects a liquid level of the plating liquid in the liquid containing space of the transition tank, and the liquid level detecting device controls the second filtering device to deliver the plating liquid in the liquid containing space of the filtering tank to the liquid storing space of the liquid storing device according to the detection result.
According to an embodiment of the present invention, in the above method, the liquid level detection device controls the second filtering device to pump the plating solution in the solution containing space of the transition tank into the solution storage space of the solution storage device after detecting that the plating solution reaches the preset liquid level.
According to an embodiment of the present invention, in the above method, the liquid level detecting device controls the second filtering device to pump the plating solution in the liquid containing space of the transition tank into the liquid storing space of the liquid storing device after detecting that the plating solution enters the liquid containing space of the transition tank.
According to one embodiment of the present invention, the plating liquid filtering method further includes the step (c) of filtering the plating liquid in the reservoir space of the reservoir device by a purifying device connected to a purifying outlet and a purifying inlet of the reservoir device.
According to an embodiment of the present invention, in the above method, the purifying device pumps the plating solution in the reservoir space of the reservoir device from bottom to top, and pumps the plating solution into the reservoir space of the reservoir device from bottom to top after the filtering.
According to an embodiment of the present invention, in the above method, the purification device pumps the plating solution in the reservoir space of the reservoir device from bottom to top, and pumps the plating solution into the reservoir space of the reservoir device from top to bottom after the filtering.
According to an embodiment of the present invention, in the above method, the purifying device pumps the plating solution in the reservoir space of the reservoir device from the bottom of the reservoir space and pumps the plating solution into the reservoir space from the purifying inlet after the plating solution is filtered.
Drawings
FIG. 1 is a schematic diagram of a plating apparatus according to a preferred embodiment of the present invention.
FIG. 2 is a schematic view showing the use of the plating apparatus according to the above preferred embodiment of the present invention, illustrating that a plating liquid in a reservoir means is pumped into a working tank by a first filtering means.
FIG. 3 is a schematic view showing the application of the plating apparatus according to the above preferred embodiment of the present invention, after the plating liquid in the working tank reaches an overflow port, flows from the overflow port into a liquid holding space of a transition tank.
FIG. 4 is a schematic view showing the application of the plating apparatus according to the above preferred embodiment of the present invention, in which the liquid level detection means detects that the plating liquid in the liquid containing space of the transition tank reaches a predetermined level, and the detection means controls a second filtration means to pump the plating liquid in the liquid containing space into the liquid storage means.
FIG. 5 is a schematic view showing the use of the plating apparatus according to the above preferred embodiment of the present invention, showing a purification unit for filtering the plating liquid stored in the reservoir unit.
Detailed Description
The following description is provided to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Referring to fig. 1 to 5, a plating solution circulation device 100 according to a preferred embodiment of the present invention will be described in the following description, wherein the plating solution circulation device 100 filters a plating solution at least twice during the circulation of the plating solution, thereby ensuring the purity of the plating solution and avoiding affecting the quality and performance of a plating layer formed on a workpiece surface during plating.
Specifically, the electroplating cycle apparatus 100 further comprises a working tank 10, at least one first filter device 20, at least one second filter device 30 and a reservoir device 40, wherein the working tank 10 has a working space 101 and a liquid inlet 102 and a liquid outlet 103 which are communicated with the working space 101, and the liquid outlet device 40 has a reservoir space 401 and a reservoir inlet 402 and a reservoir outlet 403 which are communicated with the liquid outlet space. The first filter device 20 is disposed between the reservoir outlet 403 of the reservoir device 40 and the inlet 102 of the working tank 10, and the first filter device 20 is communicated with the reservoir outlet 403 of the reservoir device 40 and the inlet 102 of the working tank 10. The second filtering device 30 is disposed between the liquid inlet 402 of the liquid storage device 40 and the liquid outlet 103 of the working tank 10, and the second filtering device 30 is communicated with the liquid inlet 402 of the liquid storage device 40 and the liquid outlet 103 of the working tank 10.
