JPH10135396A - Surface mounting electronic part - Google Patents
Surface mounting electronic partInfo
- Publication number
- JPH10135396A JPH10135396A JP8285473A JP28547396A JPH10135396A JP H10135396 A JPH10135396 A JP H10135396A JP 8285473 A JP8285473 A JP 8285473A JP 28547396 A JP28547396 A JP 28547396A JP H10135396 A JPH10135396 A JP H10135396A
- Authority
- JP
- Japan
- Prior art keywords
- land
- lead
- electronic component
- fixed
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は表面実装用電子部品
に関し、とくにプリント基板またはセラミック基板等電
気配線基板上に高密度で実装される表面実装用電子部品
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component for surface mounting, and more particularly to an electronic component for surface mounting mounted on an electric wiring board such as a printed circuit board or a ceramic substrate at a high density.
【０００２】[0002]
【従来の技術】近年、電子装置の小型化に伴い、電子部
品の高密度実装化およびゲートアレイ等のピンピッチの
狭小化がなされ、ハンダによるブリッジが大きな問題と
なってきている。2. Description of the Related Art In recent years, with the miniaturization of electronic devices, high-density mounting of electronic components and narrowing of a pin pitch of a gate array and the like have been performed, and bridging by solder has become a serious problem.
【０００３】また、チップ抵抗やＩＣなどをプリント基
板等電気配線基板に固定するランドの大きさは、通常、
チップ抵抗やＩＣピンの幅より大きく設計されている
為、ランドピッチの狭小化およびＩＣピンピッチの狭小
化にも限界があった。The size of a land for fixing a chip resistor or an IC to an electric wiring board such as a printed board is usually
Since it is designed to be larger than the chip resistor and the width of the IC pin, there is a limit in narrowing the land pitch and narrowing the IC pin pitch.
【０００４】つまり、従来の表面実装用電子部品である
特開昭６３−２５５９５０号公報の「電子部品」および
特開平２−５０４６９号公報の「平面実装用電子部品」
では、図１１の斜視図および図１２の断面図に示すよう
に、部品パッケージ６から側面に突出している複数のリ
ード端子６１は、その幅広面がランド７６に対して垂直
になるように角度９０度だけ捻って成形し、ランド７６
とリード端子６１とをハンダ８にて接着する形状のもの
が提案されていた。[0004] That is, "electronic components" of Japanese Patent Application Laid-Open No. 63-255950 and "electronic components for planar mounting" of Japanese Patent Application Laid-Open No. 2-50469, which are conventional surface mount electronic components.
Then, as shown in the perspective view of FIG. 11 and the cross-sectional view of FIG. 12, the plurality of lead terminals 61 projecting from the component package 6 to the side face have an angle 90 so that the wide surface is perpendicular to the land 76. Twist only to form and land 76
And a lead terminal 61 have been proposed to be bonded by solder 8.
【０００５】[0005]
【発明が解決しようとする課題】第１の問題点は、これ
ら従来の表面実装用電子部品においては、図１２に示す
ようにランド７６の幅をリード端子６１の幅より広くし
なければ、図１３に示すようにランド７６とリード端子
６１とのハンダ８を介して接触する面積が極端に小さく
なるので接触強度が弱くなり、この接触強度を強くする
為には図１２に示すようにランド７６の幅をリード端子
６１の幅よりも広くしなければならなかった。このた
め、ハンド接着時にハンダ８によるブリッジが発生する
恐れがあった。A first problem with these conventional surface mount electronic components is that if the width of the land 76 is not made wider than the width of the lead terminal 61 as shown in FIG. As shown in FIG. 13, the contact area between the land 76 and the lead terminal 61 via the solder 8 becomes extremely small, so that the contact strength is weakened. In order to increase the contact strength, as shown in FIG. Must be made wider than the width of the lead terminal 61. For this reason, there is a possibility that a bridge may be generated by the solder 8 during hand bonding.
【０００６】その理由は、リード端子６１の底面がラン
ド７６に対して、平行であったことによる。The reason is that the bottom surface of the lead terminal 61 is parallel to the land 76.
