JP2636227B2 - Electroplating method - Google Patents
Electroplating methodInfo
- Publication number
- JP2636227B2 JP2636227B2 JP62026560A JP2656087A JP2636227B2 JP 2636227 B2 JP2636227 B2 JP 2636227B2 JP 62026560 A JP62026560 A JP 62026560A JP 2656087 A JP2656087 A JP 2656087A JP 2636227 B2 JP2636227 B2 JP 2636227B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solution
- tank
- plating solution
- electroplating method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えば半導体装置製造工程で使用して好適
な電気めっき方法に関する。Description: TECHNICAL FIELD The present invention relates to an electroplating method suitable for use in, for example, a semiconductor device manufacturing process.
従来、この種の電気めっき方法においては、めっき品
質を改善するために、めっき溶液に対し次に示す手段が
施されている。すなわち、めっき溶液の濃度や温度を変
更すること、めっき溶液中に添加剤を混入すること、あ
るいはめっき溶液を攪拌すること等である。Conventionally, in this type of electroplating method, the following means is applied to a plating solution in order to improve plating quality. That is, changing the concentration or temperature of the plating solution, mixing an additive into the plating solution, or stirring the plating solution.
ところで、このような電気めっき方法においては、め
っき処理の高速化を図るために、電流密度（単位時間当
たりのめっき量を決定する因子）を高くすることが知ら
れている。また、特開昭54−115645号公報で提案されて
るように多孔体を通して圧縮空気を圧送して液中に気泡
を発生する方法や、特開昭53−99046号公報に開示され
てるように、微小な通気孔を有する部材に圧縮空気を通
して気泡を発生させる方法が知られている。By the way, in such an electroplating method, it is known that a current density (a factor which determines a plating amount per unit time) is increased in order to speed up a plating process. Further, as proposed in Japanese Patent Application Laid-Open No. 54-115645, a method of generating air bubbles in a liquid by pumping compressed air through a porous body, and as disclosed in Japanese Patent Application Laid-Open No. 53-99046, There is known a method of generating air bubbles by passing compressed air through a member having minute air holes.
ところが、従来の電気めっき方法においては、電流密
度を所定の電流密度（1.5A/cm2）より大きくすると、め
っきする素材にひげ状のめっき材料が異常に多く析出し
ていた。この結果、外観が悪くなるだけでなく、特に半
導体材料にめっき処理を施す場合にはその析出物によっ
てリード間が短絡することがあり、良好なめっき処理を
施すことができないという問題があった。また、気泡を
発生させる方法では、多孔体や圧縮空気源を必要とし、
装置が複雑になるという欠点があった。However, in the conventional electroplating method, when the current density is higher than a predetermined current density (1.5 A / cm2), an excessively large number of whisker-like plating materials are deposited on the material to be plated. As a result, not only the external appearance is deteriorated, but also particularly when the semiconductor material is plated, the precipitates may cause a short circuit between the leads, and there is a problem that a satisfactory plating process cannot be performed. In addition, the method of generating bubbles requires a porous body and a compressed air source,
There was a disadvantage that the device became complicated.
本発明はこのような事情に鑑みなされたもので、めっ
き処理の高速化を図ることができるばかりか、良好なめ
っき処理を施すことができる電気めっき方法を提供する
ものである。The present invention has been made in view of such circumstances, and provides an electroplating method capable of performing not only a high-speed plating process but also a favorable plating process.
本発明に係る電気めっき方法は、めっき溶液中に大気
を溶解させる手法として、めっき槽の溶液を溶解液槽の
液面上方より大気を介して流下させるものである。In the electroplating method according to the present invention, as a method of dissolving the air in the plating solution, the solution in the plating tank is caused to flow from above the liquid level of the solution tank through the atmosphere.
本発明においては、めっき槽から導びかれた溶液を溶
解液槽に流下させることにより大気が溶液中に溶解され
る。In the present invention, the atmosphere is dissolved in the solution by flowing the solution guided from the plating tank into the solution tank.
