JPH096409A - Production line control system - Google Patents
Production line control systemInfo
- Publication number
- JPH096409A JPH096409A JP15575695A JP15575695A JPH096409A JP H096409 A JPH096409 A JP H096409A JP 15575695 A JP15575695 A JP 15575695A JP 15575695 A JP15575695 A JP 15575695A JP H096409 A JPH096409 A JP H096409A
- Authority
- JP
- Japan
- Prior art keywords
- installation
- facility
- equipment
- operator
- automation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 65
- 238000012545 processing Methods 0.000 claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims abstract description 7
- 238000012546 transfer Methods 0.000 claims description 18
- 239000000047 product Substances 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 11
- 238000012384 transportation and delivery Methods 0.000 claims description 8
- 239000011265 semifinished product Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 30
- 230000008569 process Effects 0.000 abstract description 26
- 230000032258 transport Effects 0.000 abstract description 8
- 230000009467 reduction Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract 17
- 230000006872 improvement Effects 0.000 abstract 1
- 238000007689 inspection Methods 0.000 description 22
- 235000012431 wafers Nutrition 0.000 description 17
- 238000007726 management method Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011179 visual inspection Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 230000001953 sensory effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
- 238000013439 planning Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Control By Computers (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- General Factory Administration (AREA)
- Control Of Conveyors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は処理時作業者を必要とす
る設備と自動化対応の設備が混在する生産ラインの自動
化制御システムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automated control system for a production line in which facilities requiring workers during processing and facilities compatible with automation coexist.
【０００２】[0002]
【従来の技術】生産ラインにおける自動化は特開平３−
２４５９５７号公報として示されるように、作業効率向
上による省力化、スループット向上等を目的として製造
設備や搬送に関して積極的に進められてきた。しかし、
生産工程の中には作業者を必要とする工程があり、生産
ラインの自動化を進める上で障害となっている。例え
ば、検査作業には目視検査等の官能検査がある。製品の
処理よりも作業発生頻度は低いが、製品の品質維持する
には検査作業が必要である。また、検査の判定は単に規
格値による管理だけでなく、前回までの検査結果の状況
に基づく判断を要することもある。このように検査作業
に代表されるような技術的にも投資的にも自動化を進め
ることは困難な工程が存在するラインを対象に、自動化
を行う場合、人手作業を要する工程の作業領域と自動化
される設備領域をラインのなかで分離され、人手作業は
自動化の対象外として実現されてきた。2. Description of the Related Art Automation in a production line is disclosed in JP-A-3-
As disclosed in Japanese Laid-Open Patent Publication No. 245957, manufacturing facilities and transportation have been actively promoted for the purpose of labor saving by improving work efficiency and throughput. But,
Some production processes require workers, which is an obstacle to the automation of production lines. For example, inspection work includes sensory inspection such as visual inspection. Although the work frequency is lower than that of product processing, inspection work is required to maintain product quality. Further, the determination of the inspection may require not only the management based on the standard value but also the determination based on the situation of the inspection result up to the previous time. In this way, when automation is performed for a line where there are processes that are difficult to promote in terms of technology and investment as represented by inspection work, the work area and automation of processes that require manual work The equipment area to be used is separated in the line, and manual work has been realized as an object of automation.
【０００３】[0003]
【発明が解決しようとする課題】コンベアラインなどに
代表されるフローショプは搬送機構や制御も簡略であり
自動化が容易である。しかし、前述のように自動化され
てない設備もしくは自動化のレベルの低い設備を用いた
作業が存在する工程を有するジョブショップ生産形態で
は多品種少量生産の製品を取り扱う。こういったライン
では製品の流れも複雑で効率の良い自動化ライン構築が
課題となる。A flow shop typified by a conveyor line has a simple transport mechanism and control, and is easy to automate. However, as described above, in the job shop production mode having a process in which there is a work using equipment that is not automated or equipment with a low level of automation, products of high-mix low-volume production are handled. With such lines, the flow of products is complicated, and the challenge is to build an efficient automated line.