Referring to FIG. 2, at least one of the first filter devices 20 pumps the plating solution in the reservoir space 401 of the reservoir device 40 into the working space 101 of the working tank 10, and the first filter device 20 filters the plating solution during the delivery of the plating solution. The filtered electroplating solution flows into the working space 101 from the liquid inlet 102 of the working tank 10, and the electroplating solution before entering the working space 101 is filtered at least once, so that the purity of the electroplating solution entering the working space 101 of the working tank 10 is guaranteed.
A plated metal electrically connected to an anode of a power source and a work electrically connected to a cathode of the power source are held in the working space 101 of the working tank 10, respectively, and the work and the plated metal are held in the plating solution. Under the action of the DC current, the positive and negative ions in the plating solution move regularly, a plating layer is formed on the surface of the workpiece gradually, and the plating metal is dissolved in the plating solution continuously to replenish the ions consumed in the plating solution, so that the plating metal connected to the anode of the power supply is transferred to the surface of the workpiece gradually.
It should be noted that, the specific implementation of the workpiece, the plating layer and the plating metal is not limited, the workpiece may be implemented as a metal such as iron, copper, silver and the like and a metal product thereof, and the plating metal may be implemented as a metal such as copper, silver, gold, nickel, chromium and the like, and a copper plating layer, a silver plating layer, a gold plating layer, a nickel plating layer, a chromium plating layer and the like are correspondingly formed.
Preferably, the first filtering device 20 pumps the electroplating solution in the storage space 401 of the storage device 40 into the working space 101 of the working tank 10 from a direction away from the workpiece, so as to prevent the electroplating solution entering the working space 101 from impacting the coating formed on the surface of the workpiece, thereby affecting the uniformity and quality of the coating formed on the surface of the workpiece. More preferably, the plating solution flows into the working space 101 of the working tank 10 from the outlet of the first transition device 20 along an arc direction in a direction away from the workpiece.
In this particular embodiment of the plating circulation apparatus 100 of the invention, the plating liquid in the working space 101 of the working tank 10 of the plating circulation apparatus 100 can be maintained at a standard level. On one hand, when the workpieces in the same batch are electroplated, the liquid level of each workpiece which can be immersed into the electroplating liquid is the same all the time, and uniformity of the coating formed on the workpieces in the same batch is facilitated. On the other hand, different batches of workpieces are also placed in the electroplating solution at the same standard liquid level, which is beneficial to ensuring the uniformity of the plating layers formed on the surfaces of the workpieces in different batches.
Referring to fig. 3, in particular, the working tank 10 further has an overflow port 104, wherein the overflow port 104 is communicated with the working space 101. The overflow port 104 is formed in the upper portion of the working tank 10, and the standard level of the plating solution in the working space 101 of the working tank 10 is defined by the height of the overflow port 104. When the plating solution in the working space 101 of the working tank 10 reaches the standard level, the plating solution flows out from the overflow port 104 to maintain the plating solution in the working tank 10 at the standard level. Further, the overflow port 104 can prevent the plating liquid in the working space 101 of the working vessel 10 from overflowing to contaminate the working environment.
Further, the plating circulation equipment 100 includes a transition tank 50, wherein the transition tank 50 has a liquid containing space 501 and a transition inlet 502 and a transition outlet 503 which are communicated with the liquid containing space 501, and wherein the overflow 104 is communicated with the liquid containing space 501 of the transition tank 50 and the working space 101 of the working tank 10. Once the plating liquid level in the working space 101 of the working tank 10 reaches the overflow 104, the plating liquid flows out from the overflow 104 and flows into the liquid holding space 501 of the transition tank 50.