【０００７】[0007]
【課題を解決するための手段】本発明による表面実装用
電子部品は、表面実装用電子部品のパッケージから側面
方向に突出するリードの先端部を電気配線基板上に一体
化して配設されるランドにハンダにより接着固定する前
記表面実装用電子部品において、前記リードを前記ラン
ドに接着固定する際に、前記リード先端部の前記ランド
と対向する底面を前記ランドの面と平行にならないよう
に形成する。According to the present invention, there is provided a surface-mounting electronic component having a land formed by integrating a tip of a lead projecting laterally from a package of the surface-mounting electronic component onto an electric wiring board. In the surface-mounting electronic component that is bonded and fixed by soldering, when the lead is bonded and fixed to the land, a bottom surface of the tip of the lead facing the land is formed so as not to be parallel to the surface of the land. .
【０００８】本発明による表面実装用電子部品は、前記
ランドに接着固定される前記リード先端部が略立方体柱
状あるいは略直方体柱状でその断面形状が略正方形ある
いは略長方形であるように形成し、かつ前記リード先端
部を前記パッケージから突出方向の軸に対して略４５度
前後捻り変形させて前記略立方体柱状あるいは前記略直
方体柱状の１頂点角部が前記ランド面上に略当接するよ
うにして前記ランドに接着固定するようにした。In the electronic component for surface mounting according to the present invention, the tip of the lead bonded and fixed to the land is formed in a substantially cubic column or a substantially rectangular column, and the cross-sectional shape thereof is substantially a square or a rectangle. The tip of the lead is twisted and deformed approximately 45 degrees with respect to the axis in the protruding direction from the package so that one vertex corner of the substantially cubic column or the substantially rectangular column substantially abuts on the land surface. It was made to adhere and fix to the land.
【０００９】本発明による表面実装用電子部品は、前記
ランドに接着固定される前記リード先端部が略円柱状で
その断面形状が略円形状であるように形成し、かつ前記
リード先端部をその円柱面が前記ランド面上に略当接す
るようにして前記ランドに接着固定するようにした。In the electronic component for surface mounting according to the present invention, the tip of the lead, which is bonded and fixed to the land, is formed to have a substantially cylindrical shape and a substantially circular cross section, and the tip of the lead is formed to have a substantially circular shape. The cylindrical surface was substantially in contact with the land surface, and was adhered and fixed to the land.
【００１０】本発明による表面実装用電子部品は、前記
ランドに接着固定される前記リード先端部が略三角柱状
でその断面形状が略三角形であるように形成し、かつ前
記略三角柱状の１頂点角部が前記ランド面上に略当接す
るようにして前記ランド上に接着固定するようにした。[0010] In the electronic component for surface mounting according to the present invention, the tip of the lead adhered and fixed to the land is formed in a substantially triangular prism shape and the cross-sectional shape thereof is substantially triangular. The corner portion was substantially in contact with the land surface and was adhered and fixed on the land.
【００１１】本発明による表面実装用電子部品は、前記
ランドに接着固定される前記リード先端が略立方体柱状
あるいは略直方体柱状でその断面形状が略正方形あるい
は略長方形であるように形成されたリードの柱状方向１
端面側をさらに略三角柱状に抉り取って形成したリード
のその抉り取った両端凸部が前記ランド面上に略当接す
るようにして前記ランドに接着固定するようにした。[0011] In the electronic component for surface mounting according to the present invention, the tip of the lead, which is bonded and fixed to the land, may have a substantially cubic column shape or a substantially rectangular column shape, and the cross-sectional shape may be substantially square or substantially rectangular. Pillar direction 1
The lead formed by further cutting the end face side into a substantially triangular prism shape was bonded and fixed to the land such that the cut-out both end convex portions substantially contact the land surface.