【０００４】また、検査作業等は製造設備の処理状態の
把握や、検査結果の製造設備への処理条件変更による結
果の反映等検査作業のみだけでは終わらないため、検査
に関する本作業に付帯する作業の自動化による効率化も
課題となる。Further, since the inspection work and the like are not completed only by the inspection work such as grasping the processing state of the manufacturing equipment and reflecting the result of the inspection result on the manufacturing equipment by changing the processing condition, the work accompanying the inspection is attached. Another challenge is to improve efficiency through automation.
【０００５】さらに、自動化の低く自動化ラインには組
み込めない設備を自動化の進んだ設備と交換する場合で
も、制御装置の大きな改造を加えることなくフレキシブ
ルにシステム変更可能な自動化ラインを提供する必要が
ある。Further, it is necessary to provide an automated line that can flexibly change the system without major modification of the control device, even when the facility that is low in automation and cannot be installed in the automated line is replaced with a highly automated facility. .
【０００６】[0006]
【課題を解決するための手段】半製品である被処理物を
一時保管する受け払い機構を有する保管手段と、前記被
処理物を処理する製造手段部と、前記処理物を作業者の
操作により処理する処理手段部と、前記被処理物を搬送
する搬送手段部と、作業者と前記搬送機構との前記被処
理物を受け渡しを行う受け渡し手段部と、これら全ての
手段をネットワークで接続されている制御手段部から構
成することによる自動化設備と、自動化されてない設備
もしくは自動化のレベルの低い設備を用いる。[Means for Solving the Problems] Storage means having a receiving and receiving mechanism for temporarily storing a semi-finished product to be processed, a manufacturing means section for processing the product to be processed, and an operator to operate the product to be processed. A processing means section for processing, a carrying means section for carrying the object to be processed, a delivery means section for delivering the object to be processed between an operator and the carrying mechanism, and all these means are connected by a network. Use automated equipment that is configured by the control means part that is present, equipment that is not automated, or equipment that has a low level of automation.
【０００７】[0007]
【作用】作業者の操作等を必要とする設備と自動化対応
可能な設備を一つの領域に集め、保管設備内の被処理物
の工程や処理可能設備や処理条件を上位システムから制
御装置が取得する。この情報に基づき、自動化対応設備
は搬送設備で自動搬送する。非自動化設備へは受け渡し
設備までは搬送設備で搬送し、そこから作業者へ受け渡
し非自動化設備へ着工される。[Function] The equipment that requires operator's operation and the equipment that can be automated are collected in one area, and the control device acquires the process, processable equipment, and processing conditions of the object in the storage equipment from the host system. To do. Based on this information, the automation equipment automatically transports it at the transport facility. The non-automated equipment is transported to the transfer equipment by the transfer equipment, and from there, it is handed over to the workers and the non-automated equipment is started.
【０００８】[0008]
【実施例】図１は一実施例であるライン構成を示す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a line configuration which is an embodiment.
【０００９】１は同種の処理を行う製造設備群をまとめ
たジョブショップ生産形態を有する生産ライン（以下、
ベイと呼ぶ）である。ベイ１はベイ１以外から運びこま
れたり、ベイ１内で処理途中もしくは処理完了した被処
理物を複数個一時保管する受渡し機構を有する保管設備
１０２であり、ベイ内には一つ以上の工程を処理する製
造設備１０４が複数台存在し、保管設備１０２や製造設
備１０４間で被処理物を運ぶ搬送機構１０３と、検査設
備などの作業者を要する人手作業設備１０６と、さらに
作業者と搬送機構との被処理物の受け渡しを行う受け渡
し設備１０５を配置し、さらにこれらとネットワークに
より接続されベイ内に存在する被処理物のトラッキング
や製造設備１０４や搬送機構１０３等の状態管理や動作
指示をリアルタイムで行う制御装置１０１から構成され
る。1 is a production line having a job shop production system in which a group of production facilities for performing the same type of processing is put together (hereinafter, referred to as a production line).
It is called a bay). The bay 1 is a storage facility 102 having a delivery mechanism for temporarily storing a plurality of objects to be processed that have been brought in from other than the bay 1 or are being processed in the bay 1 or have been processed, and one or more processes are provided in the bay. There are a plurality of manufacturing equipments 104 for processing the object, a transfer mechanism 103 for transferring the object to be processed between the storage equipments 102 and the manufacturing equipments 104, a manual work equipment 106 requiring an operator such as an inspection equipment, and a transfer equipment with the operator. A transfer facility 105 for transferring the processed object to and from the mechanism is arranged, and further, tracking of the processed object existing in the bay, which is connected to these by a network, and status management and operation instructions of the manufacturing facility 104, the transport mechanism 103 and the like are performed. It is composed of a control device 101 that operates in real time.