The second filtering device 30 is disposed between the transition tank 50 and the liquid storage device 40, and the second filtering device 30 is communicated with the liquid containing space 501 of the transition tank 50 and the liquid outlet 402 of the liquid storage device 40. The plating liquid flowing into the liquid containing space 501 of the transition tank 50 from the overflow port 104 passes through the second filter device 30 and then enters the liquid storage device 40. Specifically, the second filter device 30 pumps the plating solution in the solution containing space 501 of the transition tank 50 into the solution storage space 401 of the solution storage device 40, and the second filter device 30 filters the plating solution during the process of delivering the plating solution, so as to ensure the purity of the plating solution flowing into the solution storage device 40 and avoid contamination of the plating solution in the solution storage device 40. So, by first filter equipment 20 with second filter equipment 30 is right the plating solution carries out twice at least and filters, has improved the purity degree of plating solution is favorable to the guarantee the quality of cladding material.
Preferably, the first filter device 20 continuously pumps the plating solution in the reservoir space 401 of the reservoir device 40 into the working space 101 of the working tank 10, and the plating solution in the working space 101 of the working tank 10 continuously flows from the overflow port 104 into the solution space 501 of the transition tank 50, so that the plating solution in the working space 101 is always in motion. On the other hand, the continuous inflow of the plating liquid can reduce the concentration gradient of the plating liquid in the work space 101, thereby reducing the plan of the plating liquid, and further improving the current efficiency and the plating efficiency. On the other hand, the electroplating solution is in a motion state continuously, which is beneficial to preventing impurities in the electroplating solution from depositing at the bottom of the working tank 10, and further improves the filtering effect of the electroplating solution circulating device 100.
Referring to FIG. 4, in this particular embodiment of the present invention, the plating liquid circulating apparatus 100 further comprises a liquid level detecting device 60, wherein the liquid level detecting device 60 is disposed in the passing space 501 of the transition tank 50, and the liquid level detecting device 60 is communicably connected to the second filtering device 30. The liquid level detection device 60 detects the electroplating solution in the transition space 501 of the transition groove 50, when the liquid level of the electroplating solution in the transition space 501 reaches a preset liquid level, the liquid level detection device 60 controls the second filtering device 30 to pump the electroplating solution in the transition space 501 into the liquid storage device 40, and meanwhile, the second filtering device 30 filters the conveyed electroplating solution. That is, the second filtering means 30 may be operated only when the plating solution stored in the transition space 501 of the transition tank 50 reaches a certain level, and the second filtering means 30 may be operated in a standby state when the plating solution stored in the transition space 501 of the transition tank 50 does not reach the preset level. In this way, not only can the efficiency of delivering the plating solution be improved, but also the saving of electric energy is facilitated.
Alternatively, in another specific example of the present invention, the second filtering device 30 may also be implemented to continuously work, once the plating solution in the working space 101 of the working tank 10 overflows to the transition space 501 of the transition tank 50, the second filtering device 30 filters the plating solution in time and pumps the plating solution into the storage device 40, so as to prevent the plating solution from staying in the transition space 501 of the transition tank 50 for too long to generate precipitation at the bottom of the transition tank 50. It should be understood by those skilled in the art that the embodiment of the second filtering device 30 is only for illustrative purposes and should not be construed as limiting the scope and content of the plating solution circulating device 100 according to the present invention.
It should be noted that the specific implementation of the first filtering device 20, the second filtering device 30 and the liquid level detecting device 60 is not limited, for example, but not limited to, the first filtering device 20 and the second filtering device 30 are implemented as filters, and the liquid level detecting device 60 is implemented as a liquid level meter or a sensor. Although in this particular embodiment of the present invention, the first filter device 20 and the second filter device 30 are each implemented as one, in other embodiments of the present invention, the second filter device 20 and the second filter device 30 may be implemented as two or more than two. That is, the plating solution in the reservoir unit 40 is filtered by at least two first filter units 20 and then flows into the working space 101 of the working tank 10, and the plating solution in the working space 101 of the working tank 10 is filtered by at least two second filter units and then flows into the reservoir unit 40. The first filter device 20 and the second filter device 30 are added to improve the filtering efficiency of the plating solution circulation device 100, thereby further improving the purity of the plating solution.