【００１２】本発明による表面実装用電子部品は、前記
ランドに接着固定される前記リード先端部が略立方体柱
状あるいは略直方体柱状でその断面形状が略正方形ある
いは略長方形であるように形成されたリードの柱状方向
１端面側をさらに略半円柱状に抉り取って形成したリー
ドのその抉り取った両端凸部が前記ランド面上に略当接
するようにして前記ランドに接着固定するようにした。In the electronic component for surface mounting according to the present invention, the lead is preferably formed such that the tip of the lead adhered and fixed to the land is substantially a cubic column or a substantially rectangular column, and the cross-sectional shape is substantially a square or a rectangle. The lead formed in the columnar direction at one end face side was further cut out into a substantially semi-cylindrical shape, and the cut-out both-ends of the lead were adhered and fixed to the land such that the cut-out both end projections substantially contact the land surface.
【００１３】[0013]
【発明の実施の形態】次に、本発明について図面を参照
して説明する。Next, the present invention will be described with reference to the drawings.
【００１４】図１は本発明の第１の実施例を示す表面実
装用電子部品の斜視図を示す。この図１において、部品
パッケージ１の側面から突出したリード端子１１の断面
形状を四角形にし、かつその突出方向を軸にほぼ４５度
前後捻り変形させている。このため、図２の断面図に示
すように電気配線基板７上に一体化されているランド７
１の面とリード端子１１の底面とは平行でないので、ラ
ンド７１の幅をリード端子１１の幅と同等かもしくは狭
くできる。従ってハンダ８によるブリッジを大幅に低減
できる。また、ランドピッチの狭小化および、リード端
子１１間ピッチの狭小化を実現することができ、電子装
置の小型化に寄与できる。さらに、リード端子７１に対
してハンダ８の接する面積が大きくなり、かつリード端
子１１とランド７１との間のハンダ量も多くなるので接
着強度も大きくなる。FIG. 1 is a perspective view of an electronic component for surface mounting according to a first embodiment of the present invention. In FIG. 1, the cross-sectional shape of the lead terminal 11 protruding from the side surface of the component package 1 is quadrangular, and the lead terminal 11 is twisted and deformed approximately 45 degrees around the protruding direction as an axis. Therefore, as shown in the cross-sectional view of FIG.
1 is not parallel to the bottom surface of the lead terminal 11, the width of the land 71 can be equal to or smaller than the width of the lead terminal 11. Therefore, the bridge due to the solder 8 can be greatly reduced. Further, the land pitch and the pitch between the lead terminals 11 can be reduced, which contributes to the miniaturization of the electronic device. Further, the area where the solder 8 contacts the lead terminal 71 increases, and the amount of solder between the lead terminal 11 and the land 71 also increases, so that the bonding strength also increases.
【００１５】次に、図３および図４と図５および図６は
各各本発明の第２の実施例と第３の実施例を示す表面実
装用電子部品の斜視図と断面図である。Next, FIGS. 3 and 4, FIGS. 5 and 6 are a perspective view and a sectional view, respectively, of an electronic component for surface mounting according to a second embodiment and a third embodiment of the present invention.
【００１６】第２の実施例である図３および図４におい
ては、リード端子２１の断面形状を円形状にし、また第
３の実施例である図５および図６においては、リード端
子３１の断面形状を三角形状にさせてその１頂点をラン
ド７３側に向けることにより、ランド７３の面とリード
端子３１の底面とを平行でなくさせたものである。In FIGS. 3 and 4 which are the second embodiment, the cross section of the lead terminal 21 is circular. In FIGS. 5 and 6 which are the third embodiment, the cross section of the lead terminal 31 is shown. The surface of the land 73 and the bottom surface of the lead terminal 31 are not parallel by making the shape triangular and turning one vertex toward the land 73 side.
【００１７】従って、これらの実施例においても前述し
た図１および図２に示す第１の実施例と同様の作用効果
を有する。Accordingly, these embodiments have the same operation and effects as those of the first embodiment shown in FIGS. 1 and 2 described above.
【００１８】尚、これら第１〜第３の実施例のいずれも
が、リード端子のランドに対向する面が丸あるいは角の
凸状になっているところに特徴がある。Each of the first to third embodiments is characterized in that the surface of the lead terminal facing the land has a round or square convex shape.
【００１９】続いて、図７および図８と図９および図１
０は各各本発明の第４の実施例と第５の実施例を示す表
面実装用電子部品の斜視図と断面図である。Subsequently, FIGS. 7 and 8, FIGS. 9 and 1
Reference numeral 0 denotes a perspective view and a cross-sectional view of a surface-mounting electronic component showing the fourth and fifth embodiments of the present invention.