図は本発明に係る電気めっき方法に用いる電気めっき
装置の概略を示す図である。同図において、符号１で示
すものは電解液としてのめっき溶液（900程度）を貯
溜可能なめっき槽、２はこのめっき槽１の下方に設けら
れた大気溶解槽、３および４はこの大気溶解槽２と前記
めっき槽１とを接続するパイプ、５はこれら両パイプ3,
4のうち前記めっき槽１の上方で開口するパイプ４中に
設けられたポンプである。また、この電気めっき装置に
は、この他図示しないが動力線の電圧を下げる変圧器、
交流を整流する装置およびめっき溶液の温度を一定範囲
に保つ装置等が備えられている。なお、図中矢印はめっ
き溶液が流動する方向を示し、符号Ａはめっき溶液面を
示す。FIG. 1 is a view schematically showing an electroplating apparatus used for an electroplating method according to the present invention. In FIG. 1, reference numeral 1 denotes a plating tank capable of storing a plating solution (about 900) as an electrolytic solution, 2 denotes an atmospheric dissolving tank provided below the plating tank 1, and 3 and 4 denote atmospheric dissolving tanks. The pipes 5 connecting the tank 2 and the plating tank 1 are both pipes 3,
4 is a pump provided in a pipe 4 opened above the plating tank 1. The electroplating apparatus also includes a transformer (not shown) for lowering the voltage of the power line,
A device for rectifying the alternating current, a device for keeping the temperature of the plating solution within a certain range, and the like are provided. The arrow in the figure indicates the direction in which the plating solution flows, and the symbol A indicates the plating solution surface.
以下に、このように構成された電気めっき装置を用い
る電気めっき方法について説明する。Hereinafter, an electroplating method using the electroplating apparatus configured as described above will be described.
先ず、めっきを施すためのめっき槽１から約80cm下方
の大気溶解槽２に約40／分のめっき溶液（ほうふっ化
浴）を流下させることにより、めっき溶液中に大気を自
然溶解させる。このとき、めっき溶液は殆ど透明で気泡
による濁りはなく、また大気の溶解量はppmオーダであ
る。次に、この溶液によってめっき素材（図示せず）に
電流密度約1.5A/cm2でめっき処理を施す。First, by flowing a plating solution (a fluorinated bath) of about 40 / min into an atmosphere dissolving tank 2 about 80 cm below the plating tank 1 for plating, the atmosphere is naturally dissolved in the plating solution. At this time, the plating solution is almost transparent, there is no turbidity due to bubbles, and the dissolved amount in the atmosphere is on the order of ppm. Next, a plating process is performed on the plating material (not shown) at a current density of about 1.5 A / cm 2 using this solution.
このようにして、めっき素材（図示せず）に対しめっ
きすることができる。In this way, plating can be performed on a plating material (not shown).
本発明による電気めっき方法を用いれば、電流密度を
所定の電流密度（1.5A/cm2）より大きくしても、めっき
する素材に発生するひげ状のめっき材料の析出を抑制で
きることが多くの実験によって立証されている。また、
特開昭54−115645号公報や特開昭53−99046号公報に開
示されているような気泡を発生させる方法では、めっき
液中の気泡やめっき液表面の気泡が、被めっき物を取り
出すときに被めっき物表面に付着して、しみ状の表面む
らが発生するのに対して、本願発明ではそのようなこと
がない。さらに、同じく従来の気泡を発生させる方法で
は、めっき液の表面からの水の蒸発が多く、めっき液の
管理に手間が多くかかるのに対して、本願発明ではその
ようなことがない。Many experiments show that the use of the electroplating method according to the present invention can suppress the whisker-like plating material from being deposited on the material to be plated even when the current density is higher than a predetermined current density (1.5 A / cm 2 ). Proven by Also,
In the method of generating bubbles as disclosed in JP-A-54-115645 and JP-A-53-99046, bubbles in the plating solution and bubbles on the surface of the plating solution are removed when the object to be plated is taken out. However, this does not occur in the present invention, whereas spot-like surface unevenness is caused to adhere to the surface of the object to be plated. Furthermore, while the conventional method of generating air bubbles causes much evaporation of water from the surface of the plating solution and takes a lot of trouble to manage the plating solution, this is not the case with the present invention.