【００１０】また、制御装置１はネットワークにより、
ライン内の被処理物の工程の進捗管理を行う進度管理シ
ステムと、処理を行う工程で処理可能な設備の指示なら
びに設備における製造条件を管理する製造条件システム
１０８と接続されている。ベイ１内で管理される被処理
物の情報をこれらシステムから取得する。Further, the control device 1 uses a network to
It is connected to a progress management system that manages the progress of the process of the object to be processed in the line, and a manufacturing condition system 108 that manages the instructions of the equipment that can be processed in the processing step and the manufacturing conditions in the equipment. Information on the object to be processed managed in the bay 1 is acquired from these systems.
【００１１】半導体ラインを例に以下具体的に説明す
る。半導体ラインではホトリソグラフィやＣＶＤ（化学
蒸着）やエッチングや酸化拡散等、同種の処理を行う製
造設備をベイ単位に集める生産方式採用している。A semiconductor line will be specifically described below as an example. The semiconductor line uses a production system that collects manufacturing equipment that performs the same type of processing such as photolithography, CVD (chemical vapor deposition), etching, and oxidation diffusion in bay units.
【００１２】ホトリソグラフィの処理を行うベイを例に
とり更に説明する。半導体前工程生産ラインではキャリ
アカセットに被処理物である薄膜形成されたシリコンウ
ェハ複数枚収納され、一つの搬送単位（以下これをロッ
トと呼ぶ）を形成している。回路パターンを形成するた
めに製造設備で塗布、感光、現像の処理を行なわれる製
造設備がある。感光設備には回路パターンのもとになる
レチクルが複数枚収納することが可能であり、異なる品
種、工程を一つの設備で処理可能である。そして、処理
完了後は回路パターンの焼き付けが規格通りに処理され
ているか確認するため、パターン線幅の寸法検査、パタ
ーンと下地の膜とのズレが許容値内であることを確認す
る検査と、欠陥等を検査する外観検査等がある。特に外
観検査は金属顕微鏡によりウェハ表面の欠陥を作業者が
目視により確認するため、検査設備の自動化や、また自
動化ラインへ検査作業の取り込みが非常に困難である。Further description will be given by taking a bay in which photolithography processing is performed as an example. In a semiconductor pre-process production line, a carrier cassette stores a plurality of thin film-formed silicon wafers, which are objects to be processed, to form one transfer unit (hereinafter referred to as a lot). There is a manufacturing facility in which coating, photosensitization, and development processes are performed in the manufacturing facility to form a circuit pattern. It is possible to store a plurality of reticles that are the basis of the circuit pattern in the photosensitive equipment, and different equipment and processes can be processed by one equipment. Then, after the processing is completed, in order to confirm whether the circuit pattern is printed according to the standard, a dimension inspection of the pattern line width, an inspection to confirm that the deviation between the pattern and the underlying film is within the allowable value, There is a visual inspection to inspect for defects and the like. Particularly in the visual inspection, the operator visually confirms defects on the wafer surface with a metallurgical microscope, so it is very difficult to automate the inspection equipment and incorporate the inspection work into the automation line.
【００１３】そこで、図２に示すように、本発明の制御
システムによれば、ホトリソグラフィベイにおける自動
化と作業者を必要とする作業が共存するようなライン構
成が実現可能となる。Therefore, as shown in FIG. 2, according to the control system of the present invention, it is possible to realize a line configuration in which automation in the photolithography bay and work requiring an operator coexist.
【００１４】図１、図２に基づいて本発明の制御システ
ムについて以下説明をする。The control system of the present invention will be described below with reference to FIGS. 1 and 2.