【００２０】第４の実施例である図７および図８におい
ては、リード端子４１の断面形状を元々は四角形であっ
たものをく形状に抉り取って、ランド７４の面とリード
端子４１の底面とを平行でなくさせたものである。In FIG. 7 and FIG. 8, which are the fourth embodiment, the cross-sectional shape of the lead terminal 41 which was originally square was cut off into a rectangular shape, and the surface of the land 74 and the bottom surface of the lead terminal 41 were removed. Are not parallel.
【００２１】また第５の実施例である図９および図１０
においては、リード端子５１の断面形状を元々は四角形
であったものを半円形状に抉り取って、ランド７５の面
とリード端子５１の底面とを平行でなくさせたものであ
る。FIGS. 9 and 10 showing a fifth embodiment.
In the above, the cross-sectional shape of the lead terminal 51 was originally square, but was cut out into a semicircular shape so that the surface of the land 75 and the bottom surface of the lead terminal 51 were not parallel.
【００２２】この第４の実施例および第５の実施例で
は、そのいずれもがリード端子のランドに対向する面が
丸あるいは角の凹状になっているところに特徴がある。Each of the fourth and fifth embodiments is characterized in that the surface of the lead terminal facing the land is round or concave.
【００２３】尚、これら第４および第５の実施例におい
ても前述した第１〜第３の実施例と同様の作用効果を有
する。The fourth and fifth embodiments have the same operation and effects as those of the first to third embodiments.
【００２４】このように、本発明による表面実装用電子
部品は、リード端子の先端部を部品パッケージから突出
方向を軸にほぼ４５度前後捻り変形させ、あるいはリー
ド端子の断面形状をランドに向けて凸形および凹形の円
形状にしたもの、またはリード端子の断面形状をランド
に向けて凸形および凹形の三角形状にして、これらのい
ずれもがランド面に対してリード端子の底面を平行でな
くさせたところに特徴を有し、これによってランドの幅
をリード端子の幅と同等かもしくは狭くできるので、ハ
ンダによる隣接ランドとのブリッジを大幅に低減でき
る。また、ランドピッチの狭小化およびリード間ピッチ
の狭小化を実現することができるので、電子装置の小型
化に寄与できる。As described above, in the electronic component for surface mounting according to the present invention, the tip of the lead terminal is twisted approximately 45 degrees around the projecting direction from the component package, or the cross-sectional shape of the lead terminal is directed toward the land. The convex and concave circular shapes, or the cross-sectional shape of the lead terminal is made into a convex and concave triangular shape facing the land, each of which is parallel to the bottom surface of the lead terminal with respect to the land surface. However, since the width of the land can be made equal to or smaller than the width of the lead terminal, the bridge between the adjacent lands by solder can be greatly reduced. Further, since the land pitch and the lead pitch can be reduced, it is possible to contribute to the miniaturization of the electronic device.
【００２５】[0025]
【発明の効果】第１の効果は、ランドの幅をリード端子
の幅と同等かもしくは狭くできる。従ってハンダによる
隣接ランドとのブリッジを大幅に低減できる。また、ラ
ンドピッチの狭小化およびリード間ピッチの狭小化を実
現することができ、電子装置の小型化に寄与できる。The first effect is that the width of the land can be made equal to or smaller than the width of the lead terminal. Therefore, bridges between adjacent lands due to solder can be greatly reduced. Further, the land pitch can be reduced and the pitch between leads can be reduced, which can contribute to downsizing of the electronic device.
【００２６】その理由は、ランドの面に対向するリード
の底面が平行でないからである。The reason is that the bottom surface of the lead facing the land surface is not parallel.
【図１】本発明の第１の実施例の表面実装用電子部品を
示す斜視図である。FIG. 1 is a perspective view showing an electronic component for surface mounting according to a first embodiment of the present invention.