Referring to FIG. 5, in this particular embodiment of the plating solution circulating apparatus 100 of the present invention, the plating solution circulating apparatus 100 further includes a purifying device 70, wherein the purifying device 70 is provided to the reservoir device 40, wherein the purifying device 70 filters and purifies the plating solution in the reservoir space 401 of the reservoir device 40, further improving the purity of the plating solution in the reservoir space 401 of the reservoir device 40.
Specifically, the reservoir 40 further has a purge outlet 404 and a purge inlet 405, wherein the purge inlet 404 and the purge outlet 405 are in communication with the reservoir 401. The purge device 70 is disposed between the purge outlet 404 and the purge inlet 405 of the reservoir 40, and the purge device 70 is in communication with the purge outlet 404 and the purge inlet 405 of the reservoir 40. The plating solution in the reservoir space 401 of the reservoir device 40 is pumped out through the purge outlet 404 by the purge device 70, and the plating solution is pumped into the reservoir space 401 through the purge inlet 405 by the purge device 70 after passing through the purge device 70. The purifying device 70 filters the plating solution during the process of delivering the plating solution, so as to ensure the purity of the plating solution in the storage space 401 of the storage device 40.
It should be noted that the purifying device 70 continuously pumps the plating solution in the reservoir space 401 of the reservoir device 40 out of the purifying outlet 404 and then into the purifying inlet 405, so that the plating solution in the reservoir space 401 is always in a flowing state, which is beneficial to preventing impurities in the plating solution from precipitating during the static process of the plating solution, and further improving the filtering effect of the plating solution circulating device.
In this embodiment of the present invention, the purge outlet 404 and the purge inlet 405 are disposed at the upper portion of the reservoir 40, and the purge device 70 is configured to draw the plating solution from the reservoir 401 of the reservoir 40 from the bottom up, so as to facilitate drawing out impurities deposited at the bottom of the reservoir 401, and then pump the filtered plating solution from the top down into the reservoir 401, thereby improving the purity of the plating solution in the reservoir 401.
Preferably, the purge outlet 404 is disposed at an upper portion of the reservoir device 40, the purge inlet 405 is disposed at a bottom portion of the reservoir device, and the purge device 70 pumps the plating solution in the reservoir space 401 of the reservoir device 40 from bottom to top, and then pumps the filtered plating solution into the reservoir space 401 from the bottom portion of the reservoir device 40, so that the plating solution is in a churning state, which is not only beneficial to preventing impurities in the plating solution from precipitating, but also reduces the concentration gradient of the plating solution.
Preferably, the purge outlet 404 is disposed at the bottom of the reservoir 40 and the purge inlet 405 is disposed at the top of the reservoir. Thus, the electroplating solution at the bottom of the storage space 401 of the storage device 40 is pumped away by the purification device 70 and then pumped into the storage space 40 from the upper part of the storage device 40, so that the electroplating solution in the storage space 401 of the storage device 40 continuously flows from top to bottom, the concentration gradient of the electroplating solution in the storage space 401 is favorably reduced, the uniformity of the electroplating solution is improved, and the current efficiency and the electroplating efficiency in the subsequent electroplating process are favorably ensured.
It should be noted that the embodiments of the purge outlet 404 and the purge inlet 405 are not limited, nor are the embodiments of the purge apparatus 70 limited, and that the descriptions in the specification and drawings are provided as examples only and should not be construed as limiting the scope and content of the plating solution circulating apparatus 100 of the present invention.