【００１５】図２にフォトリソグラフィベイの構成を示
す。ベイの中には自動化された製造設備１０４が配置さ
れ、搬送設備１０３によりロットが搬送される。自動化
されてない設備１０６は自動化された設備１０４とは別
のエリアに設備され、受け渡し装置１０５を介して搬送
設備１０３とのロットの授受を行う。通常、搬送装置に
はマニピュレータ付きの無人搬送車（ＡＧＶ）が用いら
れ、人手作業を要する自動化されていない設備１０６で
の作業が搬送車の走行もしくはウェハキャリアをハンド
リング領域にあると、作業中の安全確保が困難となる
が、今発明のようにエリアを分けることにより、作業者
と搬送設備が物理的に分離され、安全な作業環境を実現
できる。FIG. 2 shows the structure of the photolithography bay. An automated manufacturing facility 104 is arranged in the bay, and the lot is transported by the transport facility 103. The non-automated facility 106 is provided in an area different from the automated facility 104, and exchanges lots with the transfer facility 103 via the transfer device 105. Normally, an unmanned guided vehicle (AGV) with a manipulator is used as the carrier, and if the work in the non-automated facility 106 that requires manual work is in the traveling area of the carrier or the wafer carrier handling area, It is difficult to ensure safety, but by dividing the area as in the present invention, the worker and the transportation facility are physically separated, and a safe working environment can be realized.
【００１６】ベイ１以外のベイからロットを自動搬送設
備もしくは作業者により保管設備１０２に搬入される。
搬入時にはロットのロットＩＤを保管設備１０２が自動
認識し、制御装置１０１にネットワーク経由で報告す
る。制御装置１０１はロットＩＤをキーにして、進度管
理システム１０７から、ロットに関する品種コードや現
在の仕掛り工程コードやベイ１内で処理されるべきいく
つかの工程コードを取得する（図３参照）。さらに、製
造条件システムからは進度管理システム１０７から取得
したベイ内で処理すべき工程に対応した、処理可能ない
くつかの製造設備コードとその製造条件を取得する。From a bay other than the bay 1, lots are loaded into the storage facility 102 by an automatic transport facility or an operator.
At the time of delivery, the storage facility 102 automatically recognizes the lot ID of the lot and reports it to the control device 101 via the network. The control device 101 uses the lot ID as a key to acquire from the progress management system 107 the product type code relating to the lot, the current work-in-progress process code, and some process codes to be processed in the bay 1 (see FIG. 3). . Further, from the manufacturing condition system, several processable manufacturing facility codes corresponding to the process to be processed in the bay acquired from the progress management system 107 and their manufacturing conditions are acquired.
【００１７】制御装置１０１はこの情報とネットワーク
経由で取得したベイ内の設備の状態情報や、保管設備１
０２内のロットと状態や、製造設備１０４に仕掛ってい
るロットの状態から、ベイ内における生産スケジュール
を算出するか、あるいはライン作業者が計画した生産計
画に基づいて保管設備１０２内にあるロット順次処理し
ていく。The control unit 101 uses this information and the state information of the equipment in the bay acquired via the network and the storage equipment 1
The production schedule in the bay is calculated from the lot and the state in 02 or the state of the lot in the manufacturing facility 104, or the lot in the storage facility 102 is based on the production plan planned by the line operator. It processes sequentially.
【００１８】その計画に基づいて、ある工程１のロット
を処理することが決定した時、工程１が処理可能な製造
設備１０４ａ〜１０４ｃのうち設備が製品待ちの状態ま
たは処理中ではあるが最も早く着工できる製造設備１０
４ａを選択する。そして、搬送設備１０３に対して保管
設備１０２から製造設備１０４ａにロットの搬送指示を
出し、自動搬送させる。ロットが製造設備１０４ａに投
入されたとき、制御装置１０１は製造設備１０４ａに対
して製造条件システム１０８から取得した製造条件をネ
ットワークを介してオンラインで指示する。Based on the plan, when it is decided to process a lot of a certain process 1, one of the manufacturing facilities 104a to 104c capable of processing the process 1 is in the state of waiting for a product or in the process but is the earliest. Manufacturing equipment 10 that can start construction
Select 4a. Then, the storage facility 102 issues a lot transport instruction to the production facility 104a to the transport facility 103, and the lot is automatically transported. When the lot is put into the manufacturing equipment 104a, the control device 101 instructs the manufacturing equipment 104a on-line via the network the manufacturing conditions acquired from the manufacturing condition system 108.