【図２】同実施例の表面実装用電子部品のリード端子の
先端部とランドとの接続状態を示す断面図である。FIG. 2 is a cross-sectional view showing a connection state between a tip portion of a lead terminal and a land of the electronic component for surface mounting according to the embodiment.
【図３】本発明の第２の実施例の表面実装用電子部品を
示す斜視図である。FIG. 3 is a perspective view showing an electronic component for surface mounting according to a second embodiment of the present invention.
【図４】同実施例の表面実装用電子部品のリード端子の
先端部とランドとの接続状態を示す断面図である。FIG. 4 is a cross-sectional view showing a connection state between a tip of a lead terminal and a land of the electronic component for surface mounting according to the embodiment.
【図５】本発明の第３の実施例の表面実装用電子部品を
示す斜視図である。FIG. 5 is a perspective view showing an electronic component for surface mounting according to a third embodiment of the present invention.
【図６】同実施例の表面実装用電子部品のリード端子の
先端部とランドとの接続状態を示す断面図である。FIG. 6 is a cross-sectional view showing a connection state between a tip of a lead terminal and a land of the electronic component for surface mounting according to the embodiment.
【図７】本発明の第４の実施例の表面実装用電子部品を
示す斜視図である。FIG. 7 is a perspective view showing an electronic component for surface mounting according to a fourth embodiment of the present invention.
【図８】同実施例の表面実装用電子部品のリードの先端
部とランドとの接続状態を示す断面図である。FIG. 8 is a cross-sectional view illustrating a connection state between a tip of a lead and a land of the electronic component for surface mounting according to the same embodiment.
【図９】本発明の第５の実施例の表面実装用電子部品を
示す斜視図である。FIG. 9 is a perspective view showing an electronic component for surface mounting according to a fifth embodiment of the present invention.
【図１０】同実施例の表面実装用電子部品のリードの先
端部とランドとの接続状態を示す断面図である。FIG. 10 is a cross-sectional view showing a connection state between a tip of a lead and a land of the electronic component for surface mounting according to the same embodiment.
【図１１】従来の表面実装用電子部品を示す斜視図であ
る。FIG. 11 is a perspective view showing a conventional surface mount electronic component.
【図１２】同従来の表面実装用電子部品のリード端子の
先端部とランドとの接続状態を示す断面図である。FIG. 12 is a cross-sectional view showing a connection state between a tip portion of a lead terminal and a land of the conventional surface mounting electronic component.
【図１３】同従来の表面実装用電子部品のランド幅がリ
ード端子幅より狭かった場合のリード端子の先端部とラ
ンドとの接続状態を示す断面図である。FIG. 13 is a cross-sectional view showing a connection state between the tip of the lead terminal and the land when the land width of the conventional surface mount electronic component is smaller than the lead terminal width.
１〜５ 部品パッケージ ７ 電気配線基板 ８ ハンダ １１，２１，３１，４１，５１ リード端子 ７１，７２，７３，７４，７５ ランド 1-5 Component package 7 Electric wiring board 8 Solder 11, 21, 31, 41, 51 Lead terminal 71, 72, 73, 74, 75 Land
Claims (6)
面方向に突出するリードの先端部を電気配線基板上に一
体化して配設されるランドにハンダにより接着固定する
前記表面実装用電子部品において、 前記リードを前記ランドに接着固定する際に、前記リー
ド先端部の前記ランドと対向する底面を前記ランドの面
と平行にならないように形成することを特徴とする表面
実装用電子部品。1. The surface-mounting electronic component, wherein a tip of a lead projecting laterally from a package of the surface-mounting electronic component is bonded and fixed to a land integrally provided on an electric wiring board by soldering. An electronic component for surface mounting, wherein a bottom surface of the tip of the lead facing the land is formed so as not to be parallel to a surface of the land when the lead is bonded and fixed to the land.
先端部が略立方体柱状あるいは略直方体柱状でその断面
形状が略正方形あるいは略長方形であるように形成し、
かつ前記リード先端部を前記パッケージから突出方向の
軸に対して略４５度前後捻り変形させて前記略立方体柱
状あるいは前記略直方体柱状の１頂点角部が前記ランド
面上に略当接するようにして前記ランドに接着固定する
ようにしたことを特徴とする請求項１記載の表面実装用
電子部品。2. The method according to claim 2, wherein the tip of the lead bonded and fixed to the land has a substantially cubic column shape or a substantially rectangular column shape, and has a substantially square or substantially rectangular cross section.