According to another aspect of the present invention, there is further provided a method for filtering a plating solution, wherein the method for filtering a plating solution comprises the steps of:
(a) filtering the plating solution flowing from the reservoir device 40 into the working space 101 of the working tank 10 by at least one first filtering device 20; and
(b) the plating liquid flowing from the working space 101 of the working tank 10 to the reservoir space 401 of the reservoir device 40 is filtered by at least one second filter device 30.
Specifically, in step (a), the first filtering device 20 continuously pumps the plating solution in the reservoir space 401 of the reservoir device 40 into the working space 101 of the working tank 10, and the flowing plating solution facilitates reducing the concentration gradient. Further, the first and second filtering devices 20 and 30 filter the plating solution during transportation of the plating solution.
In this particular embodiment of the invention, in step (b), the plating liquid in the working space 101 of the working tank 10 is maintained at the standard level. Specifically, in the above method, the plating liquid in the working space 101 reaches the overflow port 104 of the working tank 10, and then overflows from the overflow port 104 to the liquid holding space 501 of the transition tank 50.
Further, in the above method, the liquid level of the plating solution in the solution containing space 501 of the transition tank 50 is detected by the liquid level detecting device 60, and the liquid level detecting device 60 controls the second filtering device 30 to pump the plating solution in the solution containing space 501 of the transition tank 50 into the solution storage space 401 of the solution storage device 40 according to the detection result.
Preferably, after the liquid level detection device 60 detects that the plating solution reaches the preset liquid level, the liquid level detection device 60 controls the second filtering device 30 to pump the plating solution in the solution containing space 501 of the transition tank 50 into the solution storage space 401 of the solution storage device 40. Alternatively, once the liquid level detection device 60 detects the presence of the plating liquid in the liquid containing space 501 of the transition tank 50, the liquid level detection device 60 controls the second filter device 30 to pump the plating liquid in the liquid containing space 501 of the transition tank 50 into the liquid storage space 401 of the liquid storage device 40.
In one embodiment of the present invention, the plating solution filtering method further includes the step (c) of filtering the plating solution in the reservoir space 401 of the reservoir device 40 by the purge device 70 being communicated between the purge outlet 404 and the purge inlet 405 of the reservoir device 40. It is worth mentioning that the steps (a), (b) and (c) have no sequential limitation, and the steps (a), (b) and (c) can be performed simultaneously.
Specifically, the purification device 70 pumps the plating solution from the reservoir space 401 of the reservoir device 40 from the bottom up, and pumps the plating solution from the bottom up into the reservoir space 401 after the plating solution is filtered. Alternatively, the purification device 70 pumps the plating solution in the reservoir space 401 of the reservoir device 40 from bottom to top and pumps the plating solution into the reservoir space 401 from top to bottom after the plating solution is filtered. Alternatively, the purging device 70 draws the plating solution from the reservoir space 401 of the reservoir device 40 from the bottom and pumps the plating solution into the reservoir space 401 after filtration.
It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments that are easy to realize in accordance with the disclosure of the invention, but that are not explicitly indicated in the drawings.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (20)
1. An electroplating solution circulating device, suitable for conveying an electroplating solution, characterized in that the electroplating solution circulating device comprises:
the liquid storage device is provided with a liquid storage space, a liquid storage outlet and a liquid storage inlet which are communicated with the liquid storage space;
the working groove is provided with a working space, and a liquid inlet and a liquid outlet which are communicated with the working space;
at least one first filtering device, wherein the first filtering device is communicated with the liquid storage outlet of the liquid storage device and the liquid inlet of the working tank; and
at least one second filtering device, wherein the second filtering device is communicated with the liquid storage inlet of the liquid storage device and the liquid outlet of the working tank.
2. The plating solution circulating apparatus according to claim 1, wherein the working tank has an overflow port, wherein the overflow port is connected to a working space of the working tank, and a standard level is defined by the overflow port.
3. The plating solution circulating apparatus as claimed in claim 2, further comprising a transition tank, wherein said transition tank has a liquid holding space, a transition inlet and a transition outlet, wherein said transition inlet and said transition outlet are connected to said liquid holding space, and said overflow port of said working tank is connected to said overflow port of said transition tank.