【００１９】製造装置１０４ａで処理が終了したら処理
の実績データを製造設備１０４ａから制御装置１０１に
オンラインで報告し、さらには進度管理システム１０７
にも報告し、制御装置１０１と進度管理システム１０４
のロットのトラッキング情報を更新する。そして、次の
工程２へと仕掛りが移行する。When the manufacturing apparatus 104a completes the processing, the actual processing data is reported online from the manufacturing equipment 104a to the control apparatus 101, and the progress management system 107 is also used.
Also reported to the controller 101 and the progress management system 104.
Update lot tracking information. Then, the work-in-process shifts to the next step 2.
【００２０】そして、図３のように仮に工程２が検査等
の作業者による作業である場合について、以下説明す
る。Then, a case where the step 2 is a work by an operator such as an inspection as shown in FIG. 3 will be described below.
【００２１】自動化された製造設備であれば、製造条件
システム１０８から取得する設備コードを用いて、搬送
設備１０３に搬送指示を出せばよい。しかし、ウェハ表
面の外観検査を行う金属顕微鏡等の完全に作業者の操作
を必要とするものや、ネットワークによる通信が可能で
あり一部の自動化が行われるが搬送設備１０３との受け
渡しが行えない設備等の場合にはこれら設備群を作業者
領域１０９に集める。搬送設備１０３と作業者１１０と
のロットの受け渡しは受け渡し設備１０５を介して行
う。この時、作業者領域１０９内の設備の設備コードは
受け渡し設備１０５の設備コードを製造条件システム１
０８に登録する。これにより、制御装置１０１は搬送設
備１０３に対して受け渡し設備１０５への搬送指示を出
すことが可能となる。In the case of an automated manufacturing facility, a transportation instruction may be issued to the transportation facility 103 using the facility code acquired from the manufacturing condition system 108. However, those requiring a complete operator's operation such as a metal microscope for visual inspection of the surface of the wafer, and communication through a network that allows some automation but cannot be transferred to the transfer facility 103. In the case of equipment and the like, these equipment groups are collected in the worker area 109. Lots are transferred between the transfer facility 103 and the worker 110 via the transfer facility 105. At this time, the equipment code of the equipment in the worker area 109 is the equipment code of the delivery equipment 105.
Register at 08. As a result, the control device 101 can issue a transfer instruction to the transfer facility 105 to the transfer facility 103.
【００２２】また、作業者領域１０９にある設備１０６
ａが、自動化対応設備となり変更された場合でも、製造
条件システム１０８の設備コードを受け渡し設備１０５
から設備１０６ａに変更するだけで制御装置１０１には
何等ソフトを変更をせずにすむフレキシブルな自動化ラ
インが実現できる。In addition, the equipment 106 in the worker area 109
Even if “a” is changed to automation-compatible equipment, the equipment code of the manufacturing condition system 108 is transferred to the equipment 105.
It is possible to realize a flexible automation line that does not need to change any software in the control device 101 simply by changing from the equipment to the equipment 106a.
【００２３】次に、ホトリソグラフィベイにおける作業
を具体的に、自動化されていない設備を用いての作業を
説明する。Next, the work in the photolithography bay will be concretely described by using the non-automated equipment.
【００２４】フォトリソグラフィ工程では塗布装置によ
りウェハ表面に一様な感光性の薄い膜（フォトレジス
ト）を塗布形成し、露光装置により、レーザ光を回路パ
ターンを描画したレチクルを通してウェハ上の感光膜に
照射する。このとき、レチクル上のパターンに対応した
部分はウェハ上では影となり、レーザ光が照射されない
ため感光膜は化学変化を起こさないが、他の部分は化学
変化を起こす。さらに現像装置により化学変化を起こし
た部分の感光膜を溶解、除去することにより、回路パタ
ーンをウェハ上に形成する。In the photolithography process, a uniform thin photosensitive film (photoresist) is applied and formed on the surface of the wafer by a coating device, and an exposure device causes laser light to pass through a reticle on which a circuit pattern has been drawn to the photosensitive film on the wafer. Irradiate. At this time, the portion corresponding to the pattern on the reticle becomes a shadow on the wafer and is not irradiated with the laser beam, so that the photosensitive film does not chemically change, but other portions chemically change. Further, the developing device dissolves and removes the photosensitive film in the portion where the chemical change has occurred, thereby forming a circuit pattern on the wafer.