And twisting the tip of the lead approximately 45 degrees with respect to the axis in the protruding direction from the package so that one vertex corner of the substantially cubic column or the substantially rectangular column substantially abuts on the land surface. 2. The electronic component for surface mounting according to claim 1, wherein the electronic component is adhesively fixed to the land.
先端部が略円柱状でその断面形状が略円形状であるよう
に形成し、かつ前記リード先端部をその円柱面が前記ラ
ンド面上に略当接するようにして前記ランドに接着固定
するようにしたことを特徴とする請求項１記載の表面実
装用電子部品。3. The lead tip portion bonded and fixed to the land is formed so as to have a substantially columnar shape and a substantially circular cross-sectional shape, and the lead tip portion has a cylindrical surface on the land surface. 2. The electronic component for surface mounting according to claim 1, wherein the electronic component is bonded to the land so as to be substantially in contact with the land.
先端部が略三角柱状でその断面形状が略三角形であるよ
うに形成し、かつ前記略三角柱状の１頂点角部が前記ラ
ンド面上に略当接するようにして前記ランド上に接着固
定するようにしたことを特徴とする請求項１記載の表面
実装用電子部品。4. A lead tip portion adhered and fixed to the land is formed so as to have a substantially triangular prism shape and a substantially triangular cross-sectional shape, and one vertex corner of the substantially triangular prism shape is formed on the land surface. 2. The electronic component for surface mounting according to claim 1, wherein the electronic component is adhesively fixed on the land so as to be substantially in contact with the land.
先端が略立方体柱状あるいは略直方体柱状でその断面形
状が略正方形あるいは略長方形であるように形成された
リードの柱状方向１端面側をさらに略三角柱状に抉り取
って形成したリードのその抉り取った両端凸部が前記ラ
ンド面上に略当接するようにして前記ランドに接着固定
するようにしたことを特徴とする請求項１記載の表面実
装用電子部品。5. The lead formed in such a manner that the tip of the lead adhered and fixed to the land is substantially a cubic column or a substantially rectangular column, and the cross-sectional shape thereof is substantially square or substantially rectangular. 2. The surface mounting device according to claim 1, wherein the cut-out ends of the lead formed by cutting out the triangular prism are adhered and fixed to the land so that the cut-out end projections substantially contact the land surface. For electronic components.
先端部が略立方体柱状あるいは略直方体柱状でその断面
形状が略正方形あるいは略長方形であるように形成され
たリードの柱状方向１端面側をさらに略半円柱状に抉り
取って形成したリードのその抉り取った両端凸部が前記
ランド面上に略当接するようにして前記ランドに接着固
定するようにしたことを特徴とする請求項１記載の表面
実装用電子部品。6. The one end face in the columnar direction of a lead formed such that the tip end of the lead adhered and fixed to the land is substantially a cubic column or a substantially rectangular column and the cross-sectional shape is substantially a square or a rectangle. 2. The lead according to claim 1, wherein the reed is formed in a substantially semi-cylindrical shape so that the protruded portions at both ends of the reed are substantially in contact with the land surface, and are adhered and fixed to the land. Electronic components for surface mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8285473A JPH10135396A (en) | 1996-10-28 | 1996-10-28 | Surface mounting electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8285473A JPH10135396A (en) | 1996-10-28 | 1996-10-28 | Surface mounting electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10135396A true JPH10135396A (en) | 1998-05-22 |
Family
ID=17691982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8285473A Pending JPH10135396A (en) | 1996-10-28 | 1996-10-28 | Surface mounting electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10135396A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007221043A (en) * | 2006-02-20 | 2007-08-30 | Nihon Almit Co Ltd | Electronic component |
-
1996
- 1996-10-28 JP JP8285473A patent/JPH10135396A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007221043A (en) * | 2006-02-20 | 2007-08-30 | Nihon Almit Co Ltd | Electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19981208 |