4. The plating liquid circulating apparatus as claimed in claim 3, further comprising a liquid level detecting device, wherein said liquid level detecting device is provided in said liquid holding space of said transition tank, said liquid level detecting device being communicably connected to said second filtering device.
5. The plating solution circulating device as claimed in claim 4, further comprising a purge device, wherein said reservoir device has a purge outlet and a purge inlet, wherein said purge outlet and said purge inlet are in communication with said reservoir space of said reservoir device, and wherein said purge device is in communication with said purge outlet and said purge inlet of said reservoir device.
6. The plating liquid circulating apparatus according to claim 5, wherein the purge outlet is provided at an upper portion of the purge device, and the purge device draws out the plating liquid in the reservoir space of the reservoir device from below.
7. The plating solution circulating apparatus according to claim 5, wherein the purge outlet is provided at a bottom of the purge apparatus.
8. The plating solution circulating apparatus according to claim 5, wherein the purge inlet is provided at an upper portion or a bottom portion of the purge device.
9. The plating solution circulating apparatus as claimed in claim 5, wherein said first filtering means, said second filtering means and said purifying means are implemented as a filter.
10. The plating solution circulating apparatus as claimed in claim 4, wherein said liquid level detecting means is implemented as a liquid level meter or a sensor.
11. A plating solution filtering method, characterized by comprising the steps of:
(a) filtering an electroplating solution flowing into a working space of a working tank from a liquid storage device by using at least one first filtering device; and
(b) and filtering the electroplating solution flowing from the working space to a liquid storage space of the liquid storage device by at least one second filtering device.
12. The plating solution filtering method as claimed in claim 11, wherein in said step (b), said plating solution in said work space of said work tank is maintained at a standard level.
13. The plating solution filtering method as set forth in claim 12, wherein in said method, the plating solution in said working space overflows from an overflow port of said working tank to a solution holding space of a transition tank after reaching the overflow port.
14. The plating solution filtering method as claimed in claim 13, wherein in said method, a level of the plating solution in said solution containing space of said transition tank is detected by a level detecting means, and said level detecting means controls said second filtering means to deliver the plating solution in said solution containing space of said filter tank to said solution storing space of said solution storing means in accordance with the detection result.
15. The plating solution filtering method as claimed in claim 14, wherein in said method, said liquid level detecting device controls said second filtering device to pump the plating solution in said solution containing space of said transition tank into said solution storing space of said solution storing device after said liquid level detecting device detects that the plating solution reaches said predetermined liquid level.
16. The plating solution filtering method as set forth in claim 14, wherein in the above method, the liquid level detecting device controls the second filtering device to pump the plating solution in the liquid accommodating space of the transition tank into the liquid storage space of the liquid storage device after detecting that the plating solution enters the liquid accommodating space of the transition tank.
17. The plating solution filtering method as claimed in claim 14, further comprising the step (c) of filtering the plating solution in the reservoir space of the reservoir device by a purifying device connected to a purifying outlet and a purifying inlet of the reservoir device.
18. The plating solution filtering method as set forth in claim 17, wherein in the above method, the purifying device pumps out the plating solution in the reservoir space of the reservoir device from bottom to top, and pumps the plating solution into the reservoir space of the reservoir device from bottom to top after the filtering.
19. The plating solution filtering method as set forth in claim 17, wherein in the above method, the purifying device pumps the plating solution in the reservoir space of the reservoir device from bottom to top and pumps the plating solution into the reservoir space of the reservoir device from top to bottom after the filtering.
20. The plating solution filtering method as claimed in claim 17, wherein in said method, said purifying device pumps the plating solution in said reservoir space of said reservoir device from a bottom of said reservoir space and pumps the plating solution into said reservoir space from said purifying inlet after filtering.
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Cited By (1)
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