【００２５】回路パターンは例えば１６メガビットＤＲ
ＡＭではパターンの幅が最小０．５μｍ程度と非常に微
細なため、レーザ光照射時に、フォトリソグラフィ工程
の前に形成されたパターンとのずれや、焦点ぼけによる
線幅の広がり、またフォトレジストの厚みや感光特性の
ばらつき等に起因する感光不足などが発生する場合があ
り、製品の特性劣化、歩留まりの低下を招く一因とな
る。これを防止するため、通常、以下に述べる先行作業
と呼ばれる一連の作業を行い、ロットの処理を行う。The circuit pattern is, for example, 16 megabit DR
In AM, the pattern width is very small, about 0.5 μm, so when laser light is irradiated, the line width is widened due to the deviation from the pattern formed before the photolithography process, the defocus, and the photoresist. Insufficient photosensitivity may occur due to variations in thickness and photosensitivity, which is one of the causes of deterioration of product characteristics and reduction of yield. In order to prevent this, a series of work called a preceding work described below is usually performed to process the lot.
【００２６】処理するロットの全ウェハを処理する前
に、ロットの第１枚目のウェハのみパターンの形成を行
い、パターンの線幅や下地膜とのずれ等を走査型電子顕
微鏡や金属顕微鏡で測定を行う。正常に処理されている
ことが確認できればロット内の残りの全ウェハを処理す
るが、もしずれが生じている場合にはウェハ位置（オフ
セット値）や露光時間の微調整を行う。そして、線幅や
ずれが規格値内に収まるまで２枚目、３枚目のウェハを
処理し、収まった時点で全ウェハを処理する。また、フ
ォトレジストの塗布ムラや処理中に付着した異物等に起
因する欠陥等を全ウェハ処理後、抜き取りにより、金属
顕微鏡で行う。走査型電子顕微鏡や金属顕微鏡を用いて
の検査は官能検査の性格が強く、現在の技術では自動化
が困難であり、人手による作業となる。Before processing all the wafers of the lot to be processed, a pattern is formed only on the first wafer of the lot, and the line width of the pattern and the deviation from the underlying film are checked by a scanning electron microscope or a metallographic microscope. Take a measurement. If it is confirmed that the wafers are normally processed, all the remaining wafers in the lot are processed, but if a deviation occurs, the wafer position (offset value) and the exposure time are finely adjusted. Then, the second and third wafers are processed until the line width and the deviation are within the standard value, and when the line width and the deviation are within the standard value, all the wafers are processed. In addition, defects such as uneven coating of photoresist and defects caused by foreign substances attached during processing are extracted by a metallurgical microscope after all wafers are processed. Inspection using a scanning electron microscope or a metallurgical microscope has a strong sense of sensory inspection, and it is difficult to automate with the current technology, and it is a manual operation.
【００２７】さて、受け渡し設備１０５に設備状態表示
装置や作業者入力装置を設置する。制御装置１０１で管
理するベイ１内の設備状態情報を設備状態表示装置に表
示することにより作業者に対し自動化ラインの設備状態
を、設備まで作業者が行かなくても把握可能となる。例
えば、前述した先行作業で、寸法を検査した結果を判定
する上で、製造設備の露光時間やオフセット値は製造設
備からネットワークを経由して、設備状態表示装置で確
認することができる。そして、検査結果設備の露光時間
やオフセット値を受け渡し設備１０５に設置した入力装
置から入力し、リモートコマンドで該当する製造設備の
処理条件のデータ変更を行う。また検査結果も入力装置
から行うことにより、オフラインの設備でも、入力装置
から制御装置１０１を介して上位のシステムに転送する
ことができ、受け渡し設備ですべての作業を行う事が出
来、作業効率が大幅に向上する。また、工場ラインのペ
ーパレス化へと貢献することが出来、さらに、作業ミス
等の低減効果もある。A facility status display device and a worker input device are installed in the delivery facility 105. By displaying the equipment state information in the bay 1 managed by the control device 101 on the equipment state display device, it becomes possible for a worker to grasp the equipment state of the automation line without the worker having to go to the equipment. For example, in determining the result of inspecting the dimensions in the preceding work described above, the exposure time and the offset value of the manufacturing equipment can be confirmed by the equipment status display device from the manufacturing equipment via the network. Then, the exposure time and the offset value of the inspection result equipment are transferred and input from the input device installed in the equipment 105, and the data of the processing condition of the corresponding manufacturing equipment is changed by the remote command. Further, by performing the inspection result from the input device, it is possible to transfer the input device from the input device to the higher-level system through the control device 101 even in an off-line facility, and all the work can be performed at the delivery facility, which improves work efficiency. Greatly improved. In addition, it is possible to contribute to the paperless production of the factory line, and further there is an effect of reducing work mistakes.