また、本実施例においては、めっき溶液中に大気を溶
解させた後にめっき処理を施す例を示したが、本発明は
これに限定されるものではなく、大気を溶解させながら
めっき処理を施しても実施例と同様の効果を奏する。Further, in this embodiment, an example in which the plating treatment is performed after dissolving the air in the plating solution has been described, but the present invention is not limited to this, and the plating treatment is performed while dissolving the air. Also has the same effect as the embodiment.
以上説明したように本発明によれば、めっき溶液中に
大気を溶解させながら、または溶解させた後、この溶液
によってめっき処理を施すことにより、電流密度を高く
することができると共に、ひげ状の析出物の発生を抑制
することができ、めっき処理の高速化を図ることができ
るばかりか、しみのない良好なめっき処理を施すことが
できる。また、めっき液の水の蒸発が少なく、めっき液
の管理の手間を少なくすることができる。さらに、めっ
き液を循環させるポンプと溶解液を受ける槽を用意する
だけで、めっき液中に空気を溶解させることができるか
ら、装置が簡単に構成できる。As described above, according to the present invention, while dissolving the air in the plating solution, or after dissolving it, plating is performed with this solution, so that the current density can be increased and the beard-like shape can be obtained. Not only can the generation of precipitates be suppressed and the plating process can be speeded up, but also a good plating process without stains can be performed. In addition, the evaporation of water in the plating solution is small, and the trouble of managing the plating solution can be reduced. Furthermore, air can be dissolved in the plating solution simply by providing a pump for circulating the plating solution and a tank for receiving the solution, so that the apparatus can be easily configured.
図は本発明に係る電気めっき方法に用いる電気めっき装
置の概略を示す図である。 １……めっき槽、２……大気溶解槽、3,4……パイプ、
５……ポンプ。FIG. 1 is a view schematically showing an electroplating apparatus used for an electroplating method according to the present invention. 1 ... Plating tank, 2 ... Air melting tank, 3,4 ... Pipe,
5. Pump.
Claims (1)
たは溶解させた後、この溶液によってめっき処理を施す
電気めっき方法において、 めっき槽と大気溶解槽とをポンプを介して連結してめっ
き溶液を循環させるとともに、めっき槽からの溶液を大
気溶解槽の液面の上方より流下させることを特徴とする
電気めっき方法。1. An electroplating method in which an atmosphere is dissolved in a plating solution or after dissolving the atmosphere in the plating solution, the plating solution is plated using the plating solution by connecting a plating tank and an atmosphere dissolving tank via a pump. And circulating the solution from the plating tank, and allowing the solution from the plating tank to flow from above the liquid level in the atmospheric dissolving tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62026560A JP2636227B2 (en) | 1987-02-06 | 1987-02-06 | Electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62026560A JP2636227B2 (en) | 1987-02-06 | 1987-02-06 | Electroplating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63195289A JPS63195289A (en) | 1988-08-12 |
| JP2636227B2 true JP2636227B2 (en) | 1997-07-30 |
Family
ID=12196917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62026560A Expired - Lifetime JP2636227B2 (en) | 1987-02-06 | 1987-02-06 | Electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2636227B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137117B2 (en) * | 1972-04-26 | 1976-10-13 | ||
| JPS5399046A (en) * | 1977-02-12 | 1978-08-30 | Ngk Insulators Ltd | Method of making thickness of metal film precipitating at cathode uniform in electroplating |
| JPS54115645A (en) * | 1978-02-28 | 1979-09-08 | Ngk Insulators Ltd | Electrochemical treatment |
-
1987
- 1987-02-06 JP JP62026560A patent/JP2636227B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63195289A (en) | 1988-08-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| EXPY | Cancellation because of completion of term |