【００２８】また同様な作業は例えば、ウェハ上に酸化
膜を形成する酸化工程での酸化膜の膜厚測定や、金属膜
を形成するスパッタリング工程での反射率測定等、半導
体の多くの製造工程に存在し、本実施例の方法が適用可
能である。Further, similar operations include, for example, many semiconductor manufacturing processes such as measurement of oxide film thickness in an oxidation process for forming an oxide film on a wafer and reflectance measurement in a sputtering process for forming a metal film. The method of this embodiment is applicable.
【００２９】このように自動化ラインに関する作業を受
け払い設備１０５に集約することができ、また検査作業
に付帯する作業の削減が図れ省人化につながる。As described above, the work related to the automation line can be collected and collected in the equipment 105, and the work incidental to the inspection work can be reduced, leading to labor saving.
【００３０】受け渡し設備１０５から、作業者による検
査作業等行われる作業エリア内の被処理物仕掛情報をホ
ストにネットワーク経由で上げている。そのため、ベイ
１内での着工スケジュールを制御装置で計画する上で、
作業者領域１０９の作業者から指示を受けるか、あるい
はあらかじめ設定された最大仕掛り設定値に達する、も
しくはそれが予測された場合はあらたに作業者領域１０
９にロットを搬送設備１０３で搬送しないような他の工
程を優先的に処理するよう、スケジューリング変更を行
うことも可能となる。From the transfer facility 105, information on the work in process in the work area where the worker performs inspection work and the like is sent to the host via the network. Therefore, when planning the construction schedule in bay 1 with the control device,
When the operator in the worker area 109 receives an instruction, or when the preset maximum in-process set value is reached or predicted, the worker area 10 is newly set.
It is also possible to change the scheduling so as to preferentially process other processes in which the lot is not transported by the transport facility 103.
【００３１】例えば、ベイ１に複数の工程フローで処理
されるロットが存在している場合、作業者領域１１０の
仕掛り最大値に達した場合、作業者領域１１０を通らな
い工程フローを優先的に処理されるように生産スケジュ
ールを変更する。これにより、作業者領域１１０の処理
がネックになりスループットの低減を防ぐことが可能と
なる。For example, when there are lots processed in a plurality of process flows in the bay 1, and when the in-process maximum value of the worker area 110 is reached, the process flow that does not pass through the worker area 110 is given priority. Change the production schedule to be processed in. As a result, the processing of the worker area 110 becomes a bottleneck, and it is possible to prevent a reduction in throughput.
【００３２】[0032]
【発明の効果】本発明は作業者の操作等を必要とする設
備と自動化対応可能な設備を一つの領域に集め、制御シ
ステムで管理することにより生産効率の向上や作業者の
付帯作業の低減による省人化が可能となるフレキシブル
に富んだラインを実現することができる。Industrial Applicability According to the present invention, the equipment which requires the operation of the operator and the equipment which can be automated are collected in one area, and are managed by the control system to improve the production efficiency and reduce the incidental work of the operator. It is possible to realize a flexible line that enables labor saving by using.
【図１】本発明の一実施例であるシステムのブロック
図。FIG. 1 is a block diagram of a system that is an embodiment of the present invention.
【図２】本発明の一実施例である生産ラインのブロック
図。FIG. 2 is a block diagram of a production line that is an embodiment of the present invention.
【図３】本発明の一実施例である制御システムが進度管
理システムや製造条件システムから取得するベイ内情報
ファイル構成の説明図。FIG. 3 is an explanatory diagram of an in-bay information file configuration acquired by the control system according to the embodiment of the present invention from the progress management system and the manufacturing condition system.
【図４】非自動化設備を自動化対応の設備と交換した場
合の、製造条件システムの設備コードテーブルの変更部
の説明図。FIG. 4 is an explanatory diagram of a change part of the equipment code table of the manufacturing condition system when the non-automation equipment is replaced with equipment for automation.
１…ベイ、 １０１…制御装置、 １０２…保管設備、 １０３…搬送設備、 １０４…製造設備、 １０５…受け渡し設備、 １０６、１０７…進度管理システム、 １０８…製造条件システム、 １０９…作業者領域、 １１０…作業者。 DESCRIPTION OF SYMBOLS 1 ... Bay, 101 ... Control device, 102 ... Storage equipment, 103 ... Conveyance equipment, 104 ... Manufacturing equipment, 105 ... Delivery equipment, 106, 107 ... Progress management system, 108 ... Manufacturing condition system, 109 ... Worker area, 110 …worker.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 増井 知幸 東京都小平市上水本町五丁目20番１号株式 会社日立製作所半導体事業部内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomoyuki Masui 5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock company Hitachi Ltd. Semiconductor Division
Claims (4)
払い機構を有する保管設備と、前記被処理物を自動的に
処理する製造設備と、前記処理物を作業者の操作により
処理する設備と、前記被処理物の搬送設備と、作業者と
前記搬送設備との前記被処理物を受け渡しを行う受け渡
し設備と、 これら全ての設備とネットワークで接続されている制御
装置からなることを特徴とする生産ライン制御システ
ム。1. A storage facility having a receiving and receiving mechanism for temporarily storing a semi-finished product, a manufacturing facility for automatically processing the product, and a processing device for processing the product. A facility, a facility for transporting the object to be processed, a facility for delivering and receiving the object to be treated between a worker and the facility for transportation, and a control device connected to all these facilities via a network. And production line control system.
記製造設備の処理状況や設備の処理条件パラメータを変
更する機能を具備する生産ライン制御システム。2. The production line control system according to claim 1, further comprising a function of changing a processing condition of the manufacturing equipment and a processing condition parameter of the equipment.
処理する製造設備と、前記処理物を作業者の操作により
処理する設備とが別エリアに配置された生産ライン制御
システム。3. A production line control system in which the manufacturing facility for automatically treating the object to be treated according to claim 1 and the facility for treating the object to be treated by an operator are arranged in different areas.
け渡し設備への搬入量から搬出量の差を管理し、ある一
定量を越えた場合、前記搬送設備への搬送を押さえる機
能を具備する生産制御システム。4. A function of managing the difference between the carry-in amount and the carry-out amount from the transfer facility to the delivery facility according to claim 1, and suppressing the transfer to the transport facility when a certain amount is exceeded. Production control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15575695A JPH096409A (en) | 1995-06-22 | 1995-06-22 | Production line control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15575695A JPH096409A (en) | 1995-06-22 | 1995-06-22 | Production line control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH096409A true JPH096409A (en) | 1997-01-10 |
Family
ID=15612733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15575695A Pending JPH096409A (en) | 1995-06-22 | 1995-06-22 | Production line control system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH096409A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010073959A (en) * | 2008-09-19 | 2010-04-02 | Toshiba Corp | Manufacturing management apparatus and method thereof, and manufacturing management program |
| WO2010095414A1 (en) * | 2009-02-19 | 2010-08-26 | 本田技研工業株式会社 | Production line |
| CN104401678A (en) * | 2014-09-22 | 2015-03-11 | 南车青岛四方机车车辆股份有限公司 | Full-automatic intelligent workpiece conveying method |
-
1995
- 1995-06-22 JP JP15575695A patent/JPH096409A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010073959A (en) * | 2008-09-19 | 2010-04-02 | Toshiba Corp | Manufacturing management apparatus and method thereof, and manufacturing management program |
| WO2010095414A1 (en) * | 2009-02-19 | 2010-08-26 | 本田技研工業株式会社 | Production line |
| JP2010191753A (en) * | 2009-02-19 | 2010-09-02 | Honda Motor Co Ltd | Production line |
| CN104401678A (en) * | 2014-09-22 | 2015-03-11 | 南车青岛四方机车车辆股份有限公司 | Full-automatic intelligent workpiece conveying method